The invention provides an integrated thick GEM and a manufacturing method thereof, and belongs to the technical field of gas
electron multipliers, the method comprises the following steps: laminating two
layers of
copper foils into an inner-layer core plate through a
dielectric layer, and
electroplating a
copper column in the inner-layer core plate; performing first
etching positioning at the position of the insulating ring of the
copper column, and reserving the thickness of the
copper foil etched for the second time; the outer-layer
copper foil and the inner-layer core board are pressed into an integral circuit board, and a bonding pad is manufactured through back drilling; and synchronously
etching the outer-layer
copper foil insulating ring and the inner-layer core plate insulating ring until the copper columns are exposed, so as to finish the second
etching. According to the method, the inner-layer insulating ring is pre-etched, so that accurate positioning is left for the second etching of the inner-layer core plate insulating ring; during the second etching, synchronous depth-controlled etching is carried out on the outer-layer copper foil insulating ring and the inner-layer core plate insulating ring, and the outer-layer copper foil insulating ring determines the relative distance by means of the position reference of the inner-layer core plate insulating ring, so that the concentricity of the inner-layer insulating ring, the outer-layer insulating ring and the copper column meets the production requirement, and the purpose of producing a miniaturized and integrated thick GEM is achieved.