21 results about "Micro fabrication" patented technology

Techniques are provided for calibrating thermal annealing processes (e.g., laser annealing) using microfabricated resistance temperature sensors. For example, a device comprises a substrate, and a resistance temperature sensor disposed on the substrate. The resistance temperature sensor comprises a stack of alternating metal layers of a first metal and a second metal, wherein the first metal and the second metal are different types of metals.

The utility model discloses a kind of worm processing comprehensive machine tools, including bed, the upper surface both sides of bed are fixedly installed with two symmetrical distribution primary bearing seat, one number screw rod is rotatably connected between two primary bearing seats, the outer thread of one number screw rod is connected with horizontal slide, the output shaft of one number motor is fixedly connected to one end of one number screw rod, symmetrically distributed secondary bearing seat is fixedly installed in the front and back two ends of horizontal slide, two secondary bearing seats are rotatably connected with two number screw rod, two number screw rod and one number screw rod are perpendicularly arranged between each other, the outer thread of two number screw rod is connected with longitudinal slide, the output shaft of two number motor is fixedly connected to one end of two number screw rod, equipment seat is fixedly installed on the upper surface of longitudinal slide, the machine tool of the utility model whole structure is simple, floor area is small, manufacturing difficulty is low, effectively reduce the enterprise's early purchase and later use cost, with good use economy, suitable for small and micro manufacturing enterprises development use.

A method for microfabrication of a three-dimensional transistor stack with a gate-all-around field-effect transistor device. Channels are suspended between source and drain regions. Each channel is selectively deposited with a material layer designed to adjust the threshold voltage of the channel. These layers can be oxides, high-k materials, work function materials, and metallizations. The three-dimensional transistor stack forms an array of high-threshold-voltage devices and low-threshold-voltage devices in a single package.

Battery component structures and manufacturing methods for solid-state battery cells include a unitary Li ion conducting sulfide glass solid electrolyte structure that serves as the basic building block around which a solid-state battery cell can be fabricated. The unitary glass structure approach can leverage precision controlled high throughput processes from the semiconductor industry that have been inventively modified as disclosed herein for processing a sulfide glass solid electrolyte substrate into a unitary Li ion conducting glass structure, for example, by using etching and lithographic photoresist formulations and methods. The glass substrate may be precision engineered to effectuate a dense glass portion and a porous glass portion that can be characterized as sublayers having predetermined thicknesses. The porous glass sublayer includes a plurality of discrete substantially vertical closed-end holes or trenches that are precision engineered into one or both major substrate surfaces using microfabrication processes.

Disclosed herein is an implantable or wearable, flexible, miniaturized microimaging suited for localized brain fluorescent imaging. The microimaging device is implemented on a Parylene photonics platform, which is biocompatible and fabricated using scalable planar microfabrication techniques, enabling customizable design, size, and number of channels (pixels). Operating across the entire visible spectrum. The microimaging device functions effectively both for coherent and scattered light. The microimaging device can be implanted into the brain of freely moving animals, where one or more waveguides could be dedicated to light delivery and the rest of the waveguides for collecting and relaying the fluorescent image to image the tissue structure and function.

Information handling systems are transported to a selected of plural micro manufacturing centers for harvesting of component modules to reuse in remanufactured information handling systems through an automated process that uses a robotic arm to harvest the component modules and rebuild the information handling systems. Component module health lifecycle information is applied to select components for harvesting. Carbon footprint, energy consumption, costs, any manual labor involved and time criticality are factored to select a geographical location to harvest the component modules and to send the system to subsequent end user locations.

Techniques are provided for calibrating thermal annealing processes (e.g., laser annealing) using microfabricated resistance temperature sensors. For example, a device comprises a substrate, and a resistance temperature sensor disposed on the substrate. The resistance temperature sensor comprises a stack of alternating metal layers of a first metal and a second metal, wherein the first metal and the second metal are different types of metals.

The present application provides a method and system for automated inspection of a microfabricated feature on a substrate. The disclosure utilizes manipulating laser polarization in combination with the excitation and emission process, in inspection applications. The application specifically discloses selecting the polarization of the laser light by adjusting a polarization manipulator or a quarter-waveplate and / or a half waveplate between the laser source and the substrate to impart polarization to the laser light. The polarization impacts using a polarization selected to improve fluorescence emission of certain features on a substrate. The selection can be made prior to run time or dynamically during the inspection tool runtime. If the polarization is not specifically selected, then the microfabricated features may not emit much fluorescence.

The application provides a monolithic integrated multifunctional composite sensor and a preparation method thereof, and adopts single-silicon single-surface silicon microfabrication technology to predefine and cover a first micro groove of a gas flow sensing unit, to form a pressure reference cavity and a pressure sensitive diaphragm first, to predefine a single-crystal silicon thermocouple arm and a heating resistor pattern through the first micro groove and a side wall protection, to protect the pressure sensing unit through a heat insulation medium layer, to form a heat insulation cavity and a temperature sensing unit, to finally realize integration of the gas flow sensing unit, the pressure sensing unit and the temperature sensing unit on the same monolithic wafer, and to realize the structure of the heat insulation cavity and the pressure reference cavity in the same single-crystal silicon substrate. The method replaces traditional double-sided processing technology, solves the problem that a traditional composite chip is difficult to realize small size, avoids a complex process caused by a traditional silicon-silicon or silicon-glass bonding structure, greatly reduces process difficulty and cost, improves the yield of the composite chip, and improves the reliability of the sensor.

The present disclosure provides a metal microprobe array and an electroforming method thereof, and relates to the technical field of microfabrication, and comprises the following steps: constructing a photocured resin mask model with a microprobe cavity; preparing a photocured resin mask; placing the photocured resin mask into a dopamine mixed solution to form a self-assembled polydopamine molecular layer on the surface of the photocured resin mask, thereby obtaining a photocured resin mask with surface hydrophilicity; adhering the photocured resin mask with surface hydrophilicity to a metal substrate by mechanical bonding, and using the photocured resin mask as an assembled cathode for electrodeposition; immersing the assembled cathode into an electroforming solution as a cathode for vacuum boiling electrodeposition; when the microprobe array is filled with metal and fills the cavity of the photocured resin mask with surface hydrophilicity, removing the cathode to obtain a filled photocured resin mask; and performing high-temperature ashing treatment on the filled photocured resin mask, and then performing ultrasonic cleaning to obtain a metal microprobe array. The present disclosure can improve the preparation efficiency of the metal microprobe array.

The present application provides a method and system for automated inspection of a microfabricated feature on a substrate. The disclosure utilizes manipulating laser polarization in combination with the excitation and emission process, in inspection applications. The application specifically discloses selecting the polarization of the laser light by adjusting a polarization manipulator or a quarter- waveplate and / or a half waveplate between the laser source and the substrate to impart polarization to the laser light. The polarization impacts using a polarization selected to improve fluorescence emission of certain features on a substrate. The selection can be made prior to run time or dynamically during the inspection tool runtime. If the polarization is not specifically selected, then the microfabricated features may not emit much fluorescence.

A low-cost high-pressure cell to facilitate effective analysis of sample materials with high energy photon and electron beams. In one example, the cell includes a first micro-fabricated semiconductor substrate having a first membrane of a micro-fabricated material formed thereon and including a first membrane-covered region, and a second micro-fabricated semiconductor substrate having a second membrane of the micro-fabricated material formed thereon and including a second membrane-covered region, the first and second micro-fabricated semiconductor substrates being bonded together such that the first and second membrane-covered regions are at least partially aligned. The first and second membrane-covered regions may be separated by at least one spacer layer such that a cavity is formed between the membranes, the cavity being bounded on at least one side by one of membranes. Access to the cavity may be provided by micro-fabricated trenches cut into at least one of the first and second micro-fabricated semiconductor substrates.

The application discloses a quantum sensor chip packaging structure capable of realizing wafer-level planar co-packaging, which comprises a microfabricated atomic cell, a light source chip assembly and a light detection chip assembly, the microfabricated atomic cell is integrated with a reflecting element, the reflecting element is used for adjusting the optical path of the light beam entering the microfabricated atomic cell, the microfabricated atomic cell, the light source chip assembly and the light detection chip assembly are supported on a packaging substrate through a micro-bump assembly and are directly electrically interconnected with the packaging substrate through the micro-bump assembly, the micro-bump assembly comprises a plurality of micro-bumps, the distribution mode of the micro-bumps is for the purpose of realizing the supporting function and the electrical interconnection, the size of the micro-bump supporting the microfabricated atomic cell, the light source chip assembly and / or the light detection chip assembly is adjustable, the optical path of the microfabricated atomic cell is regulated by adopting the combination of micro-bumps with different sizes, and the planar co-packaging of the microfabricated atomic cell and other key quantum sensor components can be realized.

The invention provides a metal microprobe array and an electroforming method thereof, and relates to the technical field of micro-manufacturing forming, and the electroforming method comprises the following steps: constructing a light-cured resin mask model with a microprobe cavity, and preparing a light-cured resin mask; putting a light-cured resin mask into the dopamine mixed solution, and forming a self-assembled polydopamine molecular layer on the surface of the light-cured resin mask to prepare a light-cured resin mask with surface hydrophilicity; a light-cured resin mask with surface hydrophilicity is attached to a metal substrate in a mechanical combination mode to serve as an assembling cathode for electro-deposition; immersing the assembled cathode serving as a cathode into the electroforming solution for vacuum boiling electrodeposition, and removing the cathode to obtain a filled light-cured resin mask when a cavity of the light-cured resin mask with surface hydrophilicity is filled with microprobe array metal; and carrying out high-temperature ashing treatment on the filled light-cured resin mask, and carrying out ultrasonic cleaning to obtain the metal microprobe array. According to the invention, the preparation efficiency of the metal microprobe array can be improved.

The antibacterial nanostructured substrate comprises a substrate plate and a nanostructure composite. The nanostructure composite is formed on the first surface of the substrate plate and includes multiple first nanostructure bodies and multiple second nanostructure bodies that are adjacently arranged in intervals. The first nanostructure bodies and the second nanostructure bodies are periodically arranged, with the center position of each first nanostructure body defined as a first reference point and the center position of each second nanostructure body defined as a second reference point. The first nanostructure bodies are arranged corresponding to the center position of the second nanostructure bodies. The first reference point has a first displacement and a second displacement relative to the second reference point. A method of manufacturing the antibacterial nanostructured substrate is provided to form nanostructure composite on the substrate plate using a microfabrication process.

A method for fabricating a bridge structure in a quantum mechanical device, comprising: providing a substructure comprising a substrate having a layer of a first superconducting material deposited thereon, the layer of the first superconducting material being divided into a first portion, a second portion, and a third portion that are electrically insulated from one another; depositing a sacrificial layer on the substructure; electrically connecting the first portion and the second portion with a strip of a second superconducting material, the second superconducting material being different from the first superconducting material; and removing a portion of the sacrificial layer to form a bridging structure over the third portion between the first portion and the second portion, the bridging structure electrically connecting the first portion to the second portion without electrically connecting the third portion to the first portion and without electrically connecting the third portion to the second portion.

Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device, includes micro-LEDs, micro-LED isolation structures, a transparent material, and an isolation substrate. The micro- LEDs are disposed over a backplane. Each micro-LED is coupled to at least one backplane electrode of the backplane. The micro-LED isolation structures are disposed over the backplane. Each micro-LED isolation structure is disposed between the at least one backplane electrode of adjacent micro-LEDs. The transparent material is disposed over the backplane between backplane electrodes, between the micro-LEDs, and over an emitting surface of each of the micro-LEDs. The isolation substrate has subpixel isolation (SI) structures disposed therein. The SI structures define wells of subpixels. The subpixels have a color conversion material disposed in wells and on the isolation substrate. The transparent material is between the color conversion materials.

A method of planarizing a substrate includes receiving a substrate having microfabricated structures of varying height on a working surface of the substrate defining an uneven topography; depositing a first layer including a solubility-altering agent on the working surface of the substrate in an uneven manner by spin-on deposition; exposing the first layer to a first pattern of actinic radiation based on the topography; developing the first layer using a predetermined solvent; and depositing a second layer on the working surface of the substrate, the second layer having a greater planarity than the first layer prior to developing the first layer. The first radiation pattern alters the solubility of the first layer such that upper regions of the uneven topography of the first layer are soluble in the predetermined solvent.

Provided herein are methods and apparatus for fabricating a semiconducting substrate using a template layer to form a film of molybdenum having a low resistance attributed to the large size of its internal crystalline grains. The method and apparatus described herein may be used to fabricate molybdenum lines or interconnects in an integrated circuit. Fabricated molybdenum lines may be robust against oxidative damage during air break and downstream processing and be able to maintain low resistance. The method may be used to deposit molybdenum to fill features as a liner layer and / or fill features.