145 results about "Micromachinings" patented technology

The invention relates to the technical field of laser micromachining, in particular to a TGV drilling machining system and method based on a space-time modulation Bessel beam, an initial laser beam is output through a laser device, the initial laser beam is modulated into a dynamic pulse sequence through a pulse chirp regulation and control module, axial energy attenuation is compensated, a machining subsystem generates the Bessel beam, and the TGV drilling machining system and method based on the space-time modulation Bessel beam are obtained. The angle is finely adjusted in real time through piezoelectric driving, and a dynamic spatial light modulator loads an exponential decay type phase mask, so that light beam airspace shaping, non-diffraction light beam generation, pulse time sequence and phase parameter synchronous control and high-peak power pulse array are realized, and finally, integrated micro-perforation and channel modification of the glass substrate are realized; and the machining efficiency and precision are obviously improved.

The invention discloses a three-dimensional micro-nano multistage micro-channel structure and a preparation method thereof, and the channel structure comprises a substrate, a nano honeycomb layer located on the surface of the substrate, and a Tesla valve micro-channel and a micron fence member formed on the nano honeycomb layer. The micron fence piece is provided with a plurality of rib columns which are close to each other and are arranged along the side wall direction of the Tesla valve micro-channel; the high wicking capacity of the nano porous medium and the macroscopic fluid guiding capacity of the micron channels are organically combined, so that fluid can be rapidly transported in the multi-stage channels, the transporting capacity and the heat exchange efficiency of liquid are effectively improved, especially during boiling, the liquid supplementing rate and the steam discharging rate can reach dynamic balance, and the heat exchange efficiency of the liquid is improved. The friction loss of gas-liquid two-phase flow is reduced, and different thermal management requirements are met; in addition, according to the preparation method, nano-first and micro-second processing is adopted, high compatibility of the structure morphology and the material interface is achieved, good repeatability and process window are achieved, and the preparation method is suitable for large-area preparation and industrial production.

The invention relates to a Spin Exchange Relaxation-Free (SERF)-based magnetometer system (100) for detecting ultra- weak magnetic fields, particularly suited for bio¬ sensing applications such as MEG, MCG, and MRI. The system operates at room temperature and includes a VCSEL (101) emitting dual beams tuned to Rubidium-87 transitions, a microfabricated vapor cell (102) with LIAD-based heating (103), and an optical assembly (104) for polarization control. A detection unit (105) converts Faraday rotation into electrical signals, enhanced by lock-in amplification. Magnetic shielding (106), thermal management (107), and relaxation mitigation maintain SERF conditions. A calibration subsystem (109) and embedded machine learning module (110) optimize sensitivity in real time. The compact, cryogen-free architecture enables portable and wearable applications. The invention achieves femtotesla-level sensitivity while overcoming limitations of conventional SQUID-based systems, making it suitable for clinical and field deployments.

The embodiment of the invention discloses a cold cathode flat plate X-ray source capable of coding light emitting and a coding light emitting method, the ray source comprises a vacuum sealing cavity, a cathode assembly and an anode assembly, the cathode assembly and the anode assembly are arranged in the vacuum sealing cavity in a sealing manner, and the cathode assembly and the anode assembly are oppositely arranged at an interval; a vacuum working space for electron acceleration and X-ray generation is formed; the cathode assembly comprises a cathode substrate and a nano cold cathode electron source array arranged on the cathode substrate; the anode assembly comprises an anode substrate and a transmission anode target arranged on the anode substrate; wherein at least one of the nanometer cold cathode electron source array and the transmission anode target is in a coding state: when the nanometer cold cathode electron source array is in the coding state, the nanometer cold cathode electron source array comprises a micro-unit electron source array capable of independently addressing, and a preset coding pattern is formed; and when the transmission anode target is in a coding state, a metal coating with a preset coding pattern is formed on the surface of the anode substrate through a micromachining process so as to integrate a coding function.

Disclosed in the present invention is a method for forming a precise through-hole at high speed by using an infrared laser, wherein the method irradiates in turn single modulated Bessel beam onto a workpiece in a scanning fashion by means of a mirror structure with at least one driving unit coupled to form a laser scanning processing pattern that changes the characteristics of the workpiece by precisely micromachining the workpiece into various shapes or sizes at high speed, and then wet-etching the workpiece, such that the method not only enables laser-machining the workpiece at high speed by significantly reducing laser-machining time compared to conventional methods, but also improves productivity by reducing etching time.

The invention relates to the technical field of semiconductor packaging and micromachining, in particular to a defect-free electroplating filling method and system for a high-aspect-ratio glass through hole. The method comprises the following steps: preparing an ultrathin and compact copper seed composite layer with strong binding force on the inner wall of a glass through hole by adopting an atomic layer deposition (ALD) technology; preparing an electroplating solution containing a specific additive system; and implementing a segmented pulse electroplating strategy, and realizing defect-free copper filling from the bottom to the top of the through hole by regulating and controlling the current density, the pulse width and the intermittent time in stages and combining a reverse pulse technology. The system integrates ALD deposition, pulse electroplating and an electroplating liquid circulation system, and high precision and high yield in the filling process are ensured. The method effectively solves the problems of insufficient seed layer coverage, limited mass transfer, cavity / suture defects and the like in the filling of the glass through hole with the high depth-diameter ratio (greater than or equal to 20: 1), and is suitable for advanced packaging and manufacturing of large-size glass substrates (such as 510mm * 515mm).

The disclosure features a microfabricated implantable probe, the probe comprising (a) a semiconductor substrate microprobe body including a handling portion and an elongated shaft extending from the handling portion to a tip, the tip being configured for insertion into a target area of a subject mammal, (b) at least one pair of enzyme-functionalized sensing electrodes disposed on the shaft, (c) individually addressable conductive metallic leads extending for a specified distance from each sensing electrode to contact pads disposed on the handling portion, and (d) a polymeric separating layer configured to separate each sensing electrode in the pair of electrodes from the other sensing electrode. The disclosure also features methods of using the probe to detect neurochemicals.

The invention belongs to the technical field of acoustic lenses, and discloses a high-frequency vortex sound field lens which comprises a stainless steel sheet substrate, the center area of the substrate is a solid area, and a periodic spiral line hollow structure is formed on the periphery of the solid area through laser processing; the area where the spiral line hollow structure is located allows sound waves to pass without shielding, and the solid area blocks sound wave propagation. The ultra-short pulse laser micromachining technology is adopted, the spiral line hollowed-out structure with the screw pitch, the line width and the spiral angle strictly matched with the high-frequency sound wave wavelength can be accurately etched in the surface of the stainless steel sheet, the spiral phase gradient is accurately constructed through the acoustic impedance difference of hollowed-out area conduction-solid area blocking, and the spiral phase gradient is accurately measured. The problem of phase error amplification under high frequency is effectively suppressed, the orbital angular momentum transfer efficiency is improved to 90% or above, and stable generation of a high-frequency vortex sound field is successfully realized.

This application discloses a gas sensor and electronic device. The gas sensor includes a substrate, a micro-hot plate, and a microphone. At least one of the micro-hot plate and the microphone is disposed on the substrate. The micro-hot plate includes a heating element, and a thermoacoustic cavity is formed around the heating element. The microphone has a sensing cavity, with the sensing surface of the microphone facing the sensing cavity, and the sensing cavity communicating with the thermoacoustic cavity. The micro-hot plate also includes a first substrate and a heat insulation layer stacked together. The first substrate has a first through-hole, and the heating element is located within the heat insulation layer. Thus, the gas sensor of this embodiment, through the coordinated operation of the micro-hot plate and the microphone, can accurately detect the composition and concentration of gas using the thermoacoustic effect. Furthermore, it is fabricated using microfabrication technology, making it easy to integrate into various micro-devices and possessing broad application prospects.

The invention discloses a disc Mmyshev mode-locked laser, and belongs to the technical field of ultrafast laser. The disc Mmyshev mode-locked laser comprises a laser gain module, a first nonlinear medium, a second nonlinear medium, a first interference filter, a second interference filter, a dispersion compensation module, an output coupling mirror, a first concave reflecting mirror, a second concave reflecting mirror, a high reflecting mirror, a third concave reflecting mirror and a fourth concave reflecting mirror. According to the disc Mmyshev mode-locked laser, a Mmyshev filtering mechanism is introduced into the disc Mmyshev mode-locked laser, and mode-locked self-starting and ultra-short pulse output under the condition of high average power are achieved. The disc Mmyshev mode-locked laser does not need an SESAM or Kerr mode-locked medium, can obtain stable ultrashort pulses smaller than 100 femtoseconds, has high stability, self-starting, good beam quality and structural expandability, and is suitable for application fields such as precise micromachining and extreme ultraviolet lithography driving sources.

The application relates to the technical field of laser packages, in particular to an in-situ optical shaping VCSEL array integration method and an optical interconnection module, which comprises the following steps: S1, a quartz substrate is used, a femtosecond laser pulse is focused and scanned in the quartz substrate, and a three-dimensional profile of a micro hole is defined in advance; S2, a VCSEL chip is precisely placed into the micro hole in an array arrangement with the VCSEL chip facing upwards, and epoxy resin is cured by heating; S3, a metal layer is sputtered on the quartz substrate, and an electrical interconnection track is formed through photolithography; S4, a two-photon polymerization direct writing system is used to initiate two-photon polymerization of photoresist, solidification is realized, and the production of a polymer lens is completed. The application selects fused quartz glass as the only passive integrated substrate; the substrate has four characteristics of optical transparency, electrical insulation, thermal stability and three-dimensional micro machining at the same time, replaces the multilayer composite substrate in a traditional scheme at one time, and realizes the original integration design basis of an optical path, an electrical circuit and a thermal path.

The invention relates to a method for generating self-focusing by a Lorentz non-uniform correlation partially coherent pulse light source, which comprises the following steps of: firstly, by constructing a pulse light source with a Lorentz non-uniform time correlation structure, defining a time domain mutual coherence function of the pulse light source so as to represent pulse coherence characteristics; the mutual coherence function is based on the generalized Huygens-Fresnel principle, a mutual coherence function expression of the LNUC partially coherent pulse light source at the transmission distance z is deduced, and the coherence degree is in Lorentz distribution and has the non-uniform correlation characteristic. An average intensity expression is further obtained according to a mutual dry function expression, intensity distribution has a self-focusing phenomenon in evolution, and the characteristic has potential application value in the fields of pulse beam shaping and micromachining.

The embodiment of the application provides a kind of mixed inductive proximity sensor based on semiconductor process and its manufacturing method, mixed inductive proximity sensor includes: planar induction coil and electronic chip, planar induction coil is the copper coil structure formed on substrate by photoetching and plating process, planar induction coil is integrated with multiple concentric ring sub-coil, and multiple concentric ring sub-coil is used to measure the magnetic field gradient change caused by target object in section;Electronic chip is integrated with oscillator circuit, and oscillator circuit includes inductance branch with series positive and negative temperature coefficient resistance combination, capacitor branch with parallel adjustable resistance, and comparator unit with dynamic adjustment delay;The packaging structure of mixed inductive proximity sensor includes the substrate of electronic chip flip-chip interconnection through carrier plate, surface covers protective layer;The packaging pre-treatment of mixed inductive proximity sensor includes pad microprocessing, gas protection reflow soldering and composite glue buffer layer.

The invention discloses a construction method of a high-stability interdigital supercapacitor, and the method comprises the steps: firstly designing the interdigital supercapacitor, and obtaining an interdigital conductive substrate through micromachining; then synthesizing a conductive organic frame nano material with good conductivity, and combining with a conductive polymer PEDOT: PSS to construct a composite flexible nano frame composite layer; by optimizing modification conditions, the composite material is modified on an interdigital conductive substrate, and a novel interdigital supercapacitor is prepared. The result shows that the constructed interdigital supercapacitor still keeps high specific capacitance and high stability after tens of thousands of charging and discharging cycles under different current densities. Based on the high-stability interdigital supercapacitor, a platform for promoting the neural stem cells to differentiate into neurons based on in-situ electrical stimulation is subsequently established in the method: electrical stimulation is continuously and stably applied through the interdigital supercapacitor, so that the differentiation speed of the neural stem cells is remarkably increased; and an effective research tool is provided for research of a basic molecular mechanism of neurodegenerative diseases.

The utility model discloses a sound temperature optimization structure for a magnetic axis keyboard, which comprises a mainboard PCBA, lamp holes, positioning holes and circular holes, the inner side of the mainboard PCBA is provided with the lamp holes at equal intervals, the inner side of the mainboard PCBA is provided with the positioning holes at equal intervals, the inner side of the mainboard PCBA is provided with the circular holes at equal intervals, the diameter of the circular holes is 0.2 mm-8. 5mm, and the error is + / -0.1 mm; the opening depth of the circular opening is 0.2 mm to 1.5 mm, and the error is + / -0.1 mm; the hole position of the circular hole is located between two positioning holes in the main board PCBA; the hole position of the circular hole is located on the front face of the main board PCBA, namely the face making contact with a magnetic shaft, and the bottom of the circular hole cannot be opened. According to the sound temperature optimization structure for the magnetic axis keyboard, under the condition that the structure, the installation mode and material selection of an existing magnetic axis keyboard are not changed, fine machining is conducted on the main board PCBA, and therefore sound production and temperature influence of the magnetic axis keyboard are improved under the condition that the precision of the magnetic axis keyboard is not affected.

The application relates to the field of micro-electro-mechanical systems, and specifically discloses a micro-cantilever beam deformation correction method and system for MEMS sensor output errors, which comprises the following steps: exciting a composite vibration mode of a micro-cantilever beam through a multi-mode active excitation signal, collecting a dynamic response signal and identifying a deformation state parameter by using a deep learning model, generating laser micro-processing parameters based on the identification result to perform selective material removal or annealing treatment, establishing a deformation trend prediction model to perform pre-compensation adjustment, and ensuring the correction effect through a closed-loop verification mechanism; the system comprises a multi-mode active excitation control module, a dynamic response collection and processing module, a deformation identification and state evaluation module, a laser micro-processing control module, a deformation trend prediction and pre-compensation module, a correction effect verification and iterative control module, and a system integration and data management module. The application solves the problem of sensor errors caused by physical deformation of a micro-cantilever beam, and significantly improves the precision and long-term stability of a MEMS sensor.

The present invention addresses the problem of providing a photosensitive resin composition which has high micromachining properties and can yield a cured product having a low dielectric loss tangent. The main purpose of the present invention is to obtain a photosensitive resin composition which contains a polyimide resin, a cationic polymerizable compound and a cationic polymerization initiator and which is characterized in that the polyimide resin has a structure represented by formula (1) as a tetracarboxylic acid residue in all or some tetracarboxylic acid residues. (X moieties are each independently a single bond or a divalent linking group (in which the total number of carbon atoms is 10 or fewer). Y is a phenylene group, a naphthylene group, a group represented by formula (2) or a group represented by formula (4). ＊ denotes a bond to an amide group or a carbonyl group in an imide ring) (In formula (2) and formula (4), R1 and R2 each independently denote a monovalent hydrocarbon group having 1-10 carbon atoms, in which some hydrogen atoms may be substituted by halogen atoms, Z denotes a single bond or a divalent organic group having 1-20 carbon atoms, p and q each independently denote an integer between 0 and 4, and s denotes an integer that is 0 or 1. ＊ denotes a bond to X.)

A design method of a Gibbs-Wulff optical vortex array mask plate, steps are as follows: obtaining an electric field expression of a Gibbs-Wulff optical vortex array, combining the amplitude, phase of the Gibbs-Wulff optical vortex array with a blazed grating, obtaining a complex transmittance function of the Gibbs-Wulff optical vortex array mask plate, and the mask plate described based on the complex transmittance function is the Gibbs-Wulff optical vortex array mask plate. The present application utilizes the principle of computer holography, and obtains the amplitude modulation phase mask plate of the Gibbs-Wulff optical vortex array through computer coding, so that the Gibbs-Wulff optical vortex array with controllable boundary and controllable structure and arrangement mode in the boundary can be generated. Thus, the present application has important application value in the fields of particle manipulation and optical micro-machining.

The power relay has an actuator comprising a micro-electromechanical system stator assembly and a plunger assembly that moves along a central longitudinal axis between a first position and a second position, the plunger assembly comprising a plunger including a pair of ferromagnetic plates between which a magnet is located, the first of the pair of ferromagnetic plates being located between a first ferromagnetic layer and a second ferromagnetic layer of the stator assembly, and the second of the pair of ferromagnetic plates being located between a second ferromagnetic layer and a third ferromagnetic layer of the stator assembly. The contacts formed by the ferromagnetic plates and ferromagnetic layers may include an array of micro-machined bends or stabilized liquid-solid electrical contacts.

The utility model relates to the technical field of bioengineering, and provides an array chip integrating impedance measurement and microscopic observation, which comprises a transparent substrate, a circuit board, a 3D printing board and an electrode unit, and one side of the transparent substrate is provided with a conductive film; the circuit board is arranged on the conductive film, and a plurality of micro-channels are arranged on the circuit board in an array manner; the 3D printing plate is arranged on the side, away from the conductive film, of the circuit board, a plurality of micro-cavities are arranged on the 3D printing plate in an array mode, and the positions of the micro-cavities correspond to the positions of the micro-channels one to one; the electrode unit comprises a first electrode plate and a second electrode plate, the 3D printing plate is covered with the first electrode plate, the circuit board is surrounded by the second electrode plate, and the second electrode plate and the first electrode plate form a closed loop through a conductive film. Through innovative fusion of micromachining and bioelectrochemistry, synchronization of electrophysiology (impedance) and morphology (microscopy) is realized, and the dynamic growth process of organisms is conveniently and continuously monitored.

The present application relates to a resonator and an electronic device. A high and low acoustic impedance alternating layer, a bottom temperature coefficient of frequency compensation layer, a bottom electrode layer, a piezoelectric layer, a top electrode layer and a top temperature coefficient of frequency compensation layer are sequentially stacked on a substrate by using a specific microfabrication process, to form a new resonator. The resonator can simultaneously show excellent characteristics of low loss, wide bandwidth, low temperature sensitivity and a small size through the special stack geometry, thereby having better operation reliability.

The application discloses a double-emission-direction Micro-LED structure and a preparation method thereof. x Ga 1‑x N triangular island, a quantum well layer, a P-type layer, an electrode and other functional layers. The application utilizes selective epitaxy and combines lateral epitaxy to obtain an N-type In x Ga 1‑x N triangular island with high symmetry, and grows an LED epitaxial layer on two symmetrical inclined surfaces of the triangular island, so that the double-emission-direction Micro-LED structure is formed, and the double-emission-direction Micro-LED structure can be used as a basic display unit of near-eye naked-eye three-dimensional display. Meanwhile, the independent epitaxial LED structure is grown on the inclined surfaces of the triangular island, so that the adverse effects caused by etching damage of the quantum well and the P-type layer in the traditional micro-processing technology can be avoided, the edge effect of each light-emitting unit is effectively inhibited, and the light-emitting efficiency is improved. The light-emitting units are arranged on the basis of close packing, so that the area of the epitaxial wafer can be effectively utilized to the maximum extent, and economic benefits are maximized.

Systems and methods are disclosed for overcoming technical challenges associated with machining and manufacturing printed circuit boards. In some embodiments, these systems and methods include processes for removing or reducing defects in initially fabricated printed circuit board (PCB) traces. Exemplary methods include processes for removing or reducing burrs in laser-micromachined PCB traces, which may be electrically isolated from one another. In some cases, a material is deposited on the PCB traces, forming a conductive layer that electrically connects all or most of the PCB traces and provides the electrical connection to remove or reduce defects in the PCB traces.

Thin films for developing array patterns and processes for their manufacture. The present invention relates to thin films for developing array patterns and processes for their manufacture. The thin films of the present invention have strong adhesion, improved oxidation resistance, etch compatibility with standard microfabrication techniques, and excellent electrical conductivity. Furthermore, the thin films of the present invention are stable at high temperatures in oxygen. Furthermore, the present invention relates to a simple and economical process for manufacturing thin films for developing array patterns.

The utility model belongs to the technical field of laser cutting, and particularly provides a rotary cutting device for laser drilling, which comprises a window mirror, a rotary driving part and an angle adjusting part, the rotary driving part is used for driving the window mirror to rotate around the optical axis of incident light; the angle adjusting piece is used for adjusting the included angle between the window mirror and the optical axis of incident light. According to the rotary cutting device for laser drilling, the inclination angle and the rotating speed of the window mirror are adjusted, the incident angle of a laser beam irradiating the metal surface and the rotating angle of the laser beam around the rotating shaft are changed, drilling is carried out layer by layer, drilling and micromachining of a three-dimensional complex component can be achieved, and the production efficiency is improved. The micro-hole with high depth-diameter ratio (greater than or equal to 10: 1), high processing quality, zero cone and even inverted cone is obtained, and the problems of large upper and lower aperture difference and large taper of the drilled hole are solved.

The invention discloses a nanosecond laser precision machining method for a SiCf / SiC composite material, and belongs to the field of laser machining and advanced composite material manufacturing. The method comprises the following steps: carrying out linear ablation or surface ablation on a pretreated SiCf / SiC composite material by adopting nanosecond pulse laser with the wavelength of 355 nm; the laser energy density, the scanning speed, the scanning times, the line overlapping ratio and the scanning path are optimized through the system, and high-precision and low-damage machining is achieved. The core optimization parameters are as follows: the laser energy density is 5.33 J / cm < 2 >, the scanning speed is 200mm / s, the line overlapping rate is 66.58%, and a one-way scanning mode is adopted. Through the combination of experiments and simulation, the mechanism (melting, evaporation, decomposition, and material removal by liquid drop splashing and gas volatilization) of nanosecond laser ablation of SiCf / SiC is disclosed, the heat affected zone, the oxidation phenomenon and the recondensate defect are effectively controlled, the quality and the contour precision of the machined surface are remarkably improved, and the machining precision is improved. The method is suitable for micromachining of key components such as aerospace engine hot end components and medical high-end equipment.

Packaging of microfabricated devices, such as integrated circuits, microelectromechanical systems (MEMS), or sensor devices is described. The packaging is 3D heterogeneous packaging in at least some embodiments. The 3D heterogeneous packaging includes an interposer. The interposer includes stress relief platforms. Thus, stresses originating in the packaging do not propagate to the packaged device. A stress isolation platform is an example of a stress relief feature. A stress isolation platform includes a portion of an interposer coupled to the remainder of the interposer via stress isolation suspensions. Stress isolation suspensions can be formed by etching trenches through the interposer.

The invention is suitable for the technical field of display devices, and provides an electrochromic display device based on patterning modification of a working electrode and a preparation method, the electrochromic display device comprises a first transparent base layer, a first transparent conductive layer, an Ag + gel electrolyte layer, a patterning modification working electrode and a second transparent base layer from bottom to top; wherein the patterned modified working electrode is composed of a second transparent conductive layer and a platinum patterned modified layer selectively deposited on the surface of the second transparent conductive layer. According to the invention, Ag deposition is changed from random island-shaped growth to uniform film growth by utilizing Pt modification, so that mottle appearance of a traditional device is thoroughly eliminated, and coloring uniformity is good; the response speed is greatly improved; the display content can be defined only by one-time mask sputtering, the process is extremely simple and is compatible with a large-area roll-to-roll production process, and the cost is reduced in order of magnitude compared with that of a traditional TFT micromachining scheme; the ultra-low-cost patterned display is realized, and a new application of the electrochromic technology in the field of low-cost, disposable or repeatable writing electronic tags is developed.

This invention discloses a pneumatic micro-transport device, including an air compressor connected to a pneumatic solenoid valve via an air pump pipe. The pneumatic solenoid valve is connected to a microcontroller via a relay, and the microcontroller is connected to a LabVIEW host computer via a USB interface. The pneumatic solenoid valve is also connected to a micro-transport array via the air pump pipe, and a transport plate is placed above the micro-transport array. This device is designed based on pneumatic principles. Compared to traditional contact-type transport devices, its transport method avoids failures caused by friction-induced wear. Furthermore, thanks to its non-contact transport characteristics, its application range is further expanded. It employs deep silicon etching micromachining technology, with the silicon plate structure serving as the air chamber channel and nozzle of the micro-transport device, significantly reducing the structural size of the micro-transport device, improving space utilization, and solving problems such as low integration in traditional micro-transport devices.

A method and apparatus are provided for localization of a region of interest with a fluorescent entity inside a sample and for micromachining the sample in an integral fluorescence microscope / charged particle beam apparatus. The optics of the fluorescence microscope for imaging the sample onto a detector comprises an astigmatic optical component. The method comprises the steps of: determining a position of a focal plane of the fluorescence microscope with respect to a reference plane in the integral apparatus; obtaining an image of the fluorescent entity in the sample using the fluorescence microscope; determining a position of the fluorescent entity with respect to a focal plane of the fluorescence microscope, by evaluation of a degree of astigmatism and / or an ellipticity of a fluorescence intensity profile of the image of the fluorescent entity; and micromachining the sample around the determined position using a charged particle beam.