The invention relates to the field of
wafer detection, in particular to a
wafer detection device and method, the device comprises a
scanning electron microscope, an atomic force
microscope and piezoelectric ceramics, the
scanning electron microscope comprises a lens cone, an objective lens and a
sample chamber, the objective lens is arranged in the
sample chamber, and a sample table for bearing a
wafer to be detected is arranged in the
sample chamber; the objective lens is used for acquiring a two-dimensional morphology image of the surface of the wafer to be detected; the atomic force
microscope is arranged in the sample chamber, the atomic force
microscope is not in contact with the sample table, the atomic force microscope comprises a
cantilever and a probe installed at the end of the
cantilever, the probe is used for obtaining the three-dimensional structure of a wafer to be detected, and the piezoelectric
ceramic is arranged at the end, away from the probe, of the
cantilever; and the piezoelectric
ceramic pressure realizes fine adjustment of the probe in horizontal and height directions through directional deformation. Vibration of the sample table and transmission of heat to the atomic force microscope are effectively isolated, and measurement errors caused by mismatch of vibration
noise and
thermal expansion are reduced. Precise control of the position of the probe is realized through piezoelectric ceramics.