806 results about "Micromachinings" patented technology

A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped.

A micromachined ultrasonic transducer array that focuses in the elevation direction. A curved lens is used to narrow the beam width in the elevation direction so that contrast resolution is improved and clinically relevant. Alternatively, a curved probe is formed by bending a micromachined substrate to have a predetermined curvature. The invention is further directed to methods of manufacturing such transducers.

A curved sensor device, such as an ultrasonic transducer array, is fabricated from a flat micromachined sensor (such as cMUT or pMUT) array constructed using micromachined electromechanical systems (MEMS) techniques. The device comprises: a support structure comprising a spine having a profile that is generally curved and a multiplicity of teeth extending from one side of the curved spine; and a multiplicity of sensors built on the support structure. The spine can be bent forward or backward and attached to a curved front face of a support member, thereby causing the sensors to adopt a curved array.

The invention discloses a transparent conducting electrode using a graphene film as a GaN-based LED (light-emitting diode) or ultraviolet light detector and a manufacture method and applications thereof. The graphene film is solidified and bonded on the surface of the GaN substrate of the LED or ultraviolet light detector. The transparent graphene conducting film is prepared by adopting a chemical vapor deposition or reduction-oxidation method, and the GaN-based LED or ultraviolet light detector is manufactured by utilizing a micromachining photoetching, etching and metal deposition method; the graphene film is moved to the p-type GaN-based substrate of the LED or ultraviolet light detector to serve as the transparent conducting electrode instead of ITO or Ni/Au. In the invention, the graphene film is used as the transparent conducting electrode, which can realize low-cost and high-brightness luminescent devices and expands the applications of carbon nanometer materials in the field of GaN-based photoelectric devices.

Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.

A method for tuning an electro-mechanical device such as a MEMS device is disclosed. The method comprises operating a MEMS device in a depressurized system and using FIB micromachining to remove a portion of the MEMS device. Additionally, a method for tuning a plurality of MEMS devices by depositing an active layer and then removing a portion of the active layer using FIB micromachining. Also, a method for tuning a MEMS device and vacuum packaging the MEMS device in situ are provided.

The present invention deals with optical systems for providing short laser pulses. An object of the invention is to provide an optical system providing compact and cost-effective short laser-pulses using fibers with anomalous dispersion and high non-linear thresholds. The object is achieved by a short pulse optical system for generating or processing short laser-pulses, said optical system comprises an optical fiber in the form of a photonic crystal fiber arranged to provide guidance of light in the core region due to the photonic bandgap effect (PBG), where light propagates in a hollow or solid core surrounded by a Silica cladding comprising a substantially periodic distribution of micro-structural elements, and where the refractive index of the core is lower than the effective refractive index of the cladding. The invention may be useful in applications such as laser-based micromachining, thin-film formation, laser cleaning, in medicine and biology.

The present disclosure pertains to our discovery of a particularly efficient method for etching a multi-part cavity in a substrate. The method provides for first etching a shaped opening, depositing a protective layer over at least a portion of the inner surface of the shaped opening, and then etching a shaped cavity directly beneath and in continuous communication with the shaped opening. The protective layer protects the etch profile of the shaped opening during etching of the shaped cavity, so that the shaped opening and the shaped cavity can be etched to have different shapes, if desired. In particular embodiments of the method of the invention, lateral etch barrier layers and/or implanted etch stops are also used to direct the etching process. The method of the invention can be applied to any application where it is necessary or desirable to provide a shaped opening and an underlying shaped cavity having varying shapes. The method is also useful whenever it is necessary to maintain tight control over the dimensions of the shaped opening.

Yaw rate sensors are provided, the use of which permits quantitative measurement of yaw rate. The yaw rate sensor comprises at least a base, a first suspension and a second suspension with a proof mass supported between the two suspensions, which together form a resonator. The first suspension has a pair of thin-wire driving electrodes double side patterned on the surfaces. When a driving voltage is applied to the driving electrodes, it imposes an electric field to piezoelectrically induce a driving resonance. When the sensor is rotated around its sensing axis, the resonator will be forced to generate a sensing resonance out of the driving resonance plane to compensate the change in the linear momentum which must be conserved. The piezoelectric charge signal generated by the sensing resonance on the sensing electrodes which are double side patterned on the surfaces of the second suspension is used to detect the yaw rate. Specifically, the amplitude of the sensing resonance is in proportion to the yaw rate. The structure of the yaw rate sensors of this invention is suitable for mass production by lithographic micromachining techniques at low cost.

A variable capacitor device using MEMS or micromachining techniques wherein thin-films of materials are deposited, patterned and etched to form movable micromechanical elements on the surface of a substrate composed of either semiconductor, glass, metal, or ceramic material. In one embodiment of the present invention to achieve higher frequency performance as well as other benefits, the substrate is comprised of Low-Temperature Co-Fired Ceramics (LTCC). The variable capacitor is an electrostatically actuated micromechanical device and if fabricated on a LTCC multi-layered substrate material has continuous electrical connections through the layers. The same LTCC substrate material can also be used to enclose the device by selectively removing a portion of the upper substrate so as to form a cavity. The two substrates are then bonded together to enclose and protect the variable capacitor. An integrated circuit can be incorporation onto the multi-level substrate structure to enable a electronic closed-loop controlled variable capacitor module. The integrated circuit is flip-chip bonded at the bottom of the substrate structure with appropriate electrical connections between the integrated circuit and the MEMS variable capacitor device. A variation of the present invention utilizes a zipper actuation method wherein the tuning ratio of the variable capacitor is increased to very high levels. Yet another variation of the present invention utilizes a differential gap between the top and bottom electrodes such that the actuation electrodes do not physically contact one another. Yet another implementation of the present invention uses an extra set of electrodes or mechanical mechanism so as to lock the value of the capacitor indefinitely. Yet another implementation uses shaped actuation electrodes so as to linearize the relationship between the applied actuation voltage and the resultant capacitance of the device.

The thermoelectric detector consists of an absorber structure supported by two electrically connected beams made of thermoelectric materials such as polysilicon, polysilicon/germanium, bismuth-telluride, skutterrides, superlattice structures, nano-composites and other materials. One end of the thermoelectric beam connects to the absorber structure; the other end connects to the substrate. Infrared radiation incident on the absorber heats up the absorber, resulting in a temperature gradient along the length of the thermoelectric legs, and generating an electrical voltage. The detector arrays are fabricated using micromachining process. The absorber structure is formed over a sacrificial material that is removed at the end of the processing, leaving the detector suspended and thermally isolated. The sacrificial processing method enables the production of small pixel thermoelectric detectors in large two-dimensional arrays with high sensitivity.

A microscale cylindrical ion trap, having an inner radius of order one micron, can be fabricated using surface micromachining techniques and materials known to the integrated circuits manufacturing and microelectromechanical systems industries. Micromachining methods enable batch fabrication, reduced manufacturing costs, dimensional and positional precision, and monolithic integration of massive arrays of ion traps with microscale ion generation and detection devices. Massive arraying enables the microscale cylindrical ion trap to retain the resolution, sensitivity, and mass range advantages necessary for high chemical selectivity. The microscale CIT has a reduced ion mean free path, allowing operation at higher pressures with less expensive and less bulky vacuum pumping system, and with lower battery power than conventional- and miniature-sized ion traps. The reduced electrode voltage enables integration of the microscale cylindrical ion trap with on-chip integrated circuit-based rf operation and detection electronics (i.e., cell phone electronics). Therefore, the full performance advantages of microscale cylindrical ion traps can be realized in truly field portable, handheld microanalysis systems.

The invention provides a multifunctional integrated microfluidic nucleic acid analysis chip. The chip is prepared by preparing a combination mould according to 3D printing or micromachining technology, generating a microfluidic substrate according to an injection moulding method, and completing bonding of multiple layers including a chip substrate, a liquid circuit layer, an elastic film, a gas circuit layer and the like by means of plasma cleaning to finally obtain the complete chip. The chip integrates various structures including reagent cavities, mixing cavities, a splitting cavity, a DNA (deoxyribonucleic acid) extraction cavity, amplification reaction cavities, a microvalve, a microchannel and the like and has functions of sample loading, reagent mixing, heating for splitting, DNA adsorption, cleaning, eluting, amplification reaction and the like. The multifunctional integrated microfluidic nucleic acid analysis chip has the advantages that totally-closed automatic operation of 'sample input-result output' is realized, complicated manual operations are avoided, and detection efficiency is improved.

A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.

A laser processing system provides a burst of ultrafast laser pulses having a selectively shaped burst envelope. A burst pulse laser includes a high repetition rate ultrafast laser to deliver a pulse train with each pulse in the train having an independently controlled amplitude. The respective amplitudes of each ultrafast pulse in a group define a “burst envelope.” In addition to independently controlling the amplitude of each ultrafast pulse within the burst envelope, the system may also provide selective control of spacing between each ultrafast pulse and/or the overall temporal width of the burst envelope. Thus, the system provides selective shaping of the burst envelope for particular laser processing applications.

A method is described for laser scribing or dicing portions of a workpiece using multi-source laser systems. In one embodiment, a first laser melts portions of the workpiece prior to a second laser ablating the portions of the workpiece.

Normal cells, such as fibroblasts or other tissue or organ cell types, are genetically engineered to express biologically active, therapeutic agents, such as proteins that are normally produced in small amounts, for example, MIS, or other members of the TGF-beta family Herceptin(TM), interferons, andanti-angiogenic factors. These cells are seeded into a matrix for implantation into the patient to be treated. Cells may also be engineered to include a lethal gene, so that implanted cells can be destroyed once treatment is completed. Cells can be implanted in a variety of different matrices. In a preferred embodiment, these matrices are implantable and biodegradable over a period of time equal to or less than the expected period of treatment, when cells engraft to form a functional tissue producing the desired biologically active agent. Implantation may be ectopic or in some cases orthotopic. Representative cell types include tissue specific cells, progenitor cells, and stem cells. Matrices can be formed of synthetic or natural materials, by chemical coupling at the time of implantation, using standard techniques for formation of fibrous matrices from polymeric fibers, and using micromachining or microfabrication techniques. These devices and strategies are used as delivery systems via standard or minimally invasive implantation techniques for any number of parenterally deliverable recombinant proteins, particularly those that are difficult to produce in large amounts and/or active forms using conventional methods of purification, for the treatment of a variety of conditions that produce abnormal growth, including treatment of malignant and benign neoplasias, vascular malformations (hemangiomas), inflammatory conditions, keloid formation, abdominal or plural adhesions, endometriosis, congenital or endocrine abnormalities, and other conditions that can produce abnormal growth such as infection. Efficacy of treatment with the therapeutic biologicals is detected by determining specific criteria, for example, cessation of cell proliferation, regression of abnormal tissue, or cell death, or expression of genes or proteins reflecting the above.

A subwavelength terahertz (THz) switch using an artificially designed conductor metamaterial is discussed in this invention. Theoretically, slow-light EM wave propagating at THz speed imitates the strongly localized surface plasmon modes and henceforth is called Spoof Surface Plasmon Polariton (SSPP) mode in this invention. The SSPP mode of slow-light EM propagation can be easily tailored by changing the refractive index of the dielectric materials inside the metallic gap structure engineered as a periodic array of grooves. Thus, the incorporation of electro-optical material which has birefringence such as a nematic liquid crystal (N-LC) or multiple-refractive indices into the metallic gap leads to a highly compact and efficient terahertz switch being controlled by a low-voltage signal. The optimal design of the SSPP switch enabled by this novel method shows many interesting properties including 1) strong subwavelength localization; 2) relatively high extinction (On/Off switching) ratio; and 3) small damping attenuation. The THz dynamic switches can be used to construct linear switches, Y junction switches and Mach-Zehnder interferometers by using micromachining and other fabrication techniques.

A TeraMOS sensor based on a CMOS-SOI-MEMS transistor, thermally isolated by the MEMS post-processing, designed specifically for the detection of THz radiation which may be directly integrated with the CMOS-SOI readout circuitry, in order to achieve a breakthrough in performance and cost. The TeraMOS sensor provides a low-cost, high performance THz passive or active imaging system (roughly in the range of 0.5-1.5 THz) by combining several leading technologies: Complementary Metal Oxide Semiconductor (CMOS)-Silicon on Insulator (SOI), Micro Electro Mechanical Systems (MEMS) and photonics. An array of TeraMOS sensors, integrated with readout circuitry and driving and supporting circuitry provides a monolithic focal plane array or imager. This imager is designed in a commercial CMOS-SOI Fab and the MEMS micromachining is provided as post-processing step in order to reduce cost. Thus the CMOS transistors and technology provide the sensors as well as the signal processing and additional readout circuitry both in the pixels as well as around the sensor array.

Described herein is a process for fabricating microfluidic systems with embedded components in which micron-scale features are molded into the polymeric material polydimethylsiloxane (PDMS). Micromachining is used to create a mold master and the liquid precursors for PDMS are poured over the mold and allowed to cure. The PDMS is then removed form the mold and bonded to another material such as PDMS, glass, or silicon after a simple surface preparation step to form sealed microchannels.