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312 results about "Direct imaging" patented technology

Manufacturing process for step circuit of PCB (Printed Circuit Board)

InactiveCN102651946AReduce copper thickness dropEliminate poor quality defectsConductive material chemical/electrolytical removalProduction scheduleEngineering
The invention discloses a manufacturing process for a step circuit of a PCB (Printed Circuit Board). According to the manufacturing process, different film patterns are adopted twice for manufacturing the circuit, during the primary film pattern circuit manufacture, a positive film circuit pattern is adopted, compensation is carried out a film substrate circuit at different positions according to copper thickness so as to manufacture a special circuit, and sunk copper plate electrification is carried out on the special circuit, so that the copper thickness meets the requirement; then board grinding is carried out by a twice board grinding mode so as to reduce the copper thickness difference of step positions; a dry film is enabled to be fully combined with the step positions by virtue of a film attaching and air compressing mode; and finally, normal circuit pattern manufacturing is carried out by utilizing a high-precision LDI (Laser Direct Imaging) exposure machine. Compared with the prior art, the manufacturing process for the step circuit can be used for eliminating the defects of open circuit at the position of the step circuit, notches, large deckle edges, serious lateral erosion, halfway etching and poor quality of thin lines and the like existing in the step circuit manufacturing process, improving the production efficiency and the production quality, quickening the production schedule and lowering the production cost.
Owner:SHENZHEN SUNTAK MULTILAYER PCB

Three-dimensional high definition electric resistivity exploration and direct imaging method

The invention discloses a three-dimensional high-resolution resistivity prospecting and direct imaging method, the main content is to use a unipolar-dipole device for forming a mutually crossed orthogonal observation system in a total test area; the application of the three-dimensional high-resolution resistivity prospecting and direct imaging method can overcome the problems that the existing two-dimensional high-resolution resistivity prospecting method has inaccurate tunnel positioning and undetermined tunnel shape caused by the side effects. Compared with the general three-dimensional high-density resistivity prospecting method, the three-dimensional high-resolution resistivity prospecting and direct imaging method has high sensitivity to underground tunnels, thereby truly realizing the multiple coverage measurements of underground analysis and distinguishing units, having stronger anti-interference and static offset removing capabilities and easily realizing the rolling measurement and the seamless connection of the test area. The three-dimensional direct imaging method is fast and effective, and has no problem of difficult convergence. The method can obtain more precise information of the positions, the sizes and the shapes of the underground tunnels, thereby having great significance for the study of the shallow fine geological structure.
Owner:JIANGSU UNIV

Development of radiation-sensitive elements

An aqueous alkaline developer for use with an imaged lithographic printing precursor comprises an aqueous alkaline medium, sodium metasilicate, a steric or electrosteric stabilizer, and a rinse aid or a phase stabilizer. It is suited for developing a lithographic printing precursor comprising, on a substrate, a coated and dried layer of a radiation-sensitive composition comprising one or more acetal resins. The developer may further contain a moderator, a dispersing agent capable of solvating a hydrophobic image colorant, and a wetting agent. The acetal resin of the precursor may be derived from polyvinyl alcohol by condensation with aldehydes. The imageable element is imageable by radiation, preferably infrared radiation, and provides good sensitivity for use in lithographic applications, such as conventional imaging systems, computer-to-plate systems or other direct imaging elements and applications when treated with the developer. The invention also provides a positive-working lithographic printing master comprising a precursor as aforesaid, imaged and developed with the developer. The invention further provides a method for cleaning the processor equipment in which the imaged lithographic printing precursor has been developed, comprising treating the deposit with an acid to yield liberated image colorant and treating the liberated image colorant with a cleaning composition.
Owner:KODAK GRAPHIC COMM CANADA CO

Method for making high alignment printed circuit board

The invention relates to a method for making a high collimation printed circuit board, comprising the following steps: step 1. providing a plurality of internal layer core plates, and printing circuitpatterns to be made onto the internal layer core plates by adopting a laser direct imaging technique; step 2. etching the internal layer core plates printed with the circuit patterns; step 3. respectively arranging two identifying targets for punching holes on the internal layer core plates in the long direction and short direction of the surfaces of the etched internal layer core plates, monitoring the expansion and shrinkage values of four identifying targets of the internal layer core plates by using a machine, and then partitioning the internal layer core plates according to the expansionand shrinkage values; step 4. matching and overlaying the plurality of internal layer core plates according to the partitions; and step 5. arranging six compensation targets and a central target on the internal layer core plates of odd layers or even layers, then pressing the plurality of overlaid internal layer core plates and drilling target holes by adopting a target drilling mode of six-pointcompensation method. With the method, the quality of the printed circuit board products can be effectively monitored, so that the invention is propitious to the improvement of the alignment of the printed circuit boards.
Owner:DONGGUAN MEADVILLE CIRCUITS
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