Manufacturing process for step circuit of PCB (Printed Circuit Board)

A printed circuit board and manufacturing process technology, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, can solve problems such as open circuits, excessive notch burrs, and unclean etching, so as to reduce production costs, improve production quality, and speed up production. The effect of production progress

Inactive Publication Date: 2012-08-29
SHENZHEN SUNTAK MULTILAYER PCB
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  • Abstract
  • Description
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Problems solved by technology

[0004] For this reason, the object of the present invention is to provide a kind of manufacturing process of printed circuit board ladder line, to...

Method used

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Embodiment Construction

[0037] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with specific embodiments.

[0038] A manufacturing process of a printed circuit board ladder circuit provided by the present invention specifically includes the following steps:

[0039] A. Grinding and roughening the surface of the copper clad laminate, and then pasting the dry film on both sides of the copper clad laminate. After standing for 15 minutes, perform the first counter exposure and development to expose the thick copper lines and holes;

[0040] Wherein step A specifically includes:

[0041] A1. Roughen both sides of the copper clad laminate through a ceramic grinding machine and a chemical pretreatment combination line;

[0042] A2. Paste the dry film on both sides of the copper clad board and let it stand for 15 minutes;

[0043] A3. Make a positive film containing thin copper circuit graphics and thick copper circu...

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Abstract

The invention discloses a manufacturing process for a step circuit of a PCB (Printed Circuit Board). According to the manufacturing process, different film patterns are adopted twice for manufacturing the circuit, during the primary film pattern circuit manufacture, a positive film circuit pattern is adopted, compensation is carried out a film substrate circuit at different positions according to copper thickness so as to manufacture a special circuit, and sunk copper plate electrification is carried out on the special circuit, so that the copper thickness meets the requirement; then board grinding is carried out by a twice board grinding mode so as to reduce the copper thickness difference of step positions; a dry film is enabled to be fully combined with the step positions by virtue of a film attaching and air compressing mode; and finally, normal circuit pattern manufacturing is carried out by utilizing a high-precision LDI (Laser Direct Imaging) exposure machine. Compared with the prior art, the manufacturing process for the step circuit can be used for eliminating the defects of open circuit at the position of the step circuit, notches, large deckle edges, serious lateral erosion, halfway etching and poor quality of thin lines and the like existing in the step circuit manufacturing process, improving the production efficiency and the production quality, quickening the production schedule and lowering the production cost.

Description

Technical field: [0001] The invention belongs to the technical field of printed circuit board manufacturing, and specifically relates to a manufacturing process of a printed circuit board ladder circuit. Background technique: [0002] With the development of printed circuit boards in the direction of "light, thin, short and small", the trend of product diversification and modularization is becoming more and more obvious, and the requirements for circuit design and production methods of electronic products are also getting higher and higher. It is necessary to ensure that the circuit has good heat dissipation and precision and reliability, and it is also necessary to ensure that the product performance of all aspects of the circuit meets customer requirements. Therefore, a stepped line appears in the circuit board manufacturing process, and the stepped line refers to the same or multiple lines on the same component surface or soldering surface of the same circuit board with d...

Claims

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Application Information

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IPC IPC(8): H05K3/06
Inventor 张军杰刘东欧植夫宋建远魏秀云
Owner SHENZHEN SUNTAK MULTILAYER PCB
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