This invention discloses an antistatic substrate-free
wafer bonding film and its preparation method, belonging to the field of thin film technology. The film contains antistatic
nanoneedle composite microspheres and
Schiff base corrosion inhibitor complexes. The two work synergistically to endow the
wafer bonding film with excellent
mechanical strength, antistatic properties, and
corrosion resistance, and also have
thermal conductivity, which can be applied to wafers and extend the service life of the
wafer bonding film. The antistatic
nanoneedle composite microspheres and
Schiff base corrosion inhibitor complexes form a functionally complementary and structurally synergistic filler
system in the matrix. The one-dimensional structure of the nanoneedles can act as a reinforcing phase, inhibiting the
initiation of internal cracks in the film layer and improving the tensile strength of the film layer. The
Schiff base structure can coordinate with the
copper and
zinc in the antistatic
nanoneedle composite microspheres, firmly anchoring the Schiff base
corrosion inhibitor complexes to the surface of the nanoneedle microspheres, allowing the corrosion inhibition sites to be evenly distributed in the film layer with the nanoneedle microspheres, improving the long-term effectiveness and uniformity of corrosion inhibition performance.