The invention discloses a
grinding device for
sapphire wafers. The
grinding device for
sapphire wafers comprises a pulp stock
barrel, a
peristaltic pump and a grinder, wherein a pulp stock trough is arranged on the grinder, and pulp stock enters into the grinder through the
peristaltic pump and the pulp stock trough. The
grinding method for the
sapphire wafers comprises the following steps: 1, preparing the pulp stock: putting in raw materials by levels and
layers; 2, controlling pulp stock flows: putting pulp stock accurately; 3, correcting the flatness of the surface of a grinding lower plate: repeatedly measuring by using a long gauge, a short gauge and a dial gauge, and correcting; 4, distributing
powder on the surface of a grinding plate; and 5, grinding both sides of each
wafer: firstly carrying out light pressing grinding. The grinding method provided by the invention is characterized in that
raw material ratio of the pulp stock is optimized, the pulp stock supplying flow is more accurate, the conveying is more even, before normal grinding, light pressing grinding is performed firstly, the problem of
wafer breakage during a
grinding process can be prevented for the greatest possible, the
wafer breakage rate is lowered, the merit factor of grinding is improved, the removing rate during grinding is stable, the problems of over grinding and low removing rate cannot be caused, and the efficiency is relatively high.