Method for making high alignment printed circuit board

Abstract

The invention relates to a method for making a high collimation printed circuit board, comprising the following steps: step 1. providing a plurality of internal layer core plates, and printing circuitpatterns to be made onto the internal layer core plates by adopting a laser direct imaging technique; step 2. etching the internal layer core plates printed with the circuit patterns; step 3. respectively arranging two identifying targets for punching holes on the internal layer core plates in the long direction and short direction of the surfaces of the etched internal layer core plates, monitoring the expansion and shrinkage values of four identifying targets of the internal layer core plates by using a machine, and then partitioning the internal layer core plates according to the expansionand shrinkage values; step 4. matching and overlaying the plurality of internal layer core plates according to the partitions; and step 5. arranging six compensation targets and a central target on the internal layer core plates of odd layers or even layers, then pressing the plurality of overlaid internal layer core plates and drilling target holes by adopting a target drilling mode of six-pointcompensation method. With the method, the quality of the printed circuit board products can be effectively monitored, so that the invention is propitious to the improvement of the alignment of the printed circuit boards.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a printed circuit board with high alignment. Background technique [0002] As electronic products become lighter, thinner, shorter, smaller and multifunctional, the printed circuit boards used in these electronic products also become more precise. Under this trend, the number of layers of printed circuit boards involved is getting higher and higher, the electrical performance requirements of finished printed circuit boards are becoming more and more stringent, and the requirements for interlayer alignment are getting higher and higher. The existing graphics transfer is to use astigmatism or parallel light exposure machine to expose the graphics on the film, so that the graphics on the film are transferred to the board, but due to the influence of film expansion and contraction, the accuracy of the coincidence control is low, only ± ...

AI Technical Summary

Problems solved by technology

The existing graphics transfer is to use astigmatism or parallel light exposure machine to expose the graphics on the film, so that the graphics on the film are transferred to the board, but due to the influence of film expansion and contraction, the accuracy of the coincidence control is low, only ± 50um

like Figure 4 , 5 As shown, the existing two-point compensation method for drilling target holes in laminated layers adopts the working principle of setting two compensation targets 200, 300 and a central target 400 on the inner core board 100, The center target 400 and the two compensation targets 200 and 300 are L-shaped, and then use the X-RAY drilling target machine to compensate the distance between the two compensation targets in the X-axis or Y-axis direction in half. target hole, Figure 5 Among them, 500 is the theoretically designed target graphic coordinates, 600 is the graphic coordinates of the scheduled drilling target, and 700 is the target graphic coordinates on the inner core board, but the two-point compensation method has a high probability of layer deviation, And the target accuracy is only ±50um

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