43 results about "PMUT" patented technology

The invention discloses a multifunctional neural electrode for intracranial pressure detection and closed-loop nerve regulation, the multifunctional electrode sequentially comprises a PMUT electrode for intracranial pressure detection and nerve regulation and a macro-micro electrode for electroencephalogram signal detection from top to bottom, and the PMUT electrode is bonded on the macro-micro electrode. The PMUT electrode is bonded to the macro-micro electrode to serve as a multifunctional electrode, the PMUT electrode can serve as a pressure sensor and can also serve as an ultrasonic transducer, the dual functions of intracranial pressure detection and fixed-point ultrasonic nerve stimulation are achieved, the macro-micro electrode can achieve detection of local field potential and peak potential, and the ultrasonic nerve stimulation function is achieved. Therefore, a detection-feedback-regulation closed-loop system is realized.

Disclosed herein are ultrasonic transducer systems comprising: an ultrasonic imager comprising a plurality of pMUT transducer elements; and one or more circuitries connected electronically to the plurality of transducer element, the one or more circuitries configured to enable: pulse transmission and reception of reflected signal for the ultrasonic transducer; and control of the ultrasonic transducer, the control of the ultrasonic transducer comprising focusing ultrasonic beam in an elevation direction.

The application discloses an ultrasonic indoor three-dimensional positioning system and method. The ultrasonic indoor three-dimensional positioning system comprises a central control module, a transmitting module and a receiving module. The central control module comprises a central control unit, a sound velocity correction module and a wireless communication module. The transmitting module comprises a transmitting control unit, an ultrasonic transmitting module and a wireless communication module. The receiving module comprises a receiving processing unit, a wireless communication module and an ultrasonic receiving module. The ultrasonic transmitting module adopts a PMUT with a directivity of 180 DEG, comprises area positioning ultrasonic transducers composed of one or more low-frequency ultrasonic transducers with different frequencies, and position positioning ultrasonic transducers composed of more than three high-frequency ultrasonic transducers with different frequencies. The ultrasonic receiving module adopts a wideband microphone. The ultrasonic indoor three-dimensional positioning system can realize accurate three-dimensional positioning in a large range, and the positioning precision reaches millimeter level.

An ultrasound catheter is disclosed. An ultrasound catheter includes a body having a longitudinal axis and a distal end. An array of piezoelectric micromachined ultrasound transducers (pMUTs) is disposed within the distal end of the body. Further, the pMUT array includes a plurality of pMUT array elements arranged on the substrate. Further, an insulating material is disposed at the distal end above the imaging window to provide electrical isolation and transmission of the ultrasound signals. The insulating material corresponds to a polyether block amide (PEBA) or Pebax, or a thermoplastic elastomer (TPE).

This invention discloses a GaN PMUT device with a low-stress structure featuring isolation trenches and its fabrication method. At the device level, the invention utilizes high-purity GaN single crystals as the piezoelectric layer to achieve higher ultrasonic transduction efficiency. By severing the continuity of the film in the planar direction through isolation trenches penetrating multiple composite films and part of the substrate, a channel and space for releasing accumulated residual stress are provided, effectively reducing the concentration of local residual stress and overcoming array crosstalk problems. At the fabrication method level, this invention determines the design parameters of the GaN PMUT device through finite element simulation. Electrochemical wet etching reduces damage to the epitaxial structure during the stripping process, improving the surface smoothness and uniformity of the device after stripping. Simultaneously, the isolation trenches effectively reduce crosstalk between PMUT units, decrease film stress, and significantly increase the piezoelectric driving bending moment within the film, thereby improving ultrasonic transmission and reception performance.

Embodiments of the present application disclose an ultrasonic transducing assembly and an ultrasonic transducing array, which can improve the working bandwidth of the ultrasonic transducing assembly. The ultrasonic transducing assembly comprises a substrate, at least one first PMUT unit and at least one second PMUT unit, and the first PMUT unit and the second PMUT unit are located on the substrate. The cross-sectional shape of the first PMUT unit has a long axis and a short axis, and the cross-sectional shape of the second PMUT unit has a long axis and a short axis, and the cross sections are parallel to the substrate. The size of the first PMUT unit is different from the size of the second PMUT unit. The difference between the frequency corresponding to the wave peak position on the sensitivity curve of the first PMUT unit and the frequency corresponding to the wave trough position on the sensitivity curve of the second PMUT unit is less than a preset value, and / or the difference between the frequency corresponding to the wave trough position on the sensitivity curve of the first PMUT unit and the frequency corresponding to the wave peak position on the sensitivity curve of the second PMUT unit is less than a preset value.

An ultrasound imaging and backscatter system includes an ICE ultrasound catheter having an ultrasound pMUT transducer array disposed within a distal end of the ultrasound catheter and including a plurality of transducer array elements disposed on a substrate. One end of the catheter shaft is connected to the handle assembly and the other end is connected to the ultrasonic transducer array. The catheter shaft accommodates an electronic flexible cable in communication with the signal trace and directs each of the plurality of transducer array elements to transmit and receive an ultrasound beam, receives at least one signal from the plurality of transducer array elements, and constructs at least one image characterizing one or more tissue components of the scanned object. An ultrasound imaging system is used to measure tissue thickness, tissue scar, and lesion assessment for left atrium, right atrium, left ventricle, and right ventricle tissue wall characteristics and other intracardiac tissue anomalies.

The invention discloses a lead-free piezoelectric micromechanical ultrasonic transducer array and electronic equipment, and relates to the technical field of micro electro mechanical systems, the lead-free piezoelectric micromechanical ultrasonic transducer array comprises a plurality of super pixels, and each super pixel is composed of a plurality of piezoelectric micromechanical ultrasonic transducer PMUT units; the PMUT unit comprises a bottom electrode, a lead-free piezoelectric layer and a top electrode which are stacked in sequence; wherein the array layout of the super pixels and the structural parameters of the PMUT units are collaboratively optimized, so that the transducer array has the characteristics of high emission pressure and wide bandwidth when working in a target medium through the acoustic coupling effect between the units. By arranging the lead-free piezoelectric layer and combining with collaborative optimization of super pixel layout and PMUT unit structure parameters, the emission performance and the bandwidth of the lead-free material-based transducer are improved. Through collaborative optimization of the array layout of the super pixels and the structural parameters of the PMUT units, the array is finally enabled to have the characteristics of high emission pressure and wide bandwidth in a target medium by using the acoustic coupling effect between the units.

To achieve low power consumption and a high dynamic range in TGC.SOLUTION: The transceiver includes a plurality of PMUT cells 31 to 33 provided on CMOS circuit 50, and CMOS circuit 50. The CMOS circuit 50 includes transmission pulsers 611 to 616641 and to 646, series connection switches 621 to 626, and GND switches 631 to 633. Transmission pulsers 611 to 616641 and to 646 switch and apply a high voltage and a low voltage to both sides of the upper electrode and the lower electrode of PMUT cells 31 to 33 at the time of transmission of an ultrasound wave. During reception of ultrasound, series connection switch 621 to GND switch 633 connect an arbitrary number of PMUT cells 31 to 33 in series between wave reception section 70 and a GND potential. Wave reception section 70 processes a reception signal of the connected PMUT cell.SELECTED DRAWING: Figure 3

The present application relates to the technical field of semiconductor process, and especially relates to a piezoelectric ultrasonic transducer and a preparation method thereof, which comprises a substrate, a piezoelectric layer formed on the front surface of the substrate, a back cavity formed by penetrating the substrate, a structure layer formed on the surface of the piezoelectric layer, the thickness of the structure layer being greater than the thickness of the piezoelectric film in the piezoelectric layer, and an anti-leakage sound layer arranged on the surface of the structure layer; a through groove is formed along the edge of the diaphragm, so that the diaphragm forms an external structure outside the diaphragm area and an internal structure in the diaphragm area, and the external structure and the internal structure are connected through a cantilever beam formed in the through groove. The preparation method comprises the following steps: preparing the substrate; growing the piezoelectric layer; etching the piezoelectric layer; growing the structure layer; etching the structure layer; and etching the substrate to form the back cavity. The present application uses silicon oxide as the structure layer, which can effectively reduce the resonant frequency; the cantilever beam can convert the PMUT from the Gaussian mode to the piston-like mode to improve the sensitivity, and can also provide good support.

The invention relates to the technical field of health care, in particular to a pressure injury monitoring method, device and system based on multiple sensors. The system comprises an intelligent mattress and an upper computer server, the intelligent mattress comprises a sensing layer, and the sensing layer comprises a multimode sensor array, a microprocessor unit, a data bus and a wireless transmission module; the multimode sensor array is composed of a plurality of sensor units; the sensor unit is integrated with a plurality of sensors and piezoelectric micromechanical ultrasonic transducer array elements; the sensing layer further comprises a flexible wire and a lock catch. According to the intelligent mattress, monitoring-physical therapy integration based on the PMUT array is achieved, the problems that an existing intelligent mattress is subjected to monitoring surface layer, physical therapy is not targeted, body type adaptability is poor, function expansion is limited and the like are solved, precise health monitoring and targeted physical therapy of people with different body types are achieved, and an innovative and efficient integrated solution is provided for the field of health care and healthy home furnishing.

The invention discloses a multi-finger gesture recognition method and system based on frequency modulation continuous waves and an ultrasonic transducer, and belongs to the technical field of man-machine interaction. According to the method, gesture reflection echo signals are collected through a pMUT array, and a dual-channel time-distance Doppler sequence feature map and a time-dual-channel phase difference sequence feature map are obtained through processing such as noise suppression, feature extraction and feature enhancement; and inputting the fused three-channel feature map sequence into a double-flow collaborative attention mechanism-three-dimensional convolutional neural network-long and short-term memory network neural network model to realize multi-finger micro-gesture classification and recognition, and realizing full-process automation based on threshold triggering. On the basis, the invention further provides a pMUT multi-finger micro gesture recognition system. The method has the advantages of being low in operation power consumption, high in environment adaptability, high in resolution precision and the like, and is suitable for the fields of virtual reality, vehicle-mounted control, mechanical arm control and the like.

The invention relates to an annular groove type piezoelectric micromechanical ultrasonic transducer and a preparation method thereof, the annular groove type piezoelectric micromechanical ultrasonic transducer comprises a cavity SOI substrate, the cavity SOI substrate comprises bottom layer silicon, a silicon dioxide insulating layer and top layer silicon, the silicon dioxide insulating layer and the top layer silicon are sequentially formed on the bottom layer silicon, and a cavity is formed in the middle of the bottom layer silicon; a bottom electrode, a piezoelectric layer and a top electrode are sequentially formed on the top layer silicon; the ultrasonic transducer further comprises a plurality of annular grooves arranged at intervals, the annular grooves penetrate through the silicon dioxide insulating layer from the piezoelectric layer, and an annular structure concentric with the center of the top electrode is defined by the heads and the tails of the annular grooves. The effective quality and rigidity of the diaphragm are changed by introducing the annular groove, and the residual stress of the diaphragm in the preparation process is released at the same time, so that the vibration mode of the diaphragm is improved, the effective vibration area and vibration displacement of the diaphragm are improved, and a PMUT device has higher sensitivity and emission sound pressure.

The present application relates to a kind of PMUT single channel structure, ultrasonic sensing channel unit, flexible modular ultrasonic sensor array, photoacoustic imaging system and sensor, belong to photoacoustic imaging and ultrasonic sensor field, at least one of the problems such as the volume of existing photoacoustic imaging ultrasonic sensor is large, frequency response consistency is poor, bandwidth is limited and flexibility is poor is solved.A kind of PMUT single channel structure, comprising: multiple column PMUT unit groups, each column PMUT unit group contains at least two PMUT units arranged along column direction;In the multiple column PMUT unit groups, at least two column PMUT unit groups contained PMUT unit has different cavity size.The present application realizes the efficient reception of wide spectrum photoacoustic signal, improves the imaging axial resolution, so as to obtain the reconstruction effect of higher resolution and more abundant imaging information.

A subcutaneous continuous blood pressure monitor system based on piezoelectric micromachined ultrasonic transducers (PMUTs) provides remote, silent and continuous monitoring solutions for the BP management.

The present application relates to a kind of micromechanical ultrasonic transducer structures and its manufacturing method, the micromechanical ultrasonic transducer structure includes PMUT unit, including PMUT bearing layer and the first PMUT and second PMUT of PMUT bearing layer, each PMUT includes first electrode layer, second electrode layer and piezoelectric layer, wherein: the piezoelectric coefficient of the piezoelectric layer of first PMUT is higher than the piezoelectric coefficient of the piezoelectric layer of second PMUT, and the dielectric constant of the piezoelectric layer of first PMUT is lower than the dielectric constant of the piezoelectric layer of second PMUT.Further, first PMUT and second PMUT are respectively arranged on the two sides of PMUT bearing layer.The present application also relates to an electronic device comprising the above-mentioned micromechanical ultrasonic transducer structure.

A resonator-boosted ultrasonic transducer device is provided for communication of ultrasonic signals. The device employs a micromachined ultrasonic transducer (MUT), such as a piezoelectric MUT (pMUT) or capacitive MUT (cMUT), and a matching network in electrical communication with the MUT. The matching network employs a microelectromechanical (MEMS) resonator having a working frequency selected to increase a voltage difference across electrodes of the MUT. The matching network is connected in series between the MUT and input source circuitry for transmission of outgoing ultrasonic signals. The matching network is connected between the MUT and load impedance circuitry to increase voltage from the MUT during reception of incoming ultrasonic signals. The matching network can be selected to configure the frequency of bandwidth of the device as desired for a particular application.

The invention provides a piezoelectric micromechanical ultrasonic transducer (PMUT), which comprises an ultrasonic transduction chip and a PMUT functional unit array formed by M * N regular hexagonal array elements, and the ultrasonic transduction chip sequentially comprises a top electrode layer, a piezoelectric layer, a bottom electrode layer and a substrate layer from top to bottom; a top electrode bonding pad and a bottom electrode bonding pad are arranged on the peripheral edge of the chip, each array element area is provided with an annular cavity below the upper surface of the substrate layer, and an annular vibrating diaphragm is formed on a reserved part on each annular cavity; each array element also sequentially comprises a top electrode layer, a piezoelectric layer, a bottom electrode layer and an annular diaphragm layer from top to bottom, and the same layer is connected to form each layer; isolation deep grooves are formed in the substrate layer between the adjacent edges of the adjacent array elements and penetrate upwards so as to suppress crosstalk between the array elements; a rotten liquid channel needs to be formed in the annular vibrating diaphragm; the invention further provides a manufacturing method of the PMUT and an ultrasonic transmitting and receiving method.

The present disclosure relates to a hybrid ultrasound transducer system. The present disclosure relates to an integrated chip structure. The integrated chip structure includes a dielectric stack disposed on a substrate. The integrated chip structure further includes one or more piezoelectric micromachined ultrasonic transducers (PMUTs) and one or more capacitive micromachined ultrasonic transducers (CMUTs). The one or more PMUTs include a piezoelectric stack disposed within the dielectric stack over one or more PMUT cavities. The one or more CMUTs include electrodes disposed within the dielectric stack and separated by one or more CMUT cavities. An isolation chamber is disposed within the dielectric stack laterally between the one or more PMUTs and the one or more CMUTs. The isolation chamber extends in a vertical direction through at least a portion of both the one or more PMUTs and the one or more CMUTs.

This invention discloses a novel wideband pMUT unit and array. The novel wideband pMUT unit and array, from bottom to top, comprises a base layer, a driving layer, and a multi-gradient vibration layer. The base layer includes a support, a back cavity, a back load, and a silicon dioxide insulating layer. The driving layer includes a bottom electrode, a top electrode, and an adhesion layer. The gradient of the multi-gradient vibration layer is guided by its thickness dimension, and the multi-gradient vibration layer is a multi-gradient piezoelectric thin film. The pMUT unit with the multi-gradient vibration layer has multiple resonant modes, giving it multi-frequency performance. The back load is formed by etching to amplify the damped oscillation of the pMUT unit, while adjusting the equivalent vibrating mass, stiffness, and effective vibrating area distribution of the pMUT unit, and coupling the multi-frequency bands into a wideband. This invention is applicable to the acoustic field and, compared with conventional pMUT structures, can effectively broaden the operating frequency band of the pMUT unit.

The invention belongs to the field of sensors, and particularly relates to a high-sensitivity PMUT and a preparation method thereof.The preparation method comprises the steps that a vibrating diaphragm structure of a piezoelectric micromechanical ultrasonic transducer is prepared, and the vibrating diaphragm structure comprises a silicon substrate, a buried oxide layer, a passive layer, a lower electrode layer, a piezoelectric layer and an upper electrode layer from bottom to top; in a non-anchoring area and / or a central vibration area of a vibrating diaphragm structure of the piezoelectric micromechanical ultrasonic transducer, rigidity weakening is carried out on a piezoelectric layer and / or an upper electrode layer, and the high-sensitivity piezoelectric micromechanical ultrasonic transducer is obtained; according to the invention, the electromechanical coupling coefficient is improved, and the sound output capability when the transducer is used as an emitter and the sensitivity when the transducer is used as a receiver are also improved.

A piezoelectric micromachined ultrasonic transducer (PMUT) device has different transduction efficiencies at different portions of the PMUT device depending on design characteristics such as material, material thickness, and shape. The metal layer of the PMUT device is patterned such that some portions of the piezoelectric layer of the PMUT device are inactive. Only the active portion of the piezoelectric layer is used for transmission and reception of ultrasonic signals, while the total PMUT device capacitance is reduced due to the lack of active capacitors in the inactive region (s) of the PMUT device, resulting in a PMUT design with increased sensitivity. For the differential PMUT device, patterning may be performed to match a capacitance associated with the differential piezoelectric region.

Disclosed is a transmission and reception device including: a plurality of PMUT sections in which each PMUT section includes one or more PMUTs on a CMOS circuit; and the CMOS circuit. The CMOS circuit includes: a wave transmitter that switches a voltage between a high voltage and a low voltage and applies the switched voltage to one or both of an upper electrode and a lower electrode of the PMUT section at a time of transmission of an ultrasound; and a series connector that connects the PMUT sections in series in an arbitrary number of series and connects the connected PMUT sections between a wave receiver and a common potential at a time of reception of an ultrasound, the wave receiver processing a reception signal of the connected PMUT sections.

The invention relates to the technical field of hydrogel patches, in particular to a wearable hydrogel patch structure based on an ultrasonic sensor, which is characterized in that a medical silica gel film is cut into a rectangle of 20mm * 30mm to serve as a flexible substrate supporting layer; and dropwise adding a pre-polymerization solution on the upper surface of the substrate, covering a PET mask, and then carrying out ultraviolet curing for 60 seconds to form a solid hydrogel coupling layer with the thickness of 1mm and the size slightly smaller than that of the substrate. Then aligning and pasting a flexible PMUT array on the surface of the hydrogel, and covering and sealing a polyurethane film with the thickness of 25 microns by using a hot pressing method to form a sealing protection layer; the hot pressing temperature is 85 DEG C, the pressure is 0.3 MPa, and the time is 10 seconds, so that the outer edge of the polyurethane is fused and combined with the silica gel substrate, and meanwhile, the PMUT array is completely packaged between hydrogel / polyurethane interfaces, so that the integration of'hydrogel-array-sealing 'is realized.

The invention discloses a stop strip structure for forming a cavity of an ultrasonic transceiver and a packaging method, and belongs to the technical field of micro electro mechanical system (MEMS) packaging, the stop strip structure is arranged on the periphery of a cavity area on the surface of a chip and is used for preventing a molding material from flowing into the cavity area in a molding process, the stop strips are arranged in a manner of encircling at least two circles inside and outside, and the stop strips on the inner ring and the stop strips on the outer ring are distributed in a staggered manner, so that the impact force of a molding material and the flow distance in the PMUT direction are effectively dispersed and reduced, and the molding material is ensured not to flow into a PMUT area; meanwhile, a plurality of welding pins which are distributed at intervals are arranged on the chip on the periphery of the stop strip structure; and connecting and fixing the welding pins on the chip, the stop strips on the chip, the copper columns on the chip and the corresponding bonding pads on the RDL carrier plate by adopting a reflow soldering process. The problems of low cavity forming precision, complex process and chip displacement in the existing chip preposition process are solved, and the performance and the stability of the ultrasonic transceiver are improved.

This invention belongs to the field of ultrasonic sensing and microelectromechanical systems (MEMS) packaging technology, specifically relating to a multi-segment acoustic packaging structure and optimization method for a PMUT ultrasonic transducer. The multi-segment acoustic packaging structure for a PMUT ultrasonic transducer includes a base, a PMUT chip, and an acoustic cavity. The acoustic cavity includes a front cavity section, a tapered transition section, a conduit section, and a waterproof and acoustically permeable membrane. A first minimum gap is formed between the radiating surface of the PMUT chip and the bottom surface of the front cavity section; a second minimum gap is formed between the waterproof and acoustically permeable membrane and the outlet end of the conduit section. Furthermore, the acoustic cavity serves as either a transmitter or a receiver. When used as a transmitter, the depth of the front cavity section is greater than that of the front cavity section when used as a receiver, and the inner diameter of the conduit section is smaller than that of the conduit section when used as a receiver. This packaging structure, through optimization of geometric parameters and acoustic characteristics, achieves differentiated performance improvements for the transmitter and receiver, increasing the transmitted sound pressure and directivity, and expanding the bandwidth and receiving angle of the receiver.

An integrated ultrasound imaging and ablation system is disclosed. The system comprises an ablation catheter having a longitudinal axis, a proximal end, and a distal end. A microelectromechanical (MEMS)-based piezoelectric microfabricated ultrasonic transducer (pMUT) or other ultrasonic transducer is located at the distal end of the ablation catheter. One end of the catheter shaft is connected to a handle assembly, and the other end is connected to a MEMS-based pMUT array. A first carrier assembly is connected to the catheter shaft and has an array of first electrodes connected to a plurality of first carrier arms. A second carrier assembly is connected to the catheter shaft and has an array of second electrodes connected to a plurality of second carrier arms.

Devices and systems for providing neurostimulation to a target location, may include an implantable neurostimulator device including a first transducer device that includes a gas matrix piezoelectric (GMP) array or a piezoelectric micromachined ultra-sound transducer (pMUT) array; the implantable neurostimulator device has a length of 5 mm to 20 mm and a diameter of 1 mm to 5 mm and an energy delivery device including a second transducer device; the second transducer device includes a gas matrix piezoelectric (GMP) array, a polymer matrix piezocomposite array, a capacitive micro-machined acoustic transducer (cMUT) array, or a pMUT ar-2024 / 097917 ray; and a beam-forming processor to cause the second transducer device to produce an acoustic wave, the implantable neurostimulator device is to receive the acoustic wave from the energy delivery device, convert the acoustic wave to an electrical energy signal, and apply the electrical energy signal.

The application discloses a PMUT array ultrasonic transducer, which comprises a PCB substrate and a plurality of independent PMUT array elements, wherein a plurality of array-arranged patch regions are arranged on the PCB substrate, the PMUT array elements are detachably connected to the patch regions, and the PMUT array elements correspond to the patch regions one by one. According to different ultrasonic wave transmitting and receiving requirements, different PMUT array elements can be selected to combine a PMUT array ultrasonic transducer, so that the ultrasonic wave transmitting and receiving of multiple frequencies and wide bandwidth can be realized, and the reusability and adaptability of the PMUT array ultrasonic transducer are improved.

An ultrasound catheter is disclosed. The ultrasound catheter includes a microelectromechanical (MEMS)-based piezoelectric micromachined ultrasound transducer (pMUT) array disposed within the distal end of a body. The ultrasound catheter further includes a plurality of electronic flex circuits connected at one end to a handle connector and at the other end to a first layer of an AIC. The handle connector passes ultrasound signals to the distal end through the plurality of electronic flex circuits. A distal pMUT interposer is further disposed between the first and second layers of the AIC using a plurality of InvisiVia connections. The InvisiVia connections are configured to bring the electronic flex circuits from one side of the distal pMUT interposer to the other. The MEMS-based pMUT array transmits pressure waves and receives return pressure wave echoes through the plurality of InvisiVia connections of the distal pMUT interposer.