212 results about "Micromachinery" patented technology

The present specification relates to an ultrasonic probe (100) comprising: an electronic chip (110) having a front face (110A) and comprising a substrate (111) and at least one micro-machined ultrasonic transducer (210) in and on the substrate and on the front face; an electrically insulating protective layer (130) covering the at least one transducer; and a metallic shielding layer (140) on the protective layer, the shielding layer forming an electromagnetic shield of the at least one transducer.

A package structure of a piezoelectric micromachined ultrasonic transducer includes a silicon substrate, a first protective layer, a piezoelectric composite film, a first metal layer, a second metal layer, a first pad, a second pad and a second protective layer. The silicon substrate is provided with a first through hole and a second through hole. The first protective layer is provided with a groove, a first communication hole and a second communication hole. The piezoelectric composite film includes a first electrode layer and a second electrode layer respectively filling the first communication hole and the first through hole, and the second communication hole and the second through hole so as to be connected to the first metal layer and the second metal layer. A surface of the second protective layer away from the piezoelectric composite film is a flat surface.

The invention is directed to a micromechanical device for sorting at least two distinct fractions of target particles and at least one non-target target particle from each other, all suspended in a fluid, comprising: - a source of magnetic flux (1) - a movable member (2) comprising permeable magnetic material (3) wherein the movable member (2) is moved from a first position (4) to a second position (5) and / or one or more third positions (6) by applying a magnetic flux to the movable member (2) - a sample inlet channel (7) through which the fluid flows into the micromechanical device - a first output channel (8) which the movable member (2) diverts the non-target particles while being in the first position (4) - a second output channel (9) into which the movable member (2) diverts one distinct fraction of the target particles while being in the second position (5) - one or more third output channels (10) into which the movable member (2) diverts further distinct fractions of the target particles while being in one of the one or more third position (6) - a spring (11) attached to the movable member (2) providing mechanical resistance to the movable member (2) when moving from the first position (4) to the second position (5) and / or to one or more of the third positions (6) characterized in that the spring (11) has non-linear elastomechanical properties when the movable member (2) is at the second position (5) and / or at one or more of the third positions (6).

Method for the precise measurement operation of a micromechanical angular rate sensor, comprising at least one deflectably suspended seismic mass (1, 15, 20), at least one drive device for driving the seismic mass (1, 15, 20) and at least one first (2, 11, 18) and one second (3, 12, 19) trim electrode element, which are directly or indirectly jointly assigned to the seismic mass (1, 15, 20), wherein a first electrical trim voltage (U) is applied between the first trim electrode element (2, 11, 18) and the seismic mass (1, 15, 20). TO1 , U TLO1 , U TRO1 , U TU2 , U T1H , U T2V ) and a second electrical trim voltage (U) between the second trim electrode element (3, 12, 19) and the seismic mass (1, 15, 20) TO2 , U TLO2 , U TRO2 , U TU1 , U T2H , U T1V) are set, whereby the first and second electrical trim voltages depend at least on a quadrature parameter (U). T ) and a resonance parameter (U f ) are set, characterized by the fact that the first (U TO1 , U TLO1 , U TRO1 , U TU2 , U T1H , U T2V ) and the second (U TO2 , U TLO2 , U TRO2 , U TU1 , U T2H , U T1V ) electrical trim voltage is set so that the sum of the square of the first electrical trim voltage (U) TO1 , U TLO1 , U TRO1 , U TU2 , U T1H , U T2V ) multiplied by a first constant factor (α) and from the square of the second electrical trim voltage (U) TO2 , U TLO2 , U TRO2 , U TU1 , U T2H , U T1V) multiplied by a second constant factor (β), is kept constant and / or is based on a first reference value of the resonance parameter (U) f ) is set to the square.

A micromechanical component for a sound transducer device. The micromechanical component includes a substrate, a diaphragm, at least one piezoelectric element, and at least one electrical contact connection. The diaphragm can vibrate and is connected to the substrate. The at least one piezoelectric element is disposed between the diaphragm and the substrate and is connected to the diaphragm. The at least one piezoelectric element is designed to produce and / or detect vibrations of the diaphragm in the ultrasonic range. The at least one electrical contact connection is electrically connected to the at least one piezoelectric element. The micromechanical component can be connected, using flip chip technology, to a control circuit such that the at least one piezoelectric element can be electrically connected to the control circuit by means of the at least one electrical contact connection.

A micromechanical z-acceleration sensor. The sensor has a substrate with a main extension plane, and a micromechanical rocker which is arranged parallel to the extension plane above the substrate and can be tilted in a first direction z perpendicular to the extension plane, wherein the rocker in a first partial region: has first perforations, which extend through the rocker in the first direction z, with a first cross-section parallel to the main extension plane with a first aspect ratio of at least 1:1; and has second perforations, which extend through the rocker in the first direction z, with a second cross-section with a second aspect ratio of a longer side to a shorter side, wherein the first aspect ratio is smaller than the second aspect ratio. A first perforation and a second perforation are arranged alternately next to one another in a repeating pattern.

Micromechanical sensor device with: an ASIC substrate (10) with a first front side (VSa) and a first back side (RSa); a rewiring device (20) formed on the first front side (VSa) with a plurality of stacked conductor track levels (LB0, LB1) and insulation layers (I); a MEMS substrate (9) with a second front (VS) and a second back (RS); a first micromechanical functional layer (16) formed above the second front surface (VS); a second micromechanical functional layer (17) formed above the first micromechanical functional layer (16), which is connected to the rewiring device (20) via a bond connection (50); wherein a movable sensor structure (MS) is formed in the second micromechanical functional layer (17) which is anchored on one side to the MEMS substrate (9) via a first anchoring area (17b') formed in the second micromechanical functional layer (17); wherein in the second micromechanical functional layer (17) an electrical connection element formed in a second anchoring area (17d; 17d'; 17d'') is anchored on one side via a contact area (52) of the bond connection (50) on the ASIC substrate (10); and wherein the first anchoring area (17b') and the second anchoring area (17d; 17d'; 17d'') are elastically connected to each other via a spring element (17c) formed in the second micromechanical functional layer (17).

The invention relates to a micromechanical component for a sensor device, having a substrate (10) with a substrate surface (10a), at least one stator electrode arranged on the substrate surface and / or on at least one intermediate layer at least partially covering the substrate surface, the at least one stator electrode each being formed from a first semiconductor layer and / or a metal layer, at least one actuator electrode arranged adjustably, the at least one actuator electrode each being formed from a second semiconductor and / or metal layer (P2), a membrane spanning the at least one stator electrode and the at least one actuator electrode, the membrane having a membrane outer side (18a) oriented away from the at least one stator electrode and the at least one actuator electrode, the membrane outer side being formed from a third semiconductor layer and / or a metal layer (P3), a stiffening structure and / or a protection structure (54) protruding on the membrane outer side being formed from a fourth semiconductor layer and / or a metal layer (P4).

The invention relates to a microsensor (10) for measuring a physical quantity (14), comprising a first measuring element (16) with a first measuring characteristic (C1) and a second measuring element (56) with a second measuring characteristic (C2), which is mechanically delimited and offset from the first measuring area (54) by means of a second measuring characteristic (C2), and a second measuring element (18) with a micromechanical first deflection element (18) which is deflectable depending on the quantity (14), and a second measuring element (28) which is measurable in a third measuring area (52) with a third measuring characteristic (C3), wherein the third measuring area (52) overlaps a transition (53) between the first and second measuring areas (54, 56) and forms a first overlap area (58) with the first measuring area (54) and a second overlap area (60) with the second measuring area (56).wherein the measured quantity (14) present at least at the transition (53) can be measured by measuring the second measuring element (28) based on the third measuring characteristic (C3). Furthermore, the invention relates to a method for measurement and a method for sensor condition monitoring.

Micromechanical structure (1), in particular a gyroscope, comprising a substrate (2) having a principal extension plane (100), a first detection mass element (11) and a second detection mass element (21), wherein the first detection mass element (11) is provided to be excitable by a first drive element (10) to a first vibration (101) parallel to the principal extension plane (100), wherein the second detection mass element (21) is provided to be excitable by a second drive element (20) to a second vibration (201) antiparallel to the first vibration (101), wherein a first Coriolis deflection of the first detection mass element (11) along a third direction (Z) perpendicular to the principal extension plane (100) is detectable by a first detection means,wherein a second Coriolis deflection of the second detection mass element (21) along the third direction (2) is detectable by a second detection means and wherein the first and the second detection mass elements (11, 21) are coupled to each other by means of a first coupling element (3), characterized in that the first detection mass element (11) is designed as a first rocker structure (11') and the second detection element (21) as a second rocker structure (21'), wherein the first and second rocker structures (11' and 21') are attached to the first and second drive elements (10 and 20) by means of a first and second torsion spring (13 and 23, respectively), respectively, wherein the first and second torsion axis (13' and 23') of the first and second torsion spring (13, 23) are parallel to the first and second directions (X, 2, 3, 4, 5, 6, 7, 8, 9, 10 ...Y) is provided and the first or second rocker structure (11' or 21') has an asymmetric mass distribution with respect to the first or second torsion axis (13' or 23'), wherein the first and / or the second torsion spring (13, 23) are designed as a conductor spring, wherein the first and / or the second torsion spring (13, 23) are designed as a double conductor spring.

The present disclosure relates to an array of connecting elements comprising (i) a support structure, and (ii) a plurality of connecting elements, wherein each connecting element comprises a metal base having a first engagement surface on one side of the base and a second engagement surface on the opposite side of the base, wherein each engagement surface comprises hard particles fixed on the metal base by an adhesive layer; wherein each connecting element is associated with at least one retaining arm integrally linking the connecting element to at least one of (a) the support structure, and (b) one or more other connecting elements. The present disclosure also relates to a method for producing said array and a method for producing a plurality of individual connecting elements, and to the use of a connecting element made from said array for connecting first and second parts to be joined in machine, equipment and motor vehicle construction, in energy generation, or in microelectronic or micromechanical equipment.

A laser turning system (1) for producing a component (60) such as a timepiece component or a micromechanical component having a length less than 250 mm and / or a diameter less than 10 mm, the system comprising a rotary spindle (3) for moving a bar of material and a galvanometric scanner (12) capable of emitting a femtosecond laser beam scanning a generating profile of the component to be machined in the bar of material.

Provided is a micromechanical electrical signal amplifier, which can be applied to the field of microelectronics. The structure of the amplifier comprises: an electro-mechanical conversion structure for generating an electrostatic driving displacement; a mechanical resonance structure for generating an amplified electrical signal in response to the amplified electrostatic driving displacement; and a mechanical-electric conversion structure for outputting the amplified electrical signal, wherein the mechanical resonance structure comprises a first surface and a second surface arranged oppositely; the electro-mechanical conversion structure is connected to the first surface of the mechanical resonance structure; and the mechanical-electric conversion structure is connected to the second surface of the mechanical resonance structure. The elastic beam group in the mechanical resonance structure adopts a piezoresistive material, and the self-amplification effect of the mechanical resonance structure is used to amplify the electrostatic force response displacement and further amplify the electrical signal.

The present disclosure provides a micro-mechanical gyroscope and an electronic product. The micro-mechanical gyroscope includes a plurality of first mass blocks, a plurality of second mass blocks, a plurality of driving members, first connecting beams and second connecting beams. The first mass blocks are arranged to face to each other in a first direction, and the second mass blocks are arranged between the first mass blocks and arranged to face to each other in a second direction perpendicular to the first direction. In the second direction, the driving members are arranged on either sides of the first mass blocks and of the second mass blocks. Ends of the first mass blocks in the second direction are connected to driving members, respectively, through the first connecting beams, and the second mass blocks are connected to adjacent driving members, respectively, through the second connecting beams 5.

The application belongs to the technical field of microelectronics, discloses a micromechanical resonator and a preparation method thereof, and improves the Q value of the micromechanical resonator Q The application provides the micromechanical resonator, which comprises a resonant unit and a coupling block; the coupling block is used for realizing mechanical energy transmission between adjacent resonant units; at least one coupling block contained in the micromechanical resonator is provided with a thermal resistance enhancement structure; the thermal resistance enhancement structure is an etching groove formed in the coupling block, or the thermal resistance enhancement structure is composed of the etching groove formed in the coupling block and a low-thermal-conductivity material located in the etching groove; the thermal conductivity of the low-thermal-conductivity material is less than that of a main material of the coupling block. Q The application can effectively improve the Q value of the micromechanical resonator without affecting mechanical coupling between the resonant units.

The invention provides a water floating 3D printing device and method for space additive manufacturing simulation verification, and relates to the field of space additive manufacturing. The water floating 3D printing device comprises a controller, a main mechanical arm, a 3D printing head, a microgravity printing environment simulation device, a micro mechanical arm and a sensor assembly. The microgravity printing environment simulation device comprises a water tank and a dynamic floating substrate unit. The dynamic floating substrate unit floats in the water tank to simulate a microgravity environment; the micro mechanical arm is used for regulating and controlling the nozzle position of the 3D printing head and ensuring that the nozzle is aligned with the floating substrate; and the main mechanical arm is used for moving the 3D printing head according to a preset printing path and assisting in regulating the position of the nozzle. According to the device, through a water floating method, the space microgravity environment can be effectively simulated, the micro mechanical arm and the mechanical arm of the main machine work cooperatively, and accurate and rapid printing can be achieved. According to the invention, a space-imitated environment is provided for fused deposition modeling printing, and the experiment of additive manufacturing of the space-imitated environment can be carried out on the ground.

The application discloses a micro-nano acoustic image sensor capable of large-scale integration and a control method thereof. The micro-nano acoustic image sensor comprises a plurality of pixel sensing units arranged in an array; each pixel sensing unit comprises a micro-mechanical ultrasonic transducer located at a top layer, a pixel circuit located at a bottom layer and an inter-electrode metal bonding layer connecting the two; wherein the micro-mechanical ultrasonic transducer is an acoustic-electric conversion unit with an inverted diaphragm structure, and is connected to the pixel circuit through a lower electrode layer; the pixel circuit is an integrated circuit internal unit with a "3T1D" structure, has a peak sound pressure rectification function, and synchronously senses and addresses samples the sound pressure signal of each pixel sensing unit through an inverse correlation double sampling method, and the sampling method has a global shutter function. The application can perform large-scale array integration on the pixel sensing unit, and perform tomographic sampling on the spatial distribution of ultrasonic echoes, and can directly realize dynamic intensity imaging and distance tomographic imaging of a target sound field.

A spatial ultrasound modulator includes a signal line, an ultrasonic array, a pixel coder and an ultrasonic driver. The signal line includes a plurality of first conductive lines and a plurality of second conductive lines. The plurality of first conductive lines are arranged to be spaced apart from each other on a substrate. The plurality of second conductive lines are arranged to intersect the first conductive lines above the plurality of first conductive lines and to be spaced apart from each other. The ultrasonic array includes a plurality of ultrasonic generators. Each of the plurality of ultrasonic generators includes at least one capacitive micromachined ultrasonic transducer (CMUT) device. Each of the plurality of ultrasonic generators is superimposed on one of a plurality of pixels, which are intersection points of the plurality first conductive lines and the plurality of second conductive lines. Each of the plurality of ultrasonic generators generates a unit-ultrasonic wave. The pixel coder may be configured to generate the coding array by coding each of the plurality of pixels of the ultrasonic array so that an operation mode of each of the plurality of pixels may be a contrasting binary operation mode of the ultrasonic generator. The coding array includes active pixels and inactive pixels. The ultrasonic driver drives the coding array to generate amplitude-modulated ultrasonic waves of which a wavefront may be deformed. The amplitude-modulated ultrasonic waves are a synthesized plurality of unit-ultrasonic waves.

The invention relates to a micromechanical switch having a substrate (10) with a main plane of extension (x, y), having a first electrical contact (11) and a second electrical contact (12), having a first deflectable micromechanical switch part (30) with a first contact bridge (31) for switching a first circuit (15), by means of which first contact bridge the first contact can be brought into electrical contact with the second contact, the invention relates to a first, second, third and fourth electrical contacts (21, 22), having a second deflectable micromechanical switching part (40), which has a second contact bridge (41) for switching a second circuit (25), by means of which the third contact can be brought into electrical contact with the fourth contact, the first, second, third and fourth electrical contacts being arranged on a substrate, wherein the first switching component (30) and the second switching component (40) are formed in the micromechanical functional layer (100) above the substrate and can be deflected in a direction perpendicular to a main extension plane (x, y) of the substrate.

The invention belongs to the technical field of microelectronics, and more particularly relates to a wafer level vacuum packaging structure and method for a micromechanical resonator, the structure comprises a cavity formed by a thin film packaging structure and a resonator substrate, and a resonator vibration part is suspended in the cavity through a support structure connected with the substrate; the thin film packaging structure is composed of a supporting layer, a getter layer and a packaging layer. The getter layer is embedded in the supporting layer; the packaging layer is composed of two or more than two layers of thin films and comprises two or more than two different materials. According to the packaging layer, the residual stress in the thin film packaging structure is regulated and controlled by adjusting the thickness ratio of different film layers, and the mechanical reliability of the packaging structure is improved; a getter material is embedded in a thin film packaging structure, and activation is realized by utilizing high temperature of an epitaxial growth polycrystalline silicon process, so that the high vacuum degree of a packaging chamber is ensured.

The invention provides an integrated inertial measurement module, a measurement method and terminal equipment, and relates to the technical field of sensors. The integrated inertial measurement module comprises: a packaging body; a substrate disposed within the package; a sensor array disposed on the substrate, the sensor array comprising a plurality of micromechanical gyro sensor units for measuring angular velocity; the plurality of slave processors are arranged on the substrate, each slave processor is electrically connected to one sensing subset in the sensor array, and the slave processors are used for carrying out local weight fusion on measured values of the micromechanical gyroscope sensor units in the sensing subset and outputting local fusion values; and the main processor is arranged on the substrate, is electrically connected to all the slave processors, and is used for carrying out global weighted fusion on each local fusion value and outputting a final angular velocity measurement value. According to the invention, the measurement precision of the micromechanical gyroscope sensor unit can be improved.

The invention relates to a scanning device having a transmitting arrangement (20) for transmitting signals in the form of electromagnetic radiation and / or having a receiving arrangement (30) for receiving signals in the form of electromagnetic radiation, wherein the scanning device has a micromechanical device having a carrier plate (4), which is held on a frame (1) by means of spring elements (2a, 2b, 2c, 2d), and having a drive device (2a, 2b, 2c, 2d, 11a, 11b, 11c, 11d), which is configured to drive the carrier plate relative to the frame, wherein the carrier plate has a transmitting arrangement (20, 30) and / or a receiving arrangement (20, 30), and wherein the drive device (2a, 2b, 2c, 2d, 11a, 11b, 11c, 11d) has piezoelectric drive elements which are directly connected to one of the spring elements in each case, or are part of one of the spring elements.

The application discloses a full-directional hydrophone, which comprises a hydrophone sensitive probe, a data acquisition module, a data storage module and a power management module, wherein the hydrophone sensitive probe comprises a spherical packaging shell, a ring-shaped PCB board, a front-stage signal processing circuit and a bidirectional micro-mechanical ultrasonic transducer; the bidirectional micro-mechanical ultrasonic transducer comprises a substrate, and the top surface and the bottom surface of the substrate are provided with symmetrically arranged insulating layers, lower electrode layers, device layers, vacuum cavities and upper electrode layers. The full-directional hydrophone has the advantages of scientific design, reasonable structure and good use effect, and achieves the purpose of having the same sensitivity to sound pressure signals within the 360-degree range of the plane where the hydrophone is located.

In an aspect, disclosed herein are a methods, systems and apparatus for modifying a component surface comprising, contacting the surface, with an laser beam, the surface comprising a semiconductor tool manufacturing component; modifying the surface responsive to the contacting, wherein the modifying the surface comprises forming, by micro-machining, etching, ablating, ionizing, anodizing, oxidizing, texturing, or roughening, or a combination thereof, a functional feature in the surface.

The invention relates to a method for operating a micromechanical rotation rate sensor having a sensor element as part of a vibratable structure and to a micromechanical rotation rate sensor having a sensor element as part of a vibratable structure, wherein: the micromechanical rotation rate sensor has a drive with a drive control circuit for driving a vibration of the vibratable structure in a drive direction on the basis of a drive voltage; the drive voltage and an offset voltage are applied to the vibratable structure in order to drive the vibration thereof; and the vibration amplitude of the vibratable structure is detected by means of the drive control circuit and is controlled by adjustment of the drive voltage.

A micromechanical device (1a), in particular a micromirror device, is proposed, which has at least a first micromechanical component (2a) and a second micromechanical component (3a). The first component (2a) and the second component (3a) are connected to one another directly or indirectly. The first micromechanical component (2a) has a first sub-body (4a) and at least one second sub-body (5a). The first sub-body (4a) extends in a first plane (20a) and the second sub-body (5a) extends in a second plane (21a), which is different from the first plane (20a). The first plane (20a) and the second plane (21a) extend parallel to one another and the first plane (20a) extends above the second plane (21a). Here, the second sub-body (5a) is arranged in a transition region to the second micromechanical component (3a). A second extension (26a) of the second sub-body (5a) in a longitudinal direction is greater than a first extension (25a) of the first sub-body (4a) in the longitudinal direction.