The invention discloses an inner-layer dry film production method in the technical field of printed circuit boards. The method comprises the steps of 1, pre-treatment; 2, film pressing; 3, exposure; 4, development; 5, etching; and 6, film removal. According to the method, direct imaging is carried out in combination with a DI laser exposure machine by adopting a dry film process, and a negative film does not need to be used, so that the exposure cost is greatly reduced, and meanwhile, the dry film analysis capability reduction caused by negative film variation is reduced; after pre-treatment,film pressing, exposure and development parameters are optimized, the dry film analysis capability can reach 40 microns, and 2 / 2mil lines can be massively produced; and the method is an ideal production process of fine lines in current PCB production.