Inner-layer dry film production method

A production method and inner layer dry film technology are applied in the exposure method of radiation-sensitive masks, the removal of conductive materials by chemical/electrolytic methods, photolithography/patterning, etc., which can solve the difficulty of DDR4 circuit production and processing. The problem of low resolution of the film can be solved, and the effect of reducing the reduction of the resolution of the dry film and the reduction of the exposure cost can be achieved

Inactive Publication Date: 2019-07-19
JIANDING (HUBEI) ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for producing an inner layer dry film to solve the problems of high difficulty in production and processing of DDR4 circuits and low dry film analysis ability proposed in the above-mentioned background technology

Method used

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  • Inner-layer dry film production method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Step 1: Pre-treatment: Carry out roughening pre-treatment in baking and chemical treatment on the surface of the board, remove water vapor and organic volatiles by baking, release internal stress, promote cross-linking reaction, increase the dimensional stability of the board, and chemically stabilize In order to improve the mechanical strength and mechanical strength, chemical substances such as SPS and other acidic substances are used to uniformly erode the copper surface by chemical treatment, remove grease and oxides and other impurities on the copper surface, increase the roughness of the copper surface, and increase the adhesion of the dry film;

[0028] Step 2: Film pressing: first peel off the polyethylene protective film from the dry film, and then paste the dry film resist on the copper clad board under heat and pressure, and the resist layer in the dry film will be changed by heat Soft, increased fluidity, with the help of the pressure of the hot pressing whee...

Embodiment 2

[0034] Step 1: Pre-treatment: Carry out roughening pre-treatment in baking and chemical treatment on the surface of the board, remove water vapor and organic volatiles by baking, release internal stress, promote cross-linking reaction, increase the dimensional stability of the board, and chemically stabilize In order to improve the mechanical strength and mechanical strength, chemical substances such as SPS and other acidic substances are used to uniformly erode the copper surface by chemical treatment, remove grease and oxides and other impurities on the copper surface, increase the roughness of the copper surface, and increase the adhesion of the dry film;

[0035] Step 2: Film pressing: first peel off the polyethylene protective film from the dry film, and then paste the dry film resist on the copper clad board under heat and pressure, and the resist layer in the dry film will be changed by heat Soft, increased fluidity, with the help of the pressure of the hot pressing whee...

Embodiment 3

[0041] Step 1: Pre-treatment: Carry out roughening pre-treatment in baking and chemical treatment on the surface of the board, remove water vapor and organic volatiles by baking, release internal stress, promote cross-linking reaction, increase the dimensional stability of the board, and chemically stabilize In order to improve the mechanical strength and mechanical strength, chemical substances such as SPS and other acidic substances are used to uniformly erode the copper surface by chemical treatment, remove grease and oxides and other impurities on the copper surface, increase the roughness of the copper surface, and increase the adhesion of the dry film;

[0042]Step 2: Film pressing: first peel off the polyethylene protective film from the dry film, and then paste the dry film resist on the copper clad board under heat and pressure, and the resist layer in the dry film will be changed by heat Soft, increased fluidity, with the help of the pressure of the hot pressing wheel...

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PUM

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Abstract

The invention discloses an inner-layer dry film production method in the technical field of printed circuit boards. The method comprises the steps of 1, pre-treatment; 2, film pressing; 3, exposure; 4, development; 5, etching; and 6, film removal. According to the method, direct imaging is carried out in combination with a DI laser exposure machine by adopting a dry film process, and a negative film does not need to be used, so that the exposure cost is greatly reduced, and meanwhile, the dry film analysis capability reduction caused by negative film variation is reduced; after pre-treatment,film pressing, exposure and development parameters are optimized, the dry film analysis capability can reach 40 microns, and 2 / 2mil lines can be massively produced; and the method is an ideal production process of fine lines in current PCB production.

Description

technical field [0001] The invention discloses a method for producing an inner layer dry film, and specifically relates to the technical field of printed circuit boards. Background technique [0002] Due to the rapid improvement of electronic technology, Printed Circuit Board (PCB) DDR3 memory has been the mainstream of the market for quite a long time. The advancement of technology has made DDR3 unable to meet the needs of customers. With the performance of CPU and graphics card Gradually rising, the performance of DDR3 memory has become the performance bottleneck of PCs. The new DDR4 memory has the advantages of higher frequency, lower energy consumption, and stronger performance. DDR4 memory has every reason to usher in the dawn of popularization. However, DDR4 has higher requirements for circuit grade and smaller line width spacing, which increases the difficulty of production and processing, and has higher requirements for dry film analysis ability. Contents of the in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06H05K3/00
CPCH05K3/0082H05K3/061H05K3/064H05K2203/0528H05K2203/056H05K2203/107
Inventor 胡波张业勇田伟刘阳
Owner JIANDING (HUBEI) ELECTRONICS CO LTD
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