Fabrication method of thick gas electron multiplier detector diaphragm
A technology of gas electron multiplication and production method, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, which can solve the problems affecting the working performance of the detector and increasing the difficulty of making THGEM membranes, and achieve uniformity.
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Embodiment 1
[0032] 1. Cut the double-sided copper-clad PCB board into a production board with a processing size of 300mm×300mm, scrub and clean it with a board brushing machine, and use a cleaning agent to remove grease, etc., and wait for use.
[0033] 2. Drill positioning holes on the double-sided copper clad board for the installation and fixing of THGEM membrane board.
[0034] 3. Simultaneously press the photoresist dry film on both sides of the double-sided copper clad board.
[0035] 4. Align the outer graphics film with the circuit board with the photoresist dry film pressed, put it on the exposure machine for exposure, and bake at 100°C for 3 minutes.
[0036] 5. Use NaCO with a concentration of 1% (w / v) 3 The solution was developed at a spray speed of 0.8m / min.
[0037] 6. Etch copper with etching solution, the composition of etching solution is:
[0038]
[0039] 7. Remove the photoresist dry film with film removing solution. At this time, the upper layer copper foil, th...
Embodiment 2
[0046] 1. Cut the double-sided copper-clad PCB board into a production board with a processing size of 300mm×300mm, scrub and clean it with a board brushing machine, and use a cleaning agent to remove grease, etc., and wait for use.
[0047] 2. Drill positioning holes on the double-sided copper clad board for the installation and fixing of THGEM membrane board.
[0048] 3. Simultaneously press the photoresist dry film on both sides of the double-sided copper clad board.
[0049] 4. Align the outer graphics film with the circuit board with the photoresist dry film pressed, put it on the exposure machine for exposure, and bake at 100°C for 3 minutes.
[0050] 5. Use NaCO with a concentration of 1% (w / v) 3 The solution was developed at a spray speed of 0.8m / min.
[0051] 6. Etch copper with etching solution, the composition of etching solution is:
[0052]
[0053] 7. Remove the photoresist dry film with film removing solution. At this time, the upper layer copper foil, th...
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