The invention belongs to the technical field of back contact cells, and particularly relates to a back contact
cell capable of reducing the thickness difference between an N-type region and a P-type region and preparation and application of the back contact
cell capable of reducing the thickness difference between the N-type region and the P-type region. Wherein the surface of one side, far away from the
crystalline silicon substrate, of the
amorphous silicon layer is provided with an N-type region and a P-type region which are alternately formed, the N-type region comprises an N-type doped base layer and an N-type
transition layer, and the P-type region comprises a P-type doped base layer and a P-type
transition layer; wherein the content ratio of
phosphorus to
silicon in the N-type doped base layer is smaller than 1, the content ratio of
phosphorus to
silicon in the N-type
transition layer is larger than 1, the content ratio of
boron to
silicon in the P-type doped base layer is smaller than 1, and the content ratio of
boron to silicon in the P-type transition layer is larger than 1. The vertical
contact resistance can be obviously reduced while the thickness difference between the N-type region and the P-type region is reduced, the
high cell conversion efficiency is obtained, the stability of the
cell is improved, and the service life of the cell is prolonged; meanwhile, the risk of film explosion in the subsequent process is reduced, and the edge compounding problem is relieved.