15 results about "Micro fabrication" patented technology

Techniques are provided for calibrating thermal annealing processes (e.g., laser annealing) using microfabricated resistance temperature sensors. For example, a device comprises a substrate, and a resistance temperature sensor disposed on the substrate. The resistance temperature sensor comprises a stack of alternating metal layers of a first metal and a second metal, wherein the first metal and the second metal are different types of metals.

The utility model discloses a kind of worm processing comprehensive machine tools, including bed, the upper surface both sides of bed are fixedly installed with two symmetrical distribution primary bearing seat, one number screw rod is rotatably connected between two primary bearing seats, the outer thread of one number screw rod is connected with horizontal slide, the output shaft of one number motor is fixedly connected to one end of one number screw rod, symmetrically distributed secondary bearing seat is fixedly installed in the front and back two ends of horizontal slide, two secondary bearing seats are rotatably connected with two number screw rod, two number screw rod and one number screw rod are perpendicularly arranged between each other, the outer thread of two number screw rod is connected with longitudinal slide, the output shaft of two number motor is fixedly connected to one end of two number screw rod, equipment seat is fixedly installed on the upper surface of longitudinal slide, the machine tool of the utility model whole structure is simple, floor area is small, manufacturing difficulty is low, effectively reduce the enterprise's early purchase and later use cost, with good use economy, suitable for small and micro manufacturing enterprises development use.

Disclosed herein is an implantable or wearable, flexible, miniaturized microimaging suited for localized brain fluorescent imaging. The microimaging device is implemented on a Parylene photonics platform, which is biocompatible and fabricated using scalable planar microfabrication techniques, enabling customizable design, size, and number of channels (pixels). Operating across the entire visible spectrum. The microimaging device functions effectively both for coherent and scattered light. The microimaging device can be implanted into the brain of freely moving animals, where one or more waveguides could be dedicated to light delivery and the rest of the waveguides for collecting and relaying the fluorescent image to image the tissue structure and function.

Techniques are provided for calibrating thermal annealing processes (e.g., laser annealing) using microfabricated resistance temperature sensors. For example, a device comprises a substrate, and a resistance temperature sensor disposed on the substrate. The resistance temperature sensor comprises a stack of alternating metal layers of a first metal and a second metal, wherein the first metal and the second metal are different types of metals.

The present application provides a method and system for automated inspection of a microfabricated feature on a substrate. The disclosure utilizes manipulating laser polarization in combination with the excitation and emission process, in inspection applications. The application specifically discloses selecting the polarization of the laser light by adjusting a polarization manipulator or a quarter-waveplate and / or a half waveplate between the laser source and the substrate to impart polarization to the laser light. The polarization impacts using a polarization selected to improve fluorescence emission of certain features on a substrate. The selection can be made prior to run time or dynamically during the inspection tool runtime. If the polarization is not specifically selected, then the microfabricated features may not emit much fluorescence.

The application provides a monolithic integrated multifunctional composite sensor and a preparation method thereof, and adopts single-silicon single-surface silicon microfabrication technology to predefine and cover a first micro groove of a gas flow sensing unit, to form a pressure reference cavity and a pressure sensitive diaphragm first, to predefine a single-crystal silicon thermocouple arm and a heating resistor pattern through the first micro groove and a side wall protection, to protect the pressure sensing unit through a heat insulation medium layer, to form a heat insulation cavity and a temperature sensing unit, to finally realize integration of the gas flow sensing unit, the pressure sensing unit and the temperature sensing unit on the same monolithic wafer, and to realize the structure of the heat insulation cavity and the pressure reference cavity in the same single-crystal silicon substrate. The method replaces traditional double-sided processing technology, solves the problem that a traditional composite chip is difficult to realize small size, avoids a complex process caused by a traditional silicon-silicon or silicon-glass bonding structure, greatly reduces process difficulty and cost, improves the yield of the composite chip, and improves the reliability of the sensor.

The present disclosure provides a metal microprobe array and an electroforming method thereof, and relates to the technical field of microfabrication, and comprises the following steps: constructing a photocured resin mask model with a microprobe cavity; preparing a photocured resin mask; placing the photocured resin mask into a dopamine mixed solution to form a self-assembled polydopamine molecular layer on the surface of the photocured resin mask, thereby obtaining a photocured resin mask with surface hydrophilicity; adhering the photocured resin mask with surface hydrophilicity to a metal substrate by mechanical bonding, and using the photocured resin mask as an assembled cathode for electrodeposition; immersing the assembled cathode into an electroforming solution as a cathode for vacuum boiling electrodeposition; when the microprobe array is filled with metal and fills the cavity of the photocured resin mask with surface hydrophilicity, removing the cathode to obtain a filled photocured resin mask; and performing high-temperature ashing treatment on the filled photocured resin mask, and then performing ultrasonic cleaning to obtain a metal microprobe array. The present disclosure can improve the preparation efficiency of the metal microprobe array.

The present application provides a method and system for automated inspection of a microfabricated feature on a substrate. The disclosure utilizes manipulating laser polarization in combination with the excitation and emission process, in inspection applications. The application specifically discloses selecting the polarization of the laser light by adjusting a polarization manipulator or a quarter- waveplate and / or a half waveplate between the laser source and the substrate to impart polarization to the laser light. The polarization impacts using a polarization selected to improve fluorescence emission of certain features on a substrate. The selection can be made prior to run time or dynamically during the inspection tool runtime. If the polarization is not specifically selected, then the microfabricated features may not emit much fluorescence.

The application discloses a quantum sensor chip packaging structure capable of realizing wafer-level planar co-packaging, which comprises a microfabricated atomic cell, a light source chip assembly and a light detection chip assembly, the microfabricated atomic cell is integrated with a reflecting element, the reflecting element is used for adjusting the optical path of the light beam entering the microfabricated atomic cell, the microfabricated atomic cell, the light source chip assembly and the light detection chip assembly are supported on a packaging substrate through a micro-bump assembly and are directly electrically interconnected with the packaging substrate through the micro-bump assembly, the micro-bump assembly comprises a plurality of micro-bumps, the distribution mode of the micro-bumps is for the purpose of realizing the supporting function and the electrical interconnection, the size of the micro-bump supporting the microfabricated atomic cell, the light source chip assembly and / or the light detection chip assembly is adjustable, the optical path of the microfabricated atomic cell is regulated by adopting the combination of micro-bumps with different sizes, and the planar co-packaging of the microfabricated atomic cell and other key quantum sensor components can be realized.

The antibacterial nanostructured substrate comprises a substrate plate and a nanostructure composite. The nanostructure composite is formed on the first surface of the substrate plate and includes multiple first nanostructure bodies and multiple second nanostructure bodies that are adjacently arranged in intervals. The first nanostructure bodies and the second nanostructure bodies are periodically arranged, with the center position of each first nanostructure body defined as a first reference point and the center position of each second nanostructure body defined as a second reference point. The first nanostructure bodies are arranged corresponding to the center position of the second nanostructure bodies. The first reference point has a first displacement and a second displacement relative to the second reference point. A method of manufacturing the antibacterial nanostructured substrate is provided to form nanostructure composite on the substrate plate using a microfabrication process.

A method for fabricating a bridge structure in a quantum mechanical device, comprising: providing a substructure comprising a substrate having a layer of a first superconducting material deposited thereon, the layer of the first superconducting material being divided into a first portion, a second portion, and a third portion that are electrically insulated from one another; depositing a sacrificial layer on the substructure; electrically connecting the first portion and the second portion with a strip of a second superconducting material, the second superconducting material being different from the first superconducting material; and removing a portion of the sacrificial layer to form a bridging structure over the third portion between the first portion and the second portion, the bridging structure electrically connecting the first portion to the second portion without electrically connecting the third portion to the first portion and without electrically connecting the third portion to the second portion.

A method of planarizing a substrate includes receiving a substrate having microfabricated structures of varying height on a working surface of the substrate defining an uneven topography; depositing a first layer including a solubility-altering agent on the working surface of the substrate in an uneven manner by spin-on deposition; exposing the first layer to a first pattern of actinic radiation based on the topography; developing the first layer using a predetermined solvent; and depositing a second layer on the working surface of the substrate, the second layer having a greater planarity than the first layer prior to developing the first layer. The first radiation pattern alters the solubility of the first layer such that upper regions of the uneven topography of the first layer are soluble in the predetermined solvent.

Provided herein are methods and apparatus for fabricating a semiconducting substrate using a template layer to form a film of molybdenum having a low resistance attributed to the large size of its internal crystalline grains. The method and apparatus described herein may be used to fabricate molybdenum lines or interconnects in an integrated circuit. Fabricated molybdenum lines may be robust against oxidative damage during air break and downstream processing and be able to maintain low resistance. The method may be used to deposit molybdenum to fill features as a liner layer and / or fill features.