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421 results about "Micromachinery" patented technology
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Micromachines are mechanical objects that are fabricated in the same general manner as integrated circuits. They are generally considered to be between 100 nanometres to 100 micrometres in size, though that is debatable. The applications of micromachines include accelerometers that detect when a car has hit an object and trigger an airbag. Complex systems of gears and levers are another application.
Bending bearings for reducing quadrature in oscillating micromechanical devices
Microelectromechanical component (100) for motion measurement, comprising: a fortified section (118); a single, central anchor (106) coupled to the attached section (118) with four sides; a first non-straight suspension element (108) coupled to the anchor (106) on one side of the anchor (106); a second non-straight suspension member (120) coupled to the anchor (106) on the same side of the anchor (106), wherein the second non-straight suspension member (120) has a shape and position that mirrors the first non-straight suspension member (108) on a plane (122) bisecting the anchor; and a test mass (104) which is planar, wherein the test mass (104) is suspended at least partially on the first non-straight suspension member (108) and the second non-straight suspension member (120) such that the test mass (104) is rotatable about the anchor (106) and displaceable in a plane which is parallel to the attached section (118), where the first and second non-straight suspension members (108, 120) are bending bearings, wherein the first non-straight suspension member (108) has a C-shape, wherein the C-shape includes an inner section (110) which is coupled to the anchor (106) and extends towards the plane (122) bisecting the anchor, a central section (114) which includes a nearby section and has a distant section, whereby the near section is coupled to the inner section (110), and the far section extends away from the anchor (106) along the plane (122) bisecting the anchor and is coupled to an outer section (112) extending away from the plane (122) bisecting the anchor.
Owner:FAIRCHILD SEMICON CORP
Micro-mechanical gyroscope zero offset on-line temperature compensation method based on Q value active control
The invention discloses a micro-mechanical gyroscope zero offset online temperature compensation method based on Q value active control, and belongs to the technical field of micro-mechanical gyroscope zero offset temperature compensation. According to the method, on the basis that asymmetry of quality factors of a driving mode and a detection mode is a main cause of an in-phase zero offset error, improvement of in-phase zero offset is achieved in a mode of controlling the quality factors of the modes through parametric excitation. According to the method, online identification of the intrinsic quality factor and the equivalent quality factor of the detection mode is realized by using a signal injection method, and online compensation of the equivalent quality factor is realized through parametric excitation. The method solves the problem of zero offset error drift caused by mismatching of quality factors of a driving mode and a detection mode in a temperature change environment, and a universal scheme is provided for the zero offset temperature stability of the high-performance micromechanical gyroscope.
Owner:ZHEJIANG UNIV
High-q micromechanical torsion resonator based on suspending a test mass from a nanoribbon
PendingUS20250236508A1Acceleration measurementPiezoelectric/electrostrictive devicesParticle physicsMicromachinery
The present invention features a micrometer-scale torsion balance device comprising a rigid mass and two or more nanoribbons attached to the rigid mass. The rigid mass may be suspended by the two or more nanoribbons. The two or more nanoribbons may be placed under tensile stress. A local acceleration value may be derived from a torsional stiffness of the two or more nanoribbons. In some embodiments, the rigid mass may comprise silicon. In some embodiments, the two or more nanoribbons may comprise silicon nitride. In some embodiments, the rigid mass may have a polygon shape, the polygon shape having four or more sides. A side of the four or more sides may be longer than all others.
Owner:THE GOVERNMENT OF THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY DEPARTMENT OF HEALTH & HUMAN SERVICES +1
Flexible micro-needle tip array electrode based on composite multilayer metal and preparation method of flexible micro-needle tip array electrode
PendingCN120668965AMaterial analysis using wave/particle radiationScanning probe microscopyContact layerMicromachinery
The invention belongs to the technical field of micromachining, and discloses a flexible micro needle tip array electrode based on composite multi-layer metal and a preparation method of the flexible micro needle tip array electrode. The flexible micro needle tip array electrode comprises a flexible substrate and a silicon micro needle tip array structure arranged on the flexible substrate, each silicon micro needle tip in the silicon micro needle tip array structure is provided with composite multilayer metal capable of conducting electricity and conducting signals, and the composite multilayer metal sequentially comprises a seed layer, a structural layer, an adhesion layer and a contact layer from inside to outside; the material of the seed layer is Cr, Ti, Ni, Mo, Ta, W, Fe, Cu, Au, Ag or Pt, the material of the structural layer is Cu, Ag or Au, the material of the adhesion layer is Cr, Ni, Ti, Mo, Ta or W, and the material of the contact layer is Au, Ag or AgCl. According to the invention, the composite multi-layer metal is used as the conductive layer of the flexible micro-needle-point array electrode, so that the contact impedance of the flexible micro-needle-point array electrode is reduced.
Owner:XI AN JIAOTONG UNIV
Biaxial silicon micro-accelerometer based on three-degree-of-freedom weak coupling resonator
PendingCN120294364ATelevision system detailsAcceleration measurement using interia forcesAccelerometerMicromachinery
The invention discloses a biaxial silicon micro-accelerometer based on a three-degree-of-freedom weak coupling resonator, and belongs to the technical field of micro-electro-mechanical systems and microfluid measurement. Comprising a glass base and a silicon micromechanical sensor, the center of the glass base is provided with a protruding common anchor point, the silicon micromechanical sensor is connected to the glass base through the common anchor point, and signal electrodes for transmitting signals are distributed on the glass base; the silicon micromechanical sensor comprises a stress base and resonance modules; the stress base is mounted on the glass base, and the resonance modules arranged in a Y shape are arranged on the stress base; the Y-shaped head of the resonance module is provided with a pair of resonators which are perpendicular to each other and are used for detecting acceleration in the horizontal direction and acceleration in the vertical direction respectively. The stability and the measurement accuracy of the biaxial accelerometer are further improved by arranging a resonator arrangement mode of a stable structure and cooperating with the mechanical stable design of the amplification unit and the safety structure.
Owner:NANJING UNIV OF INFORMATION SCI & TECH
Three-axis accelerometer based on four-degree-of-freedom weak coupling resonator
ActiveCN120927998AAcceleration measurement using interia forcesAcceleration measurement in multiple dimensionsSignal processing circuitsEtching
The invention provides a triaxial accelerometer based on a four-degree-of-freedom weak coupling resonator, the triaxial accelerometer comprises an upper-layer structure and a lower-layer structure, the upper layer is a micromechanical sensitive element constructed by taking silicon as a material, the lower layer is a glass base processed by a silicon dioxide material, and the glass base is used for providing mechanical support and electrical isolation functions. Wherein the micromechanical sensitive element has a signal conversion function; and the lower-layer glass base is formed by wet etching and metal sputtering processes and is used for signal output. On the basis of collaborative design of the orthogonally distributed resonance unit array and the mechanical amplification mechanism, electrostatic driving and amplitude ratio detection are combined, synchronous and accurate sensing of acceleration of the Y axis, the X axis and the Z axis is achieved through a single sensitive element, the technical limitation of a traditional single-axis detection mode is broken through, the complexity of a rear-end signal processing circuit is reduced, and the detection precision is improved. The device space utilization rate is improved.
Owner:NANJING UNIV OF INFORMATION SCI & TECH
Multi frequency acoustic emission micromachined transducers for non-destructive evaluation of structural health
ActiveUS12407974B2Material analysis using acoustic emission techniquesResponse signal detectionAcoustic emissionEngineering
A MEMS AE transducer system is provided that takes advantage of the low power consumption and lightweight characteristics of MEMS AE transducers, while also achieving higher sensing sensitivity. To address the problem of low sensitivity typically associated with MEMS AE transducers, electrical responses of multiple MEMS AE transducers operating at different frequency ranges are combined to increase the bandwidth and sensitivity of the MEMS AE transducer system. As the frequencies are constructive, the combined response on a single channel is the actual summation of two signals with an improved signal to noise ratio. Additionally, each frequency can be decomposed because they are well separated from each other due to the super narrowband response and high Quality factor of MEMS AE transducers.
Owner:THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS
Gyroscope structure, chip, gyroscope and electronic equipment
PendingCN120063238ASpeed measurement using gyroscopic effectsGyroscopes/turn-sensitive devicesGyroscopeMicromachinery
A gyroscope structure, a chip, a gyroscope and an electronic device, the gyroscope structure comprises a substrate and a structural layer, the structural layer comprises an anchor point, a first elastic structure, a second elastic structure, a third elastic structure, a lever, a first mass block and a second mass block, the anchor point is connected with the substrate, the third elastic structure is used for connecting the anchor point with the lever, and the second elastic structure is used for connecting the first mass block and the second mass block. The first elastic structure is used for connecting the lever with the first mass block, and the second elastic structure is used for connecting the lever with the second mass block. Therefore, the orthogonality problem caused by micromachining manufacturing can be inhibited and counteracted through torsion of the first lever, and the precision and the stability of the gyroscope are improved.
Owner:HUAWEI TECH CO LTD
Gyroscope structure, chip, gyroscope, and electronic device
PCT designated stage expiredWO2025112417A1Speed measurement using gyroscopic effectsGyroscopes/turn-sensitive devicesGyroscopeMicromachinery
A gyroscope structure, a chip, a gyroscope, and an electronic device. The gyroscope structure comprises a substrate (100) and a first structure layer (300). The first structure layer (300) comprises an anchor point (301), a first elastic structure (304), a second elastic structure (314), a third elastic structure (302), a first lever (303), a first mass block (305), and a second mass block (315), the anchor point (301) being connected to the substrate (100), the third elastic structure (302) being used for connecting the anchor point (301) and the first lever (303), the first elastic structure (304) being used for connecting the first lever (303) and the first mass block (305), and the second elastic structure (314) being used for connecting the first lever (303) and the second mass block (315). Thus, the orthogonality problem caused by micromachining manufacturing can be suppressed and offset by means of torsion of the first lever (303), improving the precision and stability of the gyroscope.
Owner:HUAWEI TECH CO LTD
Partial discharge detection device and method based on distributed capacitive micro-machined ultrasonic transducer
The invention belongs to the technical field of acoustic emission sensors, and discloses a partial discharge detection device and method based on distributed capacitive micro-machined ultrasonic transducers, and the device comprises the steps: arranging at least four capacitive micro-machined ultrasonic transducers at different positions of a housing of a to-be-detected transformer; acquiring an ultrasonic signal in the transformer in real time through the capacitive micro-mechanical ultrasonic transducer; and calculating the position information of the partial discharge source in the transformer by using the time information of the ultrasonic signals acquired by all the capacitive micro-mechanical ultrasonic transducers, the propagation speed of the ultrasonic waves in the transformer and the position information of each capacitive micro-mechanical ultrasonic transducer. According to the invention, the MEMS ultrasonic sensor is adopted to measure the partial discharge phenomenon of the transformer, the measurement result is accurate, and the partial discharge source with partial discharge in the transformer can be accurately judged.
Owner:XI AN JIAOTONG UNIV
MEMS sensor device and sensing method
Owner:INFINEON TECHNOLOGIES AG
Micro-electromechanical systems (MEMS) and methods of fabricating the same
PendingUS20250361140A1Decorative surface effectsSolid-state devicesMicromachineryMechanical engineering
An actuator of a micro-electromechanical system (MEMS) includes a semiconductor substrate. The actuator includes an array of micromechanical arms disposed over the semiconductor substrate. The actuator includes a first capping member disposed over the micromechanical arms. The actuator includes a second capping member disposed opposite the first capping member such that the micromechanical arms extend between the first capping member and the second capping member along a vertical direction.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
A high-sensitivity MEMS differential pressure sensor and its preparation method
ActiveCN116354307BTelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesDifferential pressureThin membrane
The present invention discloses a high-sensitivity micro-mechanical system (MEMS) differential pressure sensor and a preparation method thereof, wherein the differential pressure sensor comprises a silicon nitride (SiN) with an etched window. x ) thin films, silicon (Si) substrates, SiN x Suspended structure self-supporting film, PdSe2 polycrystalline ultra-thin film, metal electrode and surface passivation layer. Ultra-thin PdSe2 has significant piezoresistive effect and ultra-thin suspended SiN x The device has a high pressure differential stress sensing characteristic, and the high Young's modulus SiN x The device ensures the reliability of differential pressure sensing. The Wheatstone bridge formed by the optimized metal electrode structure suppresses temperature drift, ensuring the accuracy of differential pressure measurement. Advantages of this invention include compatibility with silicon-based semiconductor processes, high yield, strong repeatability, good stability, and high device sensitivity.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA
Anti-impact method and device for stabilized platform based on micromechanical gyroscope
PendingCN120406091ASpeed measurement using gyroscopic effectsControllers with particular characteristicsGyroscopeControl system
The invention discloses an impact resistance method and device for a stabilized platform based on a micromechanical gyroscope, and the method comprises the steps: recording the angle amount of the stabilized platform which is not operated due to a control bandwidth when the stabilized platform is subjected to impact or high-frequency vibration by adopting a gyroscope integration method, and continuously compensating the angle amount to a control system. The problem of pointing angle deviation caused by transient impact or high-frequency vibration can be effectively solved. The invention relates to the technical field of platform design. According to the impact resistance method and device for the stabilized platform based on the micromechanical gyroscope, the acceleration of the environment where the stabilized platform is located is calculated through a gyroscope differential method, and the acceleration is used for judging the stability of the platform environment and serves as a threshold value for starting integration of gyroscope data; a solution is given under the condition that the stable holder in a continuous tracking state is subjected to external impact, the pointing of a system can be kept stable for small-order impact, and the stable holder can still point to a target after being impacted for large-order impact.
Owner:BEIJING FUJIRUI OPTOELECTRONICS TECH CO LTD
Measuring arrangement for characterizing a fuel gas mixture and method for characterizing a fuel gas mixture
A measuring arrangement (400) for characterizing a fuel gas mixture comprises a support structure (410) and components arranged thereon that can be exposed to the fuel gas mixture, namely: a micromechanical resonator (20; 120, 220) with gas-dependent vibration properties; and a thermal conductivity sensor (44; 144); an infrared measuring arrangement (440) with a thermal infrared radiation source (442), an infrared spectroscopic sensor arrangement (444), and an irradiated infrared measuring volume (446) between the thermal infrared radiation source (442) and the infrared spectroscopic sensor arrangement (444); a pressure sensor (430) arranged on the support structure (410) for detecting a static pressure of the fuel gas mixture; a temperature sensor (50; 150) configured to detect a temperature measurement value of the fuel gas mixture; and a measuring and operating circuit (600) for receiving signals from the components;and for determining at least one final measured value of a variable characterizing the energy content of the gas on the basis of the received signals, wherein the variable characterizing the energy content of the fuel gas mixture is selected from calorific value, heating value, upper Wobbe index of the fuel gas mixture and lower Wobbe index of the fuel gas mixture;
Owner:TRUEDYNE SENSORS AG
Self-checking resonant micro-mechanical accelerometer
The invention provides a self-check resonant micro-mechanical accelerometer. The self-check resonant micro-mechanical accelerometer comprises a substrate; the anchoring platform is arranged above the substrate, and the anchoring platform is connected with the substrate through an anchoring part; the mass block is connected with the anchoring platform through a cantilever supporting assembly, and the cantilever supporting assembly enables the mass block to be arranged above the substrate in a suspended mode; the acceleration detection assembly comprises a resonance unit and an electrode group arranged corresponding to the resonance unit; the force transmission assembly is connected with the mass block and the resonance unit; the self-detection assembly is arranged on the outer side of the mass block and forms a variable capacitance structure with the mass block; wherein the self-detection assembly is used for providing an excitation signal with a preset size for the mass block and driving the mass block to generate an X-axis displacement response, the force transmission assembly transmits the X-axis displacement of the mass block to the resonance unit so as to change the Y-axis vibration frequency of the resonance unit, and the acceleration is determined according to the Y-axis vibration frequency of the resonance unit. And performing performance detection on the resonant micro-mechanical accelerometer based on the acceleration corresponding to the X-axis displacement response.
Owner:SUZHOU QIUSHI FUTURE MICROSYSTEM TECHNOLOGY CO LTD
Ultrasound probe with mut transducer and method of manufacturing thereof
PendingCN122270350AUltrasonic/sonic/infrasonic diagnosticsSurgeryTransducerElectromagnetic shielding
The present specification relates to an ultrasonic probe (100) comprising: an electronic chip (110) having a front face (110A) and comprising a substrate (111) and at least one micro-machined ultrasonic transducer (210) in and on the substrate and on the front face; an electrically insulating protective layer (130) covering the at least one transducer; and a metallic shielding layer (140) on the protective layer, the shielding layer forming an electromagnetic shield of the at least one transducer.
Owner:WAYMON CORP
Package structure of piezoelectric micromachined ultrasonic transducer
A package structure of a piezoelectric micromachined ultrasonic transducer includes a silicon substrate, a first protective layer, a piezoelectric composite film, a first metal layer, a second metal layer, a first pad, a second pad and a second protective layer. The silicon substrate is provided with a first through hole and a second through hole. The first protective layer is provided with a groove, a first communication hole and a second communication hole. The piezoelectric composite film includes a first electrode layer and a second electrode layer respectively filling the first communication hole and the first through hole, and the second communication hole and the second through hole so as to be connected to the first metal layer and the second metal layer. A surface of the second protective layer away from the piezoelectric composite film is a flat surface.
Owner:SONICMEMS (ZHENGZHOU) TECH CO LTD
Welding equipment for new energy automobile production
ActiveCN120772728AProgramme-controlled manipulatorWelding/cutting auxillary devicesNew energyMicromachinery
The invention relates to the technical field of new energy automobile production welding, in particular to welding equipment for new energy automobile production, which comprises a positioning plate, positioning holes are equidistantly formed in the side surface of the positioning plate, a product piece and a welding assembly are arranged on the upper side of the positioning plate, and a positioning assembly is arranged on the upper side of the positioning plate corresponding to the product piece. The welding assembly comprises a double-shaft transferring module, a transverse electric sliding table, a micro mechanical arm and a welding gun. By arranging the welding assembly and the positioning assembly, semi-automatic workpiece locking operation can be carried out, corner and height positioning operation can be carried out in cooperation with all sensors in the locking process, automatic welding point-to-point path operation is achieved, the welding distance can be detected in real time during welding, fine adjustment compensation can be carried out, and the welding quality is guaranteed; and the device is perfectly adapted to production of research and development of small-batch new products, can be used after being adapted to adjustment of different data, does not need fixture modification and self-establishment of a welding coordinate system, saves time and labor, and is convenient to operate.
Owner:JIANGSU DIZI IND EQUIPMENT CO LTD
Particle sorting system with multiway valve based on a cantilever beam with multiple actuation states
PCT designated stageWO2026041725A1Valve arrangementsLaboratory glasswaresCantilevered beamParticle sorting
The invention is directed to a micromechanical device for sorting at least two distinct fractions of target particles and at least one non-target target particle from each other, all suspended in a fluid, comprising: - a source of magnetic flux (1) - a movable member (2) comprising permeable magnetic material (3) wherein the movable member (2) is moved from a first position (4) to a second position (5) and / or one or more third positions (6) by applying a magnetic flux to the movable member (2) - a sample inlet channel (7) through which the fluid flows into the micromechanical device - a first output channel (8) which the movable member (2) diverts the non-target particles while being in the first position (4) - a second output channel (9) into which the movable member (2) diverts one distinct fraction of the target particles while being in the second position (5) - one or more third output channels (10) into which the movable member (2) diverts further distinct fractions of the target particles while being in one of the one or more third position (6) - a spring (11) attached to the movable member (2) providing mechanical resistance to the movable member (2) when moving from the first position (4) to the second position (5) and / or to one or more of the third positions (6) characterized in that the spring (11) has non-linear elastomechanical properties when the movable member (2) is at the second position (5) and / or at one or more of the third positions (6).
Owner:MILTENYI BIOTEC BV & CO KG
Method for the precise measurement operation of a micromechanical gyroscope
Method for the precise measurement operation of a micromechanical angular rate sensor, comprising at least one deflectably suspended seismic mass (1, 15, 20), at least one drive device for driving the seismic mass (1, 15, 20) and at least one first (2, 11, 18) and one second (3, 12, 19) trim electrode element, which are directly or indirectly jointly assigned to the seismic mass (1, 15, 20), wherein a first electrical trim voltage (U) is applied between the first trim electrode element (2, 11, 18) and the seismic mass (1, 15, 20). TO1 , U TLO1 , U TRO1 , U TU2 , U T1H , U T2V ) and a second electrical trim voltage (U) between the second trim electrode element (3, 12, 19) and the seismic mass (1, 15, 20) TO2 , U TLO2 , U TRO2 , U TU1 , U T2H , U T1V) are set, whereby the first and second electrical trim voltages depend at least on a quadrature parameter (U). T ) and a resonance parameter (U f ) are set, characterized by the fact that the first (U TO1 , U TLO1 , U TRO1 , U TU2 , U T1H , U T2V ) and the second (U TO2 , U TLO2 , U TRO2 , U TU1 , U T2H , U T1V ) electrical trim voltage is set so that the sum of the square of the first electrical trim voltage (U) TO1 , U TLO1 , U TRO1 , U TU2 , U T1H , U T2V ) multiplied by a first constant factor (α) and from the square of the second electrical trim voltage (U) TO2 , U TLO2 , U TRO2 , U TU1 , U T2H , U T1V) multiplied by a second constant factor (β), is kept constant and / or is based on a first reference value of the resonance parameter (U) f ) is set to the square.
Owner:CONTINENTAL AUTOMOTIVE TECHNOLOGIES GMBH +1
Micromechanical component, sound transducer device, and method for producing a micromechanical component
ActiveUS12628566B2Mechanical vibrations separationForming microstructural systemsElectrical connectionMicromachinery
A micromechanical component for a sound transducer device. The micromechanical component includes a substrate, a diaphragm, at least one piezoelectric element, and at least one electrical contact connection. The diaphragm can vibrate and is connected to the substrate. The at least one piezoelectric element is disposed between the diaphragm and the substrate and is connected to the diaphragm. The at least one piezoelectric element is designed to produce and / or detect vibrations of the diaphragm in the ultrasonic range. The at least one electrical contact connection is electrically connected to the at least one piezoelectric element. The micromechanical component can be connected, using flip chip technology, to a control circuit such that the at least one piezoelectric element can be electrically connected to the control circuit by means of the at least one electrical contact connection.
Owner:ROBERT BOSCH GMBH
Micromechanical z-acceleration sensor
ActiveUS12612302B2Piezoelectric/electrostrictive devicesMovable microstructural devicesMicromachineryRocker arm
A micromechanical z-acceleration sensor. The sensor has a substrate with a main extension plane, and a micromechanical rocker which is arranged parallel to the extension plane above the substrate and can be tilted in a first direction z perpendicular to the extension plane, wherein the rocker in a first partial region: has first perforations, which extend through the rocker in the first direction z, with a first cross-section parallel to the main extension plane with a first aspect ratio of at least 1:1; and has second perforations, which extend through the rocker in the first direction z, with a second cross-section with a second aspect ratio of a longer side to a shorter side, wherein the first aspect ratio is smaller than the second aspect ratio. A first perforation and a second perforation are arranged alternately next to one another in a repeating pattern.
Owner:ROBERT BOSCH GMBH
Micromechanical sensor device and corresponding manufacturing process
ActiveDE102014224559B4Television system detailsAcceleration measurement using interia forcesElectrical connectionMicromachinery
Micromechanical sensor device with: an ASIC substrate (10) with a first front side (VSa) and a first back side (RSa); a rewiring device (20) formed on the first front side (VSa) with a plurality of stacked conductor track levels (LB0, LB1) and insulation layers (I); a MEMS substrate (9) with a second front (VS) and a second back (RS); a first micromechanical functional layer (16) formed above the second front surface (VS); a second micromechanical functional layer (17) formed above the first micromechanical functional layer (16), which is connected to the rewiring device (20) via a bond connection (50); wherein a movable sensor structure (MS) is formed in the second micromechanical functional layer (17) which is anchored on one side to the MEMS substrate (9) via a first anchoring area (17b') formed in the second micromechanical functional layer (17); wherein in the second micromechanical functional layer (17) an electrical connection element formed in a second anchoring area (17d; 17d'; 17d'') is anchored on one side via a contact area (52) of the bond connection (50) on the ASIC substrate (10); and wherein the first anchoring area (17b') and the second anchoring area (17d; 17d'; 17d'') are elastically connected to each other via a spring element (17c) formed in the second micromechanical functional layer (17).
Owner:ROBERT BOSCH GMBH
Micromechanical component for a sensor device and method for manufacturing a micromechanical component for a sensor device
ActiveCN113247856BTelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesMicromachineryMechanical engineering
The invention relates to a micromechanical component for a sensor device, having a substrate (10) with a substrate surface (10a), at least one stator electrode arranged on the substrate surface and / or on at least one intermediate layer at least partially covering the substrate surface, the at least one stator electrode each being formed from a first semiconductor layer and / or a metal layer, at least one actuator electrode arranged adjustably, the at least one actuator electrode each being formed from a second semiconductor and / or metal layer (P2), a membrane spanning the at least one stator electrode and the at least one actuator electrode, the membrane having a membrane outer side (18a) oriented away from the at least one stator electrode and the at least one actuator electrode, the membrane outer side being formed from a third semiconductor layer and / or a metal layer (P3), a stiffening structure and / or a protection structure (54) protruding on the membrane outer side being formed from a fourth semiconductor layer and / or a metal layer (P4).
Owner:ROBERT BOSCH GMBH
Microsensor, measurement methods and sensor condition monitoring methods
PendingDE102024206538A1Fluid pressure measurement using ohmic-resistance variationAcceleration measurementComputational physicsMicromachinery
The invention relates to a microsensor (10) for measuring a physical quantity (14), comprising a first measuring element (16) with a first measuring characteristic (C1) and a second measuring element (56) with a second measuring characteristic (C2), which is mechanically delimited and offset from the first measuring area (54) by means of a second measuring characteristic (C2), and a second measuring element (18) with a micromechanical first deflection element (18) which is deflectable depending on the quantity (14), and a second measuring element (28) which is measurable in a third measuring area (52) with a third measuring characteristic (C3), wherein the third measuring area (52) overlaps a transition (53) between the first and second measuring areas (54, 56) and forms a first overlap area (58) with the first measuring area (54) and a second overlap area (60) with the second measuring area (56).wherein the measured quantity (14) present at least at the transition (53) can be measured by measuring the second measuring element (28) based on the third measuring characteristic (C3). Furthermore, the invention relates to a method for measurement and a method for sensor condition monitoring.
Owner:ROBERT BOSCH GMBH
Micromechanical structure
ActiveDE102009000606B4Speed measurement using gyroscopic effectsTurn-sensitive devicesGyroscopeElectrical conductor
Micromechanical structure (1), in particular a gyroscope, comprising a substrate (2) having a principal extension plane (100), a first detection mass element (11) and a second detection mass element (21), wherein the first detection mass element (11) is provided to be excitable by a first drive element (10) to a first vibration (101) parallel to the principal extension plane (100), wherein the second detection mass element (21) is provided to be excitable by a second drive element (20) to a second vibration (201) antiparallel to the first vibration (101), wherein a first Coriolis deflection of the first detection mass element (11) along a third direction (Z) perpendicular to the principal extension plane (100) is detectable by a first detection means,wherein a second Coriolis deflection of the second detection mass element (21) along the third direction (2) is detectable by a second detection means and wherein the first and the second detection mass elements (11, 21) are coupled to each other by means of a first coupling element (3), characterized in that the first detection mass element (11) is designed as a first rocker structure (11') and the second detection element (21) as a second rocker structure (21'), wherein the first and second rocker structures (11' and 21') are attached to the first and second drive elements (10 and 20) by means of a first and second torsion spring (13 and 23, respectively), respectively, wherein the first and second torsion axis (13' and 23') of the first and second torsion spring (13, 23) are parallel to the first and second directions (X, 2, 3, 4, 5, 6, 7, 8, 9, 10 ...Y) is provided and the first or second rocker structure (11' or 21') has an asymmetric mass distribution with respect to the first or second torsion axis (13' or 23'), wherein the first and / or the second torsion spring (13, 23) are designed as a conductor spring, wherein the first and / or the second torsion spring (13, 23) are designed as a double conductor spring.
Owner:ROBERT BOSCH GMBH
Micromechanical structure and method for operating a micromechanical structure
ActiveDE102009045431B4Television system detailsImpedence networksMicromachineryMechanical engineering
Owner:ROBERT BOSCH GMBH
Method for manufacturing a connection element for a friction-increasing connection of a component, and use of the connection element
The present disclosure relates to an array of connecting elements comprising (i) a support structure, and (ii) a plurality of connecting elements, wherein each connecting element comprises a metal base having a first engagement surface on one side of the base and a second engagement surface on the opposite side of the base, wherein each engagement surface comprises hard particles fixed on the metal base by an adhesive layer; wherein each connecting element is associated with at least one retaining arm integrally linking the connecting element to at least one of (a) the support structure, and (b) one or more other connecting elements. The present disclosure also relates to a method for producing said array and a method for producing a plurality of individual connecting elements, and to the use of a connecting element made from said array for connecting first and second parts to be joined in machine, equipment and motor vehicle construction, in energy generation, or in microelectronic or micromechanical equipment.
Owner:3M INNOVATIVE PROPERTIES CO