Manufacturing method of thick gas electronic multiplication detector diaphragm board

Abstract

The invention discloses a manufacturing method of a thick gas electronic multiplication detector diaphragm board. The method is characterized by including: cutting and cleaning a board clad with copper on two sides; drilling positioning holes; simultaneously pressing light-induced anti-corrosion dry diaphragms on two sides; aligning an external pattern film with the circuit board with the light-induced anti-corrosion dry diaphragms, and exposing the two on an exposure machine; developing and etching to remove copper and the light-induced anti-corrosion dry diaphragms; using a numerical control machine tool to punch hole arrays on the board clad with copper on two sides; spraying the board clad with copper on two sides. The method has the advantages that entire board micro-etching is used for manufacturing, manufacturing of large-area THGEM diaphragm boards is facilitated, the 300*300mm THGEM diaphragm boards is manufactured successfully, and rim uniformity is consistent; full-automatic circuit board manufacturing equipment is used, batch production can be achieved, and yield can reach more than 95%; the THGEM diaphragm boards are independent of reading anode plates and can be designed and machined into different sizes and shapes according to needs.

Description

technical field [0001] The invention relates to a method for manufacturing a diaphragm, in particular to a method for manufacturing a thick gas electron multiplication detector diaphragm, which belongs to the field of etching processing. Background technique [0002] Thick gas electron multiplier detector (THGEM) is a new type of microstructured gas detector, its structure is as follows: figure 1 As shown, in the airtight chamber 11 (the airtight chamber 11 is filled with working gas, which can be mixed with inert gases such as argon and xenon and quenching gases such as carbon dioxide, isobutane and methane), the drift electrode 1 , the readout anode 9 and the preamplifier 10 are arranged parallel to each other, and a THGEM diaphragm is also arranged in parallel between the drift electrode 1 and the readout anode 9. The THGEM diaphragm is composed of an upper copper layer 3, an insulating substrate 4 and a lower copper layer. 5, the THGEM film plate is provided with an arr...

AI Technical Summary

Problems solved by technology

Among them, the most difficult to control is the lamination process. Since the lamination needs to be aligned with the center of each hole, otherwise the performance of the detector will be affected due to the poor quality of a single hole. Therefore, the existing process is used for THGEM membrane plate The production of the film has high requirements on the drilling accuracy, laminating positioning accuracy, and laminating working environment, which increases the difficulty of making large-area THGEM diaphragms.

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