125 results about "Direct imaging" patented technology

The invention provides a processing method and system for reconstructing an LDI sub-pixel image through sparse compression and application, and the method comprises the steps: calculating a low-resolution to-be-exposed image corresponding to each phase structure in advance through a computer image compression algorithm; the low-resolution to-be-exposed images obtained through calculation are loaded to the digital micro-reflector according to the time sequence, and the display moment of each pattern is matched with the rotation position of the corresponding phase structure; coupling the pattern of the digital micro-mirror and the phase encoding mask in a frequency domain through a 4-f optical system, and reconstructing a high-resolution exposure pattern at a sub-pixel level by utilizing a diffraction effect; projecting a high-resolution light field of the reconstructed high-resolution exposure pattern to the surface of the photoresist, and forming a target circuit pattern by accumulating exposure dose; and the micro-nano structure with sub-pixel precision is obtained after development. The system comprises an image compression module, a pattern matching module and a pattern forming module. According to the invention, the manufacturing cost of the laser direct imaging equipment is reduced under the condition of the same precision.

The invention belongs to the field of molecular sieve material characterization, and particularly relates to a method for analyzing aluminum atom pairs in a ZSM-5 molecular sieve based on super-resolution fluorescence microscopic imaging, which comprises the following steps: activating a ZSM-5 molecular sieve sample; contacting the obtained sample with probe molecules; washing the ZSM-5 molecular sieve sample, and removing unbound or nonspecifically bound probe molecules; imaging the marked sample by using a super-resolution fluorescence microscope to obtain an image sequence containing a single fluorescent molecule emission event; processing the image sequence, determining a space coordinate of each fluorescence event, and reconstructing a super-resolution fluorescence image exceeding an optical diffraction limit; and based on the space coordinates of the fluorescent dots in the super-resolution fluorescence image, carrying out statistics to obtain the position, surface density or distribution information of the aluminum atom pairs in the ZSM-5 molecular sieve. According to the method disclosed by the invention, nanoscale spatial resolution, direct imaging and quantitative analysis of Al-pair in ZSM-5 (Zeolite Socony Mobil-5) can be realized.

The utility model discloses a visual tactile sensor, and relates to the technical field of visual tactile sensors, the visual tactile sensor comprises a mechanical part and an optical part, the mechanical part comprises a transparent elastic body and a transparent support body supporting the transparent elastic body; the transparent elastomer is provided with a mark point pattern and a reflection pattern; the optical component comprises a light source, a camera and a light filtering device; the light filtering device is configured to filter reflected light of the transparent elastomer so as to inhibit image information of the mark point pattern; the camera is configured to be capable of simultaneously receiving a first picture and a second picture, the first picture is a direct imaging picture for the transparent elastomer, and the second picture is a picture for imaging the transparent elastomer through the light filtering device. According to the utility model, lossless texture information and accurate multi-dimensional force information can be synchronously obtained in real time at the same time.

The embodiment of the utility model provides a kind of water cooling system and laser direct imaging equipment, it is related to laser direct imaging equipment technical field.The water cooling system of laser direct imaging equipment includes water cooling machine, water cooling part and temperature regulating device.Water outlet main pipe and water inlet main pipe are connected on water cooling machine.Multiple water cooling parts are respectively installed on multiple heat-generating parts.Water cooling part is communicated with water outlet main pipe by first branch pipe.Water cooling part is also communicated with water inlet main pipe by second branch pipe.Temperature regulating device is installed on water cooling part.Temperature regulating device is used to adjust the temperature of cooling water into water cooling part.The utility model can adopt a set of water cooling machine to carry out accurate temperature control to multiple heat-generating components in laser direct imaging equipment simultaneously, improve equipment stability, without multiple water cooling machine equipment, reduce equipment cost.

This invention relates to the field of industrial visual inspection technology and discloses a visual inspection device for surface defects of stator and rotor laminations after fine grinding. It aims to solve the problems of neglecting burr detection on the lamination surface of existing stator laminations, and the issues of reflective interference, efficiency bottlenecks, and difficulty in balancing reliability and high cycle time in double-sided inspection. The device includes a conveying component, a support frame, a limiting component, a visual recognition component, and a projection lamp. By vertically conveying and positioning the motor stator and rotor laminations and fixing them with a V-shaped clamp, combined with a dual inspection method of projected shadows and direct imaging of the lamination surface, it overcomes reflective interference and reduces the risk of false positives and missed detections. The visual inspection sensor dynamically scans to achieve continuous inspection, improving inspection cycle time and throughput, adapting to large-scale online production, avoiding missed detections, preventing insulation damage during lamination, and ensuring motor efficiency, reliability, and service life.

The present invention discloses an adjusting lens group and method for improving illumination uniformity, including an adjusting lens group for improving illumination uniformity. The lens group includes a first lens, a second lens, a lens barrel, an optical fiber fixing seat, and a three-dimensional adjusting mechanism. Both the first lens and the second lens are plano-convex lenses. The first lens and the second lens are respectively arranged in lens mounts, and the lens mounts are arranged in the lens barrel, and the convex surfaces of the two lenses are arranged opposite to each other. An optical fiber installation lens barrel is arranged at the upper end of the lens barrel, and the optical fiber fixing seat is installed in the optical fiber installation lens barrel. The three-dimensional adjusting mechanism is arranged between the optical fiber installation lens barrel and the optical fiber fixing seat. The three-dimensional adjusting mechanism includes a tightening nut, a fixing nut, and a ball head hexagon adjuster. The adjustment method of the lens group is simple and has low cost, so as to solve the problems in the existing laser direct imaging lithography system, such as uneven energy distribution of the exposure spot and reduced product yield due to unstable light output of the fiber laser and insufficient adjustment accuracy.

The invention relates to a method for manufacturing a wiring substrate, and yield in manufacturing the wiring substrate is improved. The method for manufacturing a wiring board includes the steps of: preparing two first support substrates (SP1) having one or more product regions; forming a first laminated part (10) including a first conductor layer and a first insulating layer in the area of the product region on the first surface (SP1a) of each first support substrate; the second surfaces (SP1b) of the two first support substrates face each other in the thickness direction of the first support substrates, and a second build-up section (20) is formed on the opposite side of each first build-up section from the first support substrates. The method for manufacturing a wiring board includes: forming a conductor pattern by forming a first resist layer having a first resist pattern; the first resist layer is exposed by direct imaging exposure, and the minimum value of the wiring width and the minimum value of the wiring interval of the wiring of the first conductor layer are smaller than the minimum value of the wiring width and the minimum value of the wiring interval of the wiring of the second conductor layer.

An air treatment device for laser direct imaging lithography equipment comprises a filter component, a temperature control and dehumidification component, and a fan component arranged in sequence from the outside to the inside. Operation of the fan component forms a positive pressure inside the air treatment device, and external air is sequentially drawn into the filter component and the temperature control and dehumidification component under the action of the air pressure difference to achieve cleanliness, temperature control, and dehumidification. The device comprises an air return port, which is located at the bottom of the filter component and can promote the circulation and replacement of air inside the laser direct imaging lithography equipment and the air inside the air treatment device. The device comprises a thermal insulation component, which is located outside the temperature control and dehumidification component and can achieve thermal insulation for the temperature control and dehumidification component. The present invention can integrate temperature, humidity, and cleanliness control functions, has a reasonable arrangement, and can operate efficiently, thereby ensuring the safe, reliable, and stable operation of the laser direct imaging lithography equipment.

The application discloses a dielectric high-space-resolution trap imaging method and system based on a scanning probe microscope, and the method comprises the following steps: recording a sample surface topography image sequence and a surface potential image sequence after removing a voltage; correcting image offset according to the surface topography image sequence, and extracting surface potential decay data of each pixel point from the corrected surface potential image sequence; determining trap distribution information of each pixel point by fitting and calculation according to the surface potential decay data of each pixel point; and forming deep and shallow trap energy level peak value images and / or deep and shallow trap density peak value images corresponding to the film surface topography according to the trap distribution information of all pixel points and the original positions of the pixel points. The method directly images the trap characteristics of a sample at a nanometer scale, and has the advantages of high spatial resolution and intuitive comparison.

A direct imaging system includes an optical modulator having multiple elements arranged corresponding to a sub scanning direction and for modulating light from a light source, and an exposure head for exposing the substrate with the light modulated by the optical modulator. A control part relatively moves the exposure head in a main scanning direction to expose the sub exposure area with the light modulated using a selection element, and after the sub exposure area is exposed, relatively moves the exposure head an amount corresponding to a sub exposure width in the sub scanning direction. Accordingly, exposure can be continued even if there is a defect in the optical modulator.

1. Name of the designed product: laser direct imaging machine. 2. Use of the designed product: advanced equipment used in the manufacturing process of printed circuit board (PCB). 3. Design points of the designed product: in shape. 4. Picture or photo that best indicates the design points: perspective view.

The invention discloses a flexible circuit board for a microchip and a preparation method thereof, and the method comprises the following steps: selecting a processed composite flexible substrate, and carrying out the surface modification of the composite flexible substrate, so as to obtain a preliminary circuit board; sequentially coating high-adhesion photoresist and high-resolution photoresist on the surface of the primary circuit board, and performing pattern exposure on the primary circuit board coated with the two layers of photoresist by adopting a laser direct imaging technology; carrying out curing treatment on the exposed photoresist layer through a hot pressing process; and forming a conductive layer in the circuit pattern area to prepare the flexible circuit board. According to the invention, the technical problem of circuit processing misalignment of the flexible circuit board in the prior art is solved.

A radiotherapy treatment apparatus for imaging and treating a patient, comprising: a radiotherapy system comprising a treatment radiation source configured to perform radiotherapy treatment of a patient by directing treatment radiation towards the patient, wherein the patient is located substantially within a treatment region defining a longitudinal axis, wherein the treatment radiation source is moveable with respect to the longitudinal axis to thereby enable a selection of a treatment direction in preparation for radiotherapy treatment of the patient; an imaging system comprising an imaging radiation source and a radiation detector, wherein the imaging radiation source is moveable with respect to the longitudinal axis and is arranged to direct imaging radiation towards the patient in an imaging direction, and wherein the radiation detector is arranged to measure the imaging radiation after interaction of the imaging radiation with the patient, wherein the radiation detector comprises one or more photon counting detector arrays defining a sensitive area of the radiation detector, and wherein the imaging system is configured to generate multi-spectral images of the patient based on measurements of the imaging radiation by the one or more photon counting detector arrays.

A laser scanning imaging device of PCB laser direct writing forming equipment comprises a laser generating and processing unit used for generating single-mode laser and emitting the single-mode laser to a first light beam needed by PCB direct imaging after collimation and focusing; a first galvanometer assembly; the first galvanometer assembly comprises a first galvanometer and a first rotating shaft for driving the first galvanometer to rotate, and is used for deflecting the laser incident at a set angle back and forth and emitting a first light beam; the second galvanometer assembly comprises a second galvanometer and a second rotating shaft used for driving the second galvanometer to rotate, the second galvanometer assembly is used for reflecting the first light beam, and the first light beam forms a one-dimensional image on the second galvanometer; and a rotating surface formed when the first rotating shaft rotates is perpendicular to a rotating surface formed when the second rotating shaft rotates. The utility model has the advantages that the image grid precision can be improved, and the gradient of the line edge after exposure can be improved.

The invention provides a solder mask roll-to-roll direct imaging device, the device comprises a roll loading station, an exposure station and a rolling station, the roll loading station and the rolling station are provided with a material receiving mechanism and a constant tension feeding mechanism, the material receiving mechanism is used for adsorbing and positioning to assist material receiving, and the constant tension feeding mechanism conveys materials with protective films removed through longitudinal movement; the exposure station adopts a multi-coordinate fusion positioning exposure machine which is calibrated and aligned from an alignment coordinate system, an exposure coordinate system, a calibration coordinate system and a world coordinate system to a reference coordinate system. According to the direct imaging equipment, reel-to-reel arrangement is adopted, the material receiving mechanism and the constant tension mechanism provide stable material supply, the exposure station adopts the exposure machine for multi-coordinate fusion positioning, the laser photoetching machining precision is guaranteed, the overall productivity is improved through multi-column arrangement, and popularization and application in the laser machining field or the submicron photoetching field are facilitated.

To provide a direct drawing type exposure device which can sufficiently remove dust even there is irregularity on surfaces of a substrate and a stage, and can improve exposure quality.SOLUTION: When a stage 6 on which a substrate W is mounted is moved by a stage movement mechanism 61, and the substrate W passes through an irradiation area irradiated with light of an exposure pattern by each exposure head 1 provided with spatial light modulators 3, exposure is performed. After a predetermined times of exposure, a main sequence program 72 moves the stage 6 in the state where the substrate W is not mounted, a negative pressure by a suction source 82 acts on and sucks a slit 810 of a nozzle 81 held at a predetermined distance d by a nozzle position adjustment mechanism 83, and dust P attached to a groove 601 and a hole 602 of the stage 6 is sucked and removed.SELECTED DRAWING: Figure 1

The invention discloses a high-performance perovskite X-ray detector based on a covalent organic framework and a preparation method of the high-performance perovskite X-ray detector, the structure of the detector comprises a COFs (Covalent Organic Frameworks) perovskite composite thin film absorption layer, and the COFs perovskite composite thin film absorption layer is formed by mixing a perovskite precursor, an organic solvent and a COFs (Covalent Organic Frameworks) material. The preparation method comprises the following steps: firstly preparing the electron transport layer, then preparing the COFs perovskite composite film absorption layer on the electron transport layer, and then preparing the hole transport layer and the metal electrode layer in sequence. The method is simple in process, the COFs are used as a carrier for perovskite recrystallization, then the high-density and low-defect perovskite thin film is constructed, the density and mechanical strength of the perovskite thin film can be improved, the quality and structural stability of the perovskite thin film are improved, the COFs are applied to assembly and integration of a perovskite X-ray direct imaging detector, and the performance of the perovskite thin film is improved. And the photoelectric conversion efficiency and the stability of the device can be greatly improved.

The invention discloses an adjusting lens group and method for improving illumination uniformity, the adjusting lens group for improving illumination uniformity comprises a first lens, a second lens, a lens barrel, an optical fiber fixing seat and a three-dimensional adjusting mechanism, the first lens and the second lens are plano-convex lenses, the first lens and the second lens are respectively arranged in the lens base, the lens base is arranged in the lens barrel, convex surfaces of the two lenses are oppositely arranged, the optical fiber mounting lens barrel is arranged at the upper end of the lens barrel, the optical fiber fixing base is mounted in the optical fiber mounting lens barrel, and the three-dimensional adjusting mechanism is arranged between the optical fiber mounting lens barrel and the optical fiber fixing base. The three-dimensional adjusting mechanism comprises a screwing nut, a fixing nut and a bulb hexagonal adjuster; the adjustment method of the lens group is simple and low in cost, so that the problems of non-uniform exposure light spot energy distribution, low product yield and the like caused by unstable light emission and insufficient adjustment precision of the optical fiber laser in the existing laser direct imaging photoetching system are solved.

The invention discloses a multi-exposure offset method for improving PCB ink color difference and a medium. The multi-exposure offset method comprises the following steps: preparing a PCB substrate coated with ink; determining the power ratio of a plurality of lasers in the laser direct imaging equipment; an exposure parameter set corresponding to the multiple exposure modes is established, the exposure parameter set at least comprises an exposure dose parameter and an exposure starting point offset parameter, and the total exposure dose of the multiple exposure modes is equivalent to the single exposure dose required for improving the chromatic aberration target; based on the exposure parameter set, the laser direct imaging equipment is controlled to execute at least two times of exposure operation on the same target pattern area on the PCB substrate, and the starting point positions of the exposure operation are different from one another. According to the invention, multiple exposure is carried out by setting different starting points for the same pattern area, so that the light path energy is dispersed and homogenized, the chromatic aberration in PCB ink exposure is efficiently compensated, and the product yield is improved.

An optical element for augmented reality and other devices is described. The optical element includes a multilayer waveguide, an in-coupling element for directing imaging light into the multilayer waveguide, and an out-coupling element spaced apart from the in-coupling element for directing light out of the multilayer waveguide to form a virtual image in the viewing field of an observer. The out-coupling element is a diffractive optical element that includes two or more diffractive grating layers that differ in refractive index. Inclusion of multiple diffraction grating layers in the out-coupling element leads to an improvement in the brightness uniformity of virtual images produced by imaging light spanning a wide range of incidence angle.

The invention relates to a brain region positioning magnetic resonance data processing method based on nerve stimulation target optimization, and the method comprises the steps: obtaining the functional magnetic resonance imaging data of a subject, extracting the signal response sequence of each brain region before and after nerve stimulation through time domain analysis, and determining the brain region with a characteristic response time window according to the response delay difference; the method comprises the following steps: detecting delayed oscillation characteristics in a cortex signal based on a neural feedback relationship between a cortex region and a deep structure to determine potential regulatory pathways of thalamus and other deep brain regions so as to position indirect stimulation targets which cannot be directly imaged; decoupling analysis of cerebral blood flow signals and nerve activation signals is carried out on the candidate brain area, and when it is detected that blood flow fluctuation exists in the area but synchronous nerve activation is lacked, it is judged that the area is a pseudo activation area and excluded; according to the method, the time delay correlation degree between the stimulation sequence and the brain region signal is calculated through the improved cross-correlation integral function, and the high-frequency noise interference is suppressed in combination with the nonlinear attenuation item, so that the estimation of the brain region response delay is more stable and repeatable.

1. Name of the designed product: Scientific camera (GLORIA 4.2 Plus). 2. Use of the designed product: The designed product is used for microimaging, for capturing biophoton correlation fluorescence spectroscopy, for direct imaging in high-energy physics, for recording astronomical phenomena such as solar physics, orbit tracking, etc. in experiments in cell biology and electrophysiology. 3. Design points of the designed product: in shape. 4. Picture or photograph best indicating the design points: perspective view.

To improve a yield in manufacture of a wiring board.SOLUTION: A method for manufacturing a wiring board includes: preparing a glass substrate GS1 including one or a plurality of product areas; and laminating a conductor layer and an insulation layer over the product area on the glass substrate GS1, and thereby forming a build-up part. The method includes: preparing a glass substrate GS1 curved in a projecting state, on the side of one surface GS1A; and alternately laminating three or more conductor layers and three or more insulation layers only on the one surface GS1A of the glass substrate GS1, wherein each product area has a rectangular shape, the lamination of the conductor layer includes forming a resist layer having a resist pattern, and forming a conductor pattern, minimum values of a wiring width and a wiring interval of the conductor pattern are 2 μm or less, and the formation of the resist layer having the resist pattern includes exposing a resist layer by direct imaging exposure.SELECTED DRAWING: Figure 3A

The invention discloses an LCD photoelectric board outer layer circuit pattern generation and precision single-point compensation method, circuit patterns of all PCS key pattern positions are generated at a time through a CAM software automation script, consistency compensation is carried out, all PAD, circuits, golden fingers, MARK and the like are compensated in one mode, but the requirement for the patterns of a photoelectric board is very high, and the problem that the PAD, the circuits, the golden fingers, the MARK and the like cannot be compensated in one mode is solved. Single-point compensation is carried out on the T disk positioned by the COF, the loss of pattern precision is reduced during etching, and the influence of the pattern precision is smaller; a laser direct imaging technology and a negative film technology are used, and a fixed pre-amplification coefficient is set in a design stage, so that errors in the manufacturing process are reduced, and the yield is improved; through exposure and development of data subjected to single-point compensation, the etching process can be better controlled, so that the COF spacing is more accurate, and smooth proceeding of subsequent procedures is facilitated.

To improve a yield in manufacture of a wiring board.SOLUTION: A method for manufacturing a wiring board includes: preparing two first support substrates SP1 including one or a plurality of product areas; forming a first build-up part 10 including a first conductor layer and a first insulation layer over the product area on first surfaces SP1a of the first support substrates SP1; and making second surfaces SP1b of the two first support substrates SP1 face each other in a thickness direction of the first support substrate SP1, and forming a second build-up part 20 on a side opposite to the first support substrates SP1 of the first build-up parts 10, and includes: forming a first resist layer having a first resist pattern and forming a conductor pattern, and exposing the first resist layer by direct imaging exposure, wherein a minimum value of a wiring width of wiring and a minimum value of a wiring interval in the first conductor layer are smaller than a minimum value of a wiring width of wiring and a minimum value of a wiring interval in a second conductor layer.SELECTED DRAWING: Figure 2L

The invention provides a material roll buffering device, a material roll buffering method and roll-to-roll direct imaging equipment, and belongs to the field of laser processing. The material coil buffering device comprises a material coil bottom plate, a material coil side plate, a material coil air expansion shaft module, a plurality of inertia fixing wheel sets, a material coil adsorption material receiving module, a separating and combining film fixing wheel set, a protective film adsorption material receiving module, a protective film air expansion shaft module and a buffering tension wheel module. The reel-to-reel direct imaging equipment comprises a reeling station, an exposure station and a reeling station, the exposure station adopts multi-coordinate fusion calibration, the exposure positioning precision is compensated and corrected by adopting a vector diagram position, and the exposure precision is improved. According to the device and method, through constant-tension feeding and material caching, the feeding or collecting progress and precision of the material coils can be effectively controlled, the equipment alignment precision is high, the high-precision exposure machining yield and efficiency are guaranteed, and application and popularization in the laser machining field are facilitated.

A direct imaging system includes an ultraviolet radiation source configured to irradiate a first region having a first width of a layer of photoreactive material on a substrate with patterned ultraviolet radiation. A thermal energy source is configured to heat a second region of the photoreactive material layer when the ultraviolet radiation source irradiates the first region. The second region contains a portion of the first region and has a second width less than the first width.

A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas formed on surface, and forming a build-up part including conductor layers and insulating layers on the surface of the substrate across the product areas. The product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers such that each insulating layer has elongation rate of 7% or more, the laminating the conductor layers includes forming a resist layer having a resist pattern and forming a conductor pattern including wirings according to the pattern such that the wirings have minimum width of 2 μm or less and minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.

A method for manufacturing a wiring substrate includes forming a build-up part including conductor layers and insulating layers across one or more product areas on a support substrate such that the one or more product areas have a rectangular shape with each side in a range of 80 mm to 240 mm. The forming the build-up part includes forming a resist layer having a resist pattern and forming a conductor pattern according to the resist pattern, and forming wirings in the conductor pattern such that the wirings have a minimum width of 2 μm or less and a minimum inter-wiring distance of 2 μm or less, and the forming the resist layer having the resist pattern includes exposing the resist layer by direct imaging exposure.

The invention discloses a device and a method for testing defocused spots and color deviation of an optical lens, and solves the problems that the testing precision is low and the spectral range of a tested optical system is limited due to the dependence on human eye observation, and the existing testing device is complicated to install and debug and low in testing efficiency. The CCD detector is used as an imaging unit, imaging testing can be carried out on the optical lens to be tested in the whole spectrum range, the energy distribution characteristics of the defocused spots of the optical lens can be truly reflected, and the actual application requirement of an optical system is met. The target surface of the CCD detector is directly imaged, high-precision and high-efficiency measurement of the defocused spots and the color deviation can be realized in cooperation with image processing software and a corresponding algorithm in the controller, and the measurement precision can reach 0.3 mu m.