751 results about "Thin line" patented technology

In a display device including a capacitive coupling touch panel, reaction to touch with nonconductive input means is achieved, and highly accurate position detection is realized with a small number of electrodes even with a small touch area. X-electrodes and Y-electrodes which intersect with each other via a first insulating layer and a Z-electrode which is in a floating state via a second insulating layer are disposed. For the Z-electrode, a material whose thickness changes by pressing due to touch, such as an elastic conductive material, is used. The Z-electrode is arranged so as to overlap both the X-electrode and the Y-electrode neighboring to each other. A pad portion of the X-electrode has a shape such that an area is maximized in the vicinity of a fine line portion of the relevant X-electrode.

A molded running board provided with a support portion and a top portion is described herein. The support portion is made of plastic material and provided with reinforcing ribs and the top portion is made of a plastic material that is advantageously compatible with the plastic material forming the support portion. A method for the assembly of such a molded running board is also described herein. This method includes the welding of a top portion to a support portion via the use of a thin strand of plastic material compatible with material used in the top portion and the support portion and metallic particles in an electromagnetic press, for example.

In an image processor which converts color image data to image data of cyan, magenta, yellow and black necessary for forming an image, a black character edge is discriminated in R, G, B image data. The edge component in a black character area is deleted by narrowing on image data of cyan, magenta and yellow. Further, in a black character area, K data is replaced with maximum density data in the R, G, B data, and edge emphasis is performed on the substituted data. Then, reproducibility of a thin line portion in a character is improved largely.

An electrical discharge weapon configured as a lightweight, slim profile gun-shaped weapon which is less than one inch thick along the cartridge receiving chamber so that it can be readily placed in a police officer's uniform pocket or in a slim-line holster for easy deployment. All of the major internal components, including battery and transformer, are positioned above or behind the trigger aperture so that even with the dart cartridge in the chamber, the weapon's center of gravity is through the hand so that it is balanced and easily aimed at the target. The invention employs a specially configured chamber to receive a unique cartridge with widely separated darts. As a result, the electrodes may be also widely separated so that current will not jump the electrode gap even when the impacted darts leave a substantial gap to a suspect's skin. Thus, the present invention is more likely to be effective against suspect's wearing thick outerwear. The spent cartridge may be expelled by a spring-activated release for quick ejection and rapid reload. A bottom rail permits connection of another non-lethal device such as a mace canister for use as a secondary weapon or the attachment of tactical lighting or laser aiming devices. A push-on/push-off trigger switch is combined with a mechanical safety device to assure weapon effectiveness and safety for the police officer. Quick disconnect battery clip allows for rapid battery replacement.

A nacelle assembly for a gas turbine engine includes a nacelle, a variable area fan nozzle, a sensor that detects a windmilling condition and a controller that communicates with the sensor. The variable area fan nozzle is moveable between a first position having a first discharge airflow area and a second position having a second discharge airflow area greater than the first discharge airflow area in response to detecting the windmilling condition.

A reversible fuse structure in an integrated circuit is obtained through the implementation of a fuse cell having a short thin line of phase change materials in contact with via and line structures capable of passing current through the line of phase change material (fuse cell). The current is passed through the fuse cell in order to change the material from a less resistive material to a more resistive material through heating the phase change material in the crystalline state to the melting point then quickly quenching the material into the amorphous state. The reversible programming is achieved by passing a lower current through the fuse cell to convert the high resistivity amorphous material to a lower resistivity crystalline material. Appropriate sense-circuitry is integrated to read the information stored in the fuses, wherein said sense circuitry is used to enable or disable circuitry.

A polarization element includes: a base; a plurality of metal thin wires provided on the base along a predetermined alignment axis; and a plurality of protection films covering each of the plurality of metal thin wires. In the element, each of the protection films covers an upper end and both sidewalls of one of the metal thin wires. Further, a width of a part, which is on the upper end of the one of the metal thin wires, of the each of the protection films in a direction of the alignment axis is larger than a width obtained by summing a width of the one of the metal thin wires in the direction of the alignment axis and widths of parts, which are on the both sidewalls of the one of the metal thin wires, of the each of the protection films in the direction of the alignment axis.

The protection films on sidewalls, which are opposed to each other, of the metal thin wires that are adjacent form an air gap.

An image forming apparatus includes an image bearing member configured to bear a toner image on a surface thereof. A charging mechanism is configured to uniformly charge the surface of the image bearing member. An intermediate transfer mechanism is configured to transfer the toner image from the image bearing member onto an image receiver. A cleaning mechanism is configured to clean the surface of the image bearing member after the toner image is transferred onto the image receiver. A lubricant supplying mechanism is configured to supply a lubricant contained therein onto the surface of the image bearing member and form a thin layer using a lubricating blade. The lubricant supplying mechanism is disposed between the cleaning mechanism and the charging mechanism.

The invention discloses a fan-out type 3D packaging structure embedded in a silicon substrate. In the packaging structure, a functional chip is embedded into a groove formed in the front surface of the silicon substrate; vertical conductive through holes are formed in a region outside the groove formed in the front surface of the silicon substrate; the functional chip can be used for conducting electricity to the back surface of the silicon substrate; and a rearrangement wire and a welding ball are arranged on the front surface and back surface of the silicon substrate. The structure has the advantages that the thermal expansion coefficients of the silicon substrate and the chip are close so that the packaging structure has good reliability; the structure can realize 3D packaging interconnection; the silicon substrate is adopted, a thin-line and high-density rearrangement wire can be produced, and the requirements on high-density interconnection can be met; and the packaging structure can relatively easily realize miniaturization and thinness, a preparation method is developed and a process is feasible.

An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.

The invention discloses a preparation method of a high-brittleness transparent rock material test piece. The preparation method comprises the steps of resin material selection, selection of materials for forming three-dimensional prefabricated built-in elliptical cracks, molding and space location. Raw materials comprise CY-39 type resin and YS-T31 type curing agent, wherein the mass ratio of the CY-39 type resin to the YS-T31 type curing agent is 100: 34, or and the volume ratio of the CY-39 type resin to the YS-T31 type curing agent is 100: 41. The preparation method comprises the following general steps: (1) weighing the materials; (2) mixing the materials; and (3) casting, molding and maintaining. Mica plates with the thickness of 0.12mm are used for forming the prefabricated cracks, and an elliptical steel mold with the corresponding size is used for cutting the mica plates into the required accurate size. The preparation method is characterized in that different parts of a left side face plate and a right side face place of the mold are drilled, a thin line is used for pulling, fixing and connecting the prefabricated cracks, the two ends of the thin line are fixed in holes of the two side face plates so as to play a role of accurate location, and three-dimensional crack test pieces with different numbers of cracks at different angles and different opposite locations are manufactured. The test piece prepared by the method has the characteristics of good brittleness, high transparency, easiness for molding and observing crack extension process and the like.

A natural leather having a three-dimensional pattern formed on the surface thereof is provided. The three-dimensionally patterned natural leather permits a minute three-dimensional expression such as small dots and thin lines, is high in the degree of freedom of the three-dimensional pattern, can retain the three-dimensional pattern even with the lapse of time and retain the characteristics peculiar to the natural leather. The three-dimensional pattern is formed by a resin portion which covers by coating the surface of an undercoating layer of the natural leather partially in a pattern shape. The resin portion has a maximum thickness of 20 to 400 μm.

The invention discloses a manufacturing process for a step circuit of a PCB (Printed Circuit Board). According to the manufacturing process, different film patterns are adopted twice for manufacturing the circuit, during the primary film pattern circuit manufacture, a positive film circuit pattern is adopted, compensation is carried out a film substrate circuit at different positions according to copper thickness so as to manufacture a special circuit, and sunk copper plate electrification is carried out on the special circuit, so that the copper thickness meets the requirement; then board grinding is carried out by a twice board grinding mode so as to reduce the copper thickness difference of step positions; a dry film is enabled to be fully combined with the step positions by virtue of a film attaching and air compressing mode; and finally, normal circuit pattern manufacturing is carried out by utilizing a high-precision LDI (Laser Direct Imaging) exposure machine. Compared with the prior art, the manufacturing process for the step circuit can be used for eliminating the defects of open circuit at the position of the step circuit, notches, large deckle edges, serious lateral erosion, halfway etching and poor quality of thin lines and the like existing in the step circuit manufacturing process, improving the production efficiency and the production quality, quickening the production schedule and lowering the production cost.

An image processing apparatus includes a first sensor having a plurality of reading elements arranged in the primary scanning direction, a second sensor disposed in parallel with the first sensor and by a predetermined lines in the secondary scanning direction, an integral correction portion for correcting a time difference of data output due to a position difference between the first sensor and the second sensor by a line unit, and a fractional correction portion for correcting a time difference of data output due to a position difference between the first sensor and the second sensor by a sub line unit. Thus, the correction of the phase shift between element arrays can be performed as precisely as possible and the reproducibility of a black fine line is increased.

The invention provides a forming process of a thin film pattern capable of properly realizing a thin line. The forming process of a thin film pattern of the invention can be a process of forming a thin film pattern by arranging a functional liquid on a substrate P. The process can include a bank forming step to set up banks protrudingly on the substrate corresponding to the thin film pattern, a repellent liquefaction step of imparting a liquid repellent property to the bank by CF₄ plasma processing, and a material arranging step of arranging the functional liquid between the banks imparted with the liquid repellent property.

An interconnect structure that includes a barrier-redundancy feature which is capable of avoiding a sudden open circuit after an electromigration (EM) failure as well as a method of forming the same are provided. In accordance with the present invention, the barrier-redundancy feature is located within preselected locations within the interconnect structure including in a wide line region, a thin line region or any combination thereof. The barrier-redundancy feature includes an electrical conductive material located between, and in contact with, a conductive line diffusion barrier of a conductive line and a via diffusion barrier of an overlying via. The presence of the inventive barrier-redundancy feature creates an electrical path between the via diffusion barrier along the sidewalls of the via and the conductive line diffusion barrier along the sidewalls of the conductive line. This electrical path generated by the inventive barrier-redundancy feature can avoid a sudden open circuit resulting from EM failure at the bottom of the via. The presence of the inventive barrier-redundancy feature within an interconnect structure provides sufficient time for chip replacement or system operation.

A stator for an electric machine includes a generally cylindrically-shaped stator core having a plurality of circumferentially spaced core slots. A stator winding includes a plurality of phases, each including at least a first filar and a second filar extending circumferentially around the stator core to form a plurality of layers. Each of the filars is a conductor having a plurality of slot segments disposed in the core slots. The slot segments are alternately connected at the first and second ends of the stator core by a plurality of end loop segments that may form a cascaded winding pattern. The plurality of filars of each phase alternating radial positions with one another within at least one end loop segment at discreet locations around the stator core such that the average radial position of the slot segments of the first filar conductors is substantially equal to that of the second filar.

In various embodiments, a High Definition (HD) camera may be controlled by one or more motors in a base of the HD camera. Cables and other components may be used to manipulate the HD camera lens through the side arms of the HD camera. Putting the motors in the base may reduce the size of the outer case of the HD camera and add stability. In some embodiments, images from the HD camera may be converted into a serialized stream and transported over a cable from the HD camera. Other components may also be used to increase the functionality of the HD camera.

The invention relates to a ceramic brick manufacturing process with concave-convex polished in-glaze decoration, which comprises the following steps: on the basis of the traditional process, firstly, applying a layer of ground coat and a first layer of transparent glaze on the surface of a green brick; then, printing for 4-7 times on the first layer of transparent glaze; stacking dry powder transparent glaze of which the thickness is 0.7-1.2mm on the printing pigment, and carrying out corresponding distribution according to the printed pattern textures to form concave-convex contour patterns; baking at high temperature of 1200-1230 DEG C, and then, polishing and grinding the plane of the baked green brick by adopting a hard grinding head, wherein the polishing and grinding depth is controlled at 0.1-0.3mm; and polishing and grinding the plane by adopting an elastic soft grinding head, and carrying out micro-polishing treatment on the concave pit surface of the green brick, which sags and can not be processed. The process can enable the surface of a ceramic brick to have bright and clean decorative effect of a polished brick and simultaneously have exquisite textures, thin lines, smooth and hazy tactile sensation and bright and luxuriant color, and the patterns below the glaze layer generate strong visual three-dimensional effect, thereby innovating the style of ceramic brick products.