55 results about "Wire array" patented technology

The invention discloses a follow-up PIV boundary layer flow field test system and test method based on electrolytic hydrogen bubbles. The follow-up PIV boundary layer flow field test system comprises an integrated optical measurement module and a tracer particle generation module, the optical measurement module is arranged in the UUV and comprises a laser transmitter assembly, a sapphire prism and two imaging cameras which are symmetrically arranged, and laser sheet light forms a sheet light area on the outer surface of the UUV after being refracted by the sapphire prism; the tracer particle generation module comprises a cathode, an anode and a power supply unit, the cathode is a platinum wire array composed of a plurality of platinum wires arranged in the axial direction of the UUV, and the platinum wires are located at different heights away from the wall face of the UUV; the power supply unit selectively electrifies the platinum wire, independently adjusts the voltage, controls the number and frequency of generated hydrogen bubbles, and achieves the synchronous measurement of flow field information at different thickness positions of a boundary layer. According to the invention, boundary layer flow field in-situ follow-up measurement and synchronous fine measurement of different thickness positions under the condition of not changing the UUV shape are realized, and the device has the advantages of high integration level, small flow field disturbance, high measurement efficiency and the like.

The invention discloses a microelectrode for collecting cell electrophysiological signals and a preparation method thereof.The microelectrode comprises a substrate, an electrode array, a wire array and a bonding pad array, the electrode array, the wire array and the bonding pad array are arranged on the substrate, the electrode array is distributed in a dispersed mode with a preset position as the center, and the wire array is connected with the electrode array and the bonding pad array; the electrode array comprises a first conducting layer, the wire array sequentially comprises a first conducting layer, a second conducting layer and an insulating layer, the bonding pad array sequentially comprises a first conducting layer and a second conducting layer, and the first conducting layer and the second conducting layer are made of different materials. According to the embodiment, the performance of the microelectrode array can be improved, the preparation cost is reduced, and the preparation efficiency is improved. The microelectrode can be widely applied to the technical field of microelectrodes.

The invention provides a thin-film resistor network space debris detection circuit and method based on a coding mode, and the circuit comprises a coding thin-film resistor network which is composed of a parallel resistor wire array with the front side and the back side orthogonally arranged, the signal generation module is used for generating on-off signals through broken lines caused by fragment impact; the on-off comparison circuit is connected with the coding thin-film resistor net and is used for converting the on-off state of the resistor wire into an identification signal of a high level or a low level; the on-off identification circuit is connected with the on-off comparison circuit and used for collecting identification signals of all channels in parallel and outputting a disconnection state; resistor wires of the coding film resistor net are connected with signal channels in a grouping circulation connection mode, and the total number of the signal channels is smaller than that of the resistor wires. According to the invention, the size information in two dimension directions can be identified, and the positioning precision of the impact position can be improved, so that the detection parameter testing precision of the whole detector is improved.

The present invention discloses a gallium nitride micro-wire array photodetector and a preparation method thereof. The photodetector includes: a silicon substrate, a methylammonium lead iodide layer, and an electrode; a plurality of grooves arranged in parallel are formed on the upper surface of the silicon substrate; an insulating layer covers the surface of the protruding portion on the upper surface of the silicon substrate; gallium nitride micro-wires are epitaxially grown on the two inner sidewalls of the grooves respectively, the extending direction of the gallium nitride micro-wires is the same as the extending direction of the grooves, and the gallium nitride micro-wires form a parallel micro-wire array; the electrode is disposed on the upper surface of the silicon substrate, and the methylammonium lead iodide layer is coated on the upper surface of the silicon substrate to cover the electrode and the gallium nitride micro-wires so as to form a double heterojunction. The photodetector has low dark current, fast response speed, high on / off current ratio, and long detection range, with good comprehensive performance, and the device structure is simple and easy to manufacture.

This invention discloses a hot wire array device with a hot wire compensation structure and its usage method. The hot wire array device with the hot wire compensation structure includes a base, an electrode assembly, a hot wire assembly, a support device, a horizontal tension compensation assembly, and a longitudinal tension compensation assembly. The hot wire assembly includes several parallel hot wires. The horizontal tension component passes through a heat insulation assembly, and its two ends are connected to the support device and a power compensation component, respectively. The power compensation component does not include an elastic component. The longitudinal tension compensation assembly includes several hot wire support strips, several tantalum cables, and several tantalum cable fixing components. The hot wire support strips are provided with several support grooves. The hot wires contact the support grooves of the hot wire support strips, and the hot wires are perpendicular to the hot wire support strips. This ensures that the tension and length of each segment of the hot wire are the same when fixed, and that no sagging occurs during heating.

The present invention discloses a flexible wire array and an LED light strip. The flexible wire array includes a plurality of flat wires and an insulating film. Each flat wire is fixedly arranged side by side at intervals on the insulating film. The insulating film is provided with a plurality of hollow areas at intervals along the length direction of the flat wires. Each hollow area is provided with a plurality of hollow holes at the position corresponding to the flat wires. The hollow holes are arranged along the width direction of the insulating film. The exposed portions of each flat wire in the hollow holes form flat wire connection areas. A connection conductor is fixed on the flat wire connection areas. The connection conductor includes two plug-in parts for plugging and at least one conductor connection piece. The two plug-in parts are respectively electrically connected to the flat wire, and the two plug-in parts are connected by the conductor connection piece. The plug-in parts are both in a hollow column shape. The structure of the flexible wire array is simple. It only needs to be sheared along the hollow area. After shearing, hollow columns that can be plugged are formed at the end of the flexible wire array, which is convenient for the electrical connection between the flexible wire array and external electrical components.

A method and apparatus for predicting the configuration and attitude of a towed wire array subjected to current-induced vibrations, relating to the field of marine exploration technology, are disclosed. The method includes: employing a quasi-static model to determine the configuration and attitude and tension of the towed wire array at its equilibrium position by solving a set of nonlinear equations considering boundary constraints; wherein the tail boundary conditions of the quasi-static model include tail rope tension; employing a dynamic model, using the configuration and attitude and tension as initial conditions, discretizing and solving the dynamic model to obtain the spatiotemporal distribution characteristics of the displacement of the towed wire array subjected to current-induced vibrations; wherein the dynamic model includes segment tension and gravity. This application combines a quasi-static model and a dynamic model, adding tail rope tension, segment tension, and gravity to the existing parameters, making the model conform to the actual stress conditions of the towed wire array, thereby achieving accurate prediction of the spatiotemporal distribution of the configuration and attitude of the towed wire array subjected to current-induced vibrations.

Technical problem: The present invention provides a method for restarting the operation of a wire saw, wherein, in a wire saw using a fixed abrasive metal wire, when restarting the cutting of a workpiece that has been interrupted in the middle due to an abnormality such as wire breakage, the wire will not break due to the wire pulling the workpiece. Solution: A method for restarting the operation of a wire saw, the method being an operation restart method in the following case, wherein, in the operation of a wire saw that forms a metal wire array by winding a fixed abrasive metal wire having abrasive grains fixed on its surface onto a plurality of grooved rollers, and cutting and feeding the workpiece relatively against the metal wire array while reciprocating the fixed abrasive metal wire in an axial direction, thereby cutting the workpiece into a wafer shape, when the cutting of the workpiece is temporarily interrupted in the middle of the workpiece, the cutting of the workpiece is restarted, wherein the fixed abrasive metal wire after the abrasive grains have been worn away is arranged at the cutting position of the workpiece where the cutting of the workpiece was interrupted, and the cutting of the workpiece is restarted.

The application discloses a kind of based on electrolytic hydrogen bubble's PIV boundary layer flow field test system and test method of satellite, including integrated optical measurement module and tracer particle generation module;Optical measurement module is located in UUV interior, including laser emitter assembly, sapphire prism and the two imaging cameras of symmetrical arrangement, laser sheet light is refracted after sapphire prism and forms sheet light area on the outer surface of UUV;Tracer particle generation module includes cathode, anode and power supply unit, cathode is the platinum wire array of several platinum wires arranged along the axis of UUV, each platinum wire is located at different height from the wall surface of UUV;Power supply unit selectively energizes platinum wire and independently adjusts voltage, control the number and frequency of hydrogen bubbles generated, realize the synchronous measurement of flow field information at different thickness positions of boundary layer.The application realizes boundary layer flow field in-situ satellite measurement and synchronous fine measurement at different thickness positions under the condition of not changing the appearance of UUV, with the advantages of high integration, small flow field disturbance, high measurement efficiency.

The invention discloses a cable management clamp and welding equipment, the cable management clamp comprises a base, a cable holding piece and a guiding piece, and wires extending out of the ends of a cable respectively penetrate through corresponding guiding structures and extend outwards to form a wire array used for being connected with an external device in a guiding mode. The cable is mainly placed on the base, the end portion of the cable can be pulled to the cable holding piece, and the multiple wires can penetrate through the cable holding piece, move in the direction of the guiding piece and penetrate through the corresponding guiding structures so that the multiple wires can form a wire array used for being connected with an external device in a guiding mode, and therefore the positions of the multiple wires do not need to be repeatedly ranked continuously. In the welding production process, the time needed for welding one product can be shortened through the arrangement, and the production problem caused by disordered wire sorting due to human negligence is avoided.

The invention belongs to the technical field of eddy current detection. The rail vehicle communication cable broken wire array eddy current detection probe comprises a plane winding displacement coil and a differential three-dimensional coil array, the plane winding displacement coil is used for applying high-frequency excitation, and the differential three-dimensional coil array is used for sensing broken wire defect magnetic field disturbance; the differential three-dimensional coil array comprises a plurality of differential three-dimensional coil pairs, each differential three-dimensional coil pair comprises a first three-dimensional coil and a second three-dimensional coil, the first three-dimensional coil is arranged at the position where the magnetic field disturbance gradient of the planar winding displacement coil is maximum, and the second three-dimensional coil is arranged at the position where the magnetic field disturbance gradient of the planar winding displacement coil is minimum. The detection bottleneck of a thick insulating layer is broken through, the channel consistency of the array probe is optimized, the detection efficiency and precision of the communication cable under the large lift-off working condition are greatly improved, interference is effectively restrained, the structural adaptability is high, and effective recognition of the broken wire in the cable can be achieved.

The application relates to the technical field of display, and provides a display panel, a folding screen and a folding screen device. The display panel is applied to the folding screen device, first display driving chips and second display driving chips of the folding screen device are arranged along a longer first side of the folding screen device, the first side is perpendicular to a rotating shaft of the folding screen device, the first side is adjacent to a shorter second side of the folding screen device; a first gate driver of the folding screen device is arranged along the second side; the display panel comprises: a plurality of scanning signal lines and a first wire array, the plurality of scanning signal lines are connected with the first gate driver and are perpendicular to the rotating shaft; a first end of the first wire array is connected with the first display driving chip, and a second end of the first wire array is connected with a data signal line of a first folding sub-region in a first display region. The display panel can increase the charging time of a pixel unit, and can also make the wire between the scanning signal line and the DDIC avoid the folding region.

The invention has been developed primarily for use in / with sensing biological signals and / or stimulating a body part of a subject. The invention relates to flexible bioelectrode(s) device and a method of manufacturing such a flexible bioelectrode device. The flexible bioelectrode device comprises a moulded body, a wire array of conductive wires at least partially embedded in the moulded body; the wire array defining terminal ends and distal ends; wherein each of the terminal ends of the wire array are connected to an electrode; and at least one or more connector terminals connected to the distal ends of the wire array.

The invention discloses a preparation method of a low-wind-resistance noise water retaining device of a purification combined type air conditioning unit for a dust-free room. The method comprises the following steps: S1, manufacturing a steel wire with a water-drop-shaped section; s2, an upper top plate and a lower bottom plate are manufactured, the upper top plate and the lower bottom plate are oppositely arranged, hanging plate arrays are arranged on the opposite faces of the upper top plate and the lower bottom plate, and hanging plates in each row and adjacent hanging plates in the hanging plate arrays are arranged in a staggered mode; s3, water-drop-shaped steel wires are sequentially hung on each row of hanging plates of the lower bottom plate and the upper top plate in a staggered and penetrating mode, and a steel wire array is formed between the upper top plate and the lower bottom plate; and S4, side plates are arranged on the two sides of the upper top plate and the two sides of the lower bottom plate, the upper top plate and the lower bottom plate are fixedly connected through the side plates to form an outer frame, the section of each steel wire in the steel wire array is in a water drop shape, and the water retaining wind resistance is effectively reduced through the steel wires with the water drop-shaped sections.

The invention has been developed primarily for use in / with sensing biological signals and / or stimulating a body part of a subject. The invention relates to flexible bioelectrode(s) device and a method of manufacturing such a flexible bioelectrode device. The flexible bioelectrode device comprises a moulded body, a wire array of conductive wires at least partially embedded in the moulded body; the wire array defining terminal ends and distal ends; wherein each of the terminal ends of the wire array are connected to an electrode; and at least one or more connector terminals connected to the distal ends of the wire array.

The present application discloses a cable management fixture and a soldering apparatus comprising a base, a cable holder, and a guider. Each of conducting wires extending from the end of the cable passes through a corresponding one of said guide structures and protrudes outward, forming a conducting wire array for connecting with external devices. The cable is mainly placed on the base, an end of the cable may be pulled onto the cable holder, and a plurality of conducting wires may pass through the cable holder, move in the direction of the guider and pass through corresponding ones of the guide structures so that the plurality of conducting wires form a conducting wire array for connecting with external devices, therefore the positions of the plurality of conducting wires are not required to be repeatedly reordered. Such an arrangement may shorten the time required to solder a product in a soldering production process and avoid problems in production caused by the disorder of conducting wires caused by any human negligence.

The invention discloses an arc extinguishing structure for preventing metal wire electric explosion circuit breaker rebreakdown, an assembling method and a switch, the structure comprises an insulating sleeve, arc extinguishing partition plates, two disc electrodes and a metal wire array, the arc extinguishing partition plates are detachably connected with the inner wall of a cylinder, the arc extinguishing partition plates are arranged at intervals in the axial direction of the insulating sleeve, micropores are formed in the arc extinguishing partition plates, and the metal wire array is arranged between the two disc electrodes. The micropores in the adjacent arc extinguishing partition plates are aligned in the axial direction; the two disc electrodes are fixedly attached to the opposite side walls of the two sealing plates respectively. The parallel metal wires of the metal wire array are arranged in the axially aligned micropores in the axial direction of the insulating sleeve in a penetrating mode, the two ends of the metal wires are fixedly connected with the two disc electrodes respectively, and compared with arc extinguishing media such as sulfur hexafluoride, nitrogen and quartz sand, the arc extinguishing partition plates with the micropores are arranged, so that re-breakdown after a switch is switched off is prevented, and the arc extinguishing effect is improved. The formation of a plasma conductive channel is avoided, the metal wire array can be supported, and the requirement of the interior of the switch for air tightness is low.

A catalytic converter shield assembly including a catalytic converter shield and vehicles including the catalytic converter shield assembly. The catalytic converter shield includes a first panel having an inner surface and an opposite outer surface, a second panel having an inner surface facing the first panel and an opposite outer surface, a wire array provided between the first panel and the second panel, and a heat shielding layer provided on the outer surface of the second panel opposite the wire array.

The application provides a hot wire architecture and a chemical vapor deposition device, and belongs to the field of hot wire chemical vapor deposition. The hot wire architecture provided by the application comprises a hot wire, a first support structure and a second support structure. The first support structure and the second support structure are arranged at intervals along a first direction. The first support structure comprises a plurality of first fixing columns arranged at intervals along a second direction. The second support structure comprises a plurality of second fixing columns arranged at intervals along the second direction. The hot wire is alternately wound around the plurality of first fixing columns and the plurality of second fixing columns along the second direction to form a hot wire array. The hot wire architecture provided by the application greatly simplifies the structure, reduces the demand for electrical contact and power supply, facilitates modular expansion, has high effective utilization rate of the hot wire, relatively low loss, is easy to maintain and replace, reduces the use cost and maintenance cost, and effectively promotes the industrialization process of hot wire CVD diamond film growth.

The application provides a preparation method of a driving array, the driving array and an electronic device. The preparation method of the driving array provided by the application comprises the following steps: forming a metal wire structure; forming a first gate line array on a first dielectric material layer in the metal wire structure, and covering the first gate line array with a second dielectric material layer; forming a first hole in an overlapping area of a projection area of each metal wire in the first metal wire array on the second dielectric material layer and a projection area of each gate line in the first gate line array on the second dielectric material layer; etching downwardly in the first hole, and stopping the etching process on an upper surface of the metal wire to form a first through hole perpendicular to the metal wire; depositing a third dielectric material layer in the first through hole, and etching the third dielectric material layer at the bottom of the first through hole vertically downward to form a side wall in the first through hole; and depositing a channel material in the first through hole. The preparation method of the driving array provided by the application can be used to prepare a driving array with a micro-structured structure.

A method cuts slices from workpieces using a wire saw with a wire array tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. A workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while controlling a temperature of the workpiece with a cooling medium, with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in dependence on a depth of cut and in correlation with a first correction profile, and while simultaneously moving the workpiece along the workpiece axis in accordance with a specification of a second correction profile, which specifies a travel of the workpiece. The first correction profile and the second correction profile being opposed to a shape deviation.

This invention discloses a method for preparing a composite poly-Si thin film, comprising: depositing and growing an intrinsic poly-Si thin film on a single-crystal silicon substrate using a vertical double-layer hot-wire array thermal field design and a high-temperature hot-wire silane pyrolysis technique; and introducing trace amounts of NH3 or N2O gas to generate Si in situ. x N y or SiO x N y A quantum dot barrier layer is formed by introducing a doping source, PH3 or B2H6, for in-situ doping to obtain a doped source layer. The grown poly-Si thin film with the composite structure is then annealed using vacuum rapid annealing or laser annealing to activate the doping source and promote crystal growth. This process produces a poly-Si thin film with a composite structure of "intrinsic layer + barrier layer + doped layer," which improves carrier mobility and reduces parasitic absorption. This structure shows promising application prospects for developing photovoltaic cells and optoelectronic devices.

The utility model discloses a polymerization X-ray capillary optical element wire arrangement die which comprises a base and an upper cover which are connected through a bolt, and after the base and the upper cover are aligned and combined, hollowed parts of the base and the upper cover can form a section of wire arrangement fixing hole with a regular hexagonal section. And a limiting structure for ensuring that the base and the upper cover are accurately aligned and combined is also arranged on the combination surface of the base and the upper cover. According to the utility model, the limiting structure is arranged on the combining surface of the upper cover and the base, so that the upper cover and the base are ensured to be accurately aligned in the combining process. By means of the design, the joint face deviation caused by the diameter machining tolerance of the screw hole and the screw is avoided, and the stability and durability of the die are improved.

A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.

The application discloses a composite optical fiber probe integrated with an electrode array and a preparation method thereof, and relates to the technical field of optoelectronics. The composite optical fiber probe integrated with the electrode array comprises a fiber base, a microchannel array, a metal micro-wire array and an encapsulation layer. The microchannel array comprises at least one groove, and each groove is arranged on an outer cladding layer of the fiber base. The metal micro-wire array comprises at least one metal micro-wire, and each metal micro-wire is embedded in a groove of the microchannel array. The encapsulation layer is filled in the groove, and the metal micro-wire is embedded and fixed in the groove, and a continuous integral surface is formed between the encapsulation layer and the outer surface of the outer cladding layer. The composite optical fiber probe integrated with the electrode array realizes the compatibility of the quartz-based optical fiber and the metal electrode array material, the flexible layout of the electrode and the customizable integration. The composite optical fiber probe integrated with the electrode array not only utilizes the excellent optical transmission performance of the quartz-based hollow optical fiber, but also supports diversified optical signal modes, and can realize high-precision volume illumination control.

The invention relates to a method for cutting a plurality of slices from a workpiece (4) by means of a wire saw, wherein a wire array (2) is tensioned in a plane between two wire guide rollers (1), wherein each of the two wire guide rollers (1) comprises at least one chamber (18) and a housing portion (8), which surrounds a core portion (17) of the wire guide roller (1) and is configured with a guide groove for a wire section. The method comprises conveying the workpiece (4) via the wire array (2), at the same time changing the length of the housing portions (8) of the two wire guide rollers (1) by controlling the temperature of the chambers (18) of the wire guide rollers (1) with a first cooling fluid according to a specification of a first temperature profile, and at the same time moving the workpiece (4) along a workpiece axis according to a specification of a second correction profile.

Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in correlation with a first correction profile, which specifies a travel of the floating bearings in dependence on the depth of cut. In dependence on the depth of cut, operating parameters are set, such as the feed rate, an amount of working fluid fed to the wire array per unit time, a temperature of the working fluid, a wire speed, a wire consumption per cut-off operation, or a wire tension.

The invention provides a code scanning trimming circuit, a code scanning trimming method and a chip. The code scanning trimming circuit comprises a burning test circuit module and an auxiliary circuit unit, and the burning test circuit module is used for verifying and correcting the received burning test code until the test parameter corresponding to the burning test code meets the preset design target range, and then the burning test operation is executed. According to the invention, effective and reliable programming trimming can be carried out on the fuse wire array, code scanning verification is allowed to be carried out on the to-be-programmed code value before programming to confirm the accuracy of the to-be-programmed code value, in addition, the circuit is small and exquisite, the occupied chip area is small, and the layout is flexible.

This invention provides a method for preparing perovskite single-crystal micron-shaped wire arrays using a melt method. Perovskite powder is added to the gap between a silicon pillar template and a quartz substrate, forming a sandwich structure. This sandwich structure is placed on a heating device, and the temperature is increased. When the temperature exceeds the melting point of perovskite, the melt flows along the top of the silicon pillar until it covers the entire silicon pillar template. The temperature is then slowly lowered until it falls below the solidification point of perovskite, resulting in a regularly arranged perovskite micron-shaped wire array on the substrate. Compared to traditional liquid-phase methods for preparing perovskite arrays, this invention ensures crystal quality, avoids the harm to health and the environment caused by organic solvents, and enables the array preparation of perovskite that is insoluble in organic solvents. Furthermore, it provides a new approach for the array preparation of other perovskites and their application in optoelectronic devices.

An efficient energy-saving low-wind-resistance water retaining device of a purification combined type air conditioning unit for a dust-free room comprises an outer frame and a steel wire array, the steel wire array is detachably installed in the outer frame, and the section of steel wires forming the steel wire array is in a water drop shape; the water retaining wind resistance is effectively reduced by the steel wires with the water-drop-shaped sections, the steel wires are sequentially hung on the hanging plates to form the steel wire array, and the hanging plates in each row and the hanging plates in the adjacent row in the hanging plate array are arranged in a staggered manner, so that the steel wires in each row and the water-drop-shaped steel wires in the adjacent row in the steel wire array are arranged in a staggered manner; and non-atomized water drops can be effectively intercepted and prevented from entering the air outlet pipeline.