The invention relates to the technical field of
thermoelectric materials, and discloses a method for optimizing thermoelectric performance and stability of a
copper sulphide material by a macroscopic insulation structure, which comprises the following steps: firstly, preparing Cu1.96S precursor
powder by using a mechanical alloying method, then putting the Cu1.96S precursor
powder into a
graphite grinding tool, and carrying out heat treatment on the Cu1.96S precursor
powder to obtain a Cu1.96S / Cu1.96S
composite material; meanwhile, macroscopic insulation structure frames are added layer by layer according to different arrangement
modes (including up-and-down hole arrangement and left-and-right hole arrangement); and the obtained Cu1. 96S + macroscopic insulation structure frame mixed powder is subjected to
spark plasma sintering, and then the block
composite material is obtained. The directional migration process of Cu ions in Cu1.96S in the
sintering process can be influenced by the added macroscopic insulation structure frame, migration of part of the Cu ions is hindered, the problem that the migration rate and the electrical property of the material are deteriorated due to invalidation caused by the
copper ions is solved, the heat
conductivity is slightly reduced, and finally the thermoelectric property and the stability are synchronously improved. The problem that an existing
cuprous sulfide thermoelectric material is difficult to obtain excellent thermoelectric performance and stability at the same time is solved.