41results about "Radiation-sensitive masks exposure" patented technology

The present invention relates to the technical field of PCB board production, and specifically discloses an exposure machine, including an exposure machine body, with feed ports for PCB boards to enter and exit on both left and right sides, the exposure machine body including a bearing system for placing PCB boards, and the exposure machine also including two flip modules disposed on the left and right sides of the exposure machine body and corresponding to the two feed ports one by one, the flip module including a flip frame extending forward and backward along an axis and two conveying roller groups installed on the flip frame. The beneficial effects of the present invention are as follows: each side of the exposure body can be used for loading unexposed PCB boards, loading single-sided exposed PCB boards, and unloading double-sided exposed PCB boards. There is no need to set a transplanting device outside the exposure machine body to transfer single-sided exposed PCB boards, thus saving space. The flipping time, loading and unloading time, especially the loading and unloading time which takes a long time, are used to perform synchronous work, thus saving time and improving work efficiency.

The application discloses a kind of composite insulating circuit board with ceramic filler reinforcing layer and preparation method thereof, belong to circuit board preparation technical field.The kind of composite insulating circuit board with ceramic filler reinforcing layer, comprising the following steps: step one: after drying, ceramic filler is added to silane coupling agent mixed solution, stirring mixes, dry, obtain pretreated ceramic filler;Step two: pretreated ceramic filler, modified composite resin, curing agent and N, N-dimethylformamide are added to reaction container, stirring, grinding, obtain mixed slurry;Step three: mixed slurry is coated on the surface of metal substrate, solidification treatment, cover copper foil, form metal substrate-mixed slurry-copper foil structure, high temperature and high pressure treatment, make circuit diagram, surface oxidation resistance treatment, obtain a kind of composite insulating circuit board with ceramic filler reinforcing layer.The circuit board prepared by the method has excellent dielectric properties and heat resistance.

The embodiment of the invention provides a method for processing a thick metal layer on the surface of a printed circuit board, and the method comprises the steps: coating the surface of the printed circuit board with solder resist ink, and forming a solder resist ink layer; removing the solder resist ink in a target area on the solder resist ink layer through optical exposure and development treatment, and then curing the solder resist ink layer; the surface of the solder resist ink layer is coated with a flowing protection object, flowing filling treatment is conducted on the surface of the solder resist ink layer, a flat temporary protection layer is formed, and then the flowing protection object in a target area on the temporary protection layer is removed; pasting a dry film on the surface of the temporary protection layer to form a dry film layer; removing the dry film in the target area on the dry film layer through optical exposure and development treatment; manufacturing a metal layer in the target area so as to form the metal layer in the target area on the surface of the printed circuit board; and removing the dry film and the temporary protection layer. The method solves the problems that in the prior art, machining efficiency is low, machining precision is poor, and foreign matter anti-sticking is likely to be caused.

The present invention discloses a double-sided exposure device and method for high-density circuit boards. The double-sided exposure device includes a workbench and a frame fixed on the workbench. The upper surface of the workbench is provided with an X-axis moving mechanism. The X-axis moving mechanism includes two grooves opened on the upper surface of the workbench and parallel to each other. Each of the grooves is provided with an X-axis linear module. The slide of each X-axis linear module is provided with a fixed plate. The upper surface of the fixed plate is provided with a circuit board rotating assembly and a Y-axis moving mechanism. The present invention can realize double-sided exposure of high-density circuit boards. After the front of the circuit board is exposed, the circuit board does not need to be removed. The circuit board can be turned over to realize exposure of the back of the circuit board. The circuit board fixing frame can realize rapid support and fixation of the circuit board. The mask plate fixing frame quickly installs the mask plate, thereby improving the working efficiency of circuit board exposure. The entire exposure equipment structure is simple and low-cost.

The invention relates to a control method for preventing skip plating in PCB electroless gold plating, which is characterized in that a deburring process is added before needle brush treatment in a board grinding process in an electroplating process, three groups of needle brush board grinding processing are adopted, and grinding crack parameters, water breaking parameters and board surface roughness in the electroplating process, a circuit process and a solder mask process are respectively controlled. Key process parameters are controlled in the copper deposition and electroplating processes, angle parameters and pressure parameters of a hole plugging cutter are controlled in the hole plugging process, grinding crack parameters, micro-etching amount, sand blasting sand content and water breaking parameters are controlled in the chemical gold pretreatment process, and key process parameters in the whole chemical gold process are controlled; and in the chemical gold post-treatment procedure, the plate placing speed, the pickling concentration, the liquid medicine spraying pressure parameter, the ultrasonic power and the drying temperature are controlled. Through a series of control, compared with an existing technological method, the production qualification rate is increased by 24-30%. According to the invention, the production cost is reduced, the product quality is improved, and the quality guarantee is provided for users.

An apparatus for exposing a printing plate including at least a front source array of LEDs that emits a radiation field incident on the front side of the plate and a back source array of LEDs that emits a radiation field incident on the back side of the plate. A controller connected to the front source and the back source causes movement of at least the front radiation field relative to the plate fixed on a substrate that receives the printing plate in a fixed configuration between the front source and the back source. The apparatus commences a first exposure step of one side of the plate with one of the sources and then a second exposure step of the opposite side of the plate with the other source, imposing a user-definable time delay (t) between commencing the first exposure step and commencing the second exposure step.

The present invention provides a method for manufacturing a six-layer high-frequency hybrid circuit board, comprising the following steps: inner layer → lamination → ceramic grinding → primary dry film → primary micro-etching and copper reduction → primary resin grinding → primary drilling → primary electroplating → resin plugging → secondary resin grinding → secondary micro-etching and copper reduction → tertiary resin grinding → secondary electroplating → outer layer dry film → outer layer etching → AOI → solder mask → secondary drilling → profiling → testing → AVI → nickel-palladium-gold (NPG) → packaging. During the primary dry film step, the L6 surface is fully covered with dry film and exposed without removing the protective film. Both the primary and secondary micro-etching and copper reduction steps utilize an etching machine for copper reduction. This improves the manufacturing process, enhances copper reduction uniformity, prevents resin exposure at the surface plugging and capping, and enhances the quality of the hybrid circuit board.

The invention relates to the technical field of electronic packaging, in particular to a frame layer of a circuit board and a manufacturing method thereof, and the method comprises the steps: providing a metal plate, carrying out the pattern etching of the upper and lower surfaces of the metal plate, reserving metal with a preset thickness at an etching position during the pattern etching, forming a rib reserving layer, and obtaining an etched metal plate; laminating a first insulating material on the upper and lower surfaces of the etched metal plate to form a first laminated plate, laminating a second insulating material on the upper and lower surfaces of the first laminated plate to form a second laminated plate, and performing pattern etching on the upper and lower surfaces of the second laminated plate according to a preset pattern to obtain the metal frame layer. The method comprises the following steps: performing pattern etching and rib reserving on a metal plate to obtain an etched metal plate, performing lamination of a first insulating material and a second insulating material on the etched metal plate to form a second laminated plate, and performing pattern etching on the upper surface and the lower surface of the second laminated plate to obtain a metal frame layer. Therefore, the metal plate is used for replacing the frame layer of the circuit board, and the metal frame layer is efficiently formed.

This invention discloses a lamination process for multilayer circuit boards, relating to the field of multilayer circuit board lamination technology. The process includes the following steps: material preparation, preparing the materials required for lamination of the multilayer circuit board, including a substrate, a conductive layer, a non-conductive layer, and an insulating layer. The substrate can be copper foil, the conductive layer can be gold or silver, the non-conductive layer can be fiberglass cloth, and the insulating layer can be epoxy resin. This multilayer circuit board lamination process employs high-precision automated equipment and a precision control system, achieving precise control of the lamination process, improving interlayer alignment and lamination quality, reducing scrap rate, and minimizing problems such as poor interlayer alignment, residual bubbles, and resin voids. Furthermore, this process can well adapt to the needs of new materials and complex designs, supporting the manufacturing of circuit boards with higher layer counts and smaller line widths and spacings, and can promote the development of electronic products towards miniaturization, lightweighting, and high performance.

The invention discloses a circuit board jump layer blind hole manufacturing method, a circuit board and electronic equipment, a target inner layer circuit layer of a target circuit board to be manufactured is provided with a laser target used for calibrating the position of a jump layer blind hole, a first window is formed in the target circuit board, the laser target is exposed, a first mask layer is formed on a surface layer circuit layer, and a second window is formed on the surface layer circuit layer; taking the laser target as position calibration, exposing and developing the first mask layer, forming a second window corresponding to the jump layer blind hole on the first mask layer, exposing the surface circuit layer, removing part of the surface circuit layer exposed by the second window, exposing the base material, and taking the laser target as position calibration; laser drilling is adopted to remove part of the target circuit board at the same position of the second window, form a third window, expose the target inner circuit layer, remove the first mask layer, form a metal coating on the inner wall of the third window, and form a jump layer blind hole for connecting the surface circuit layer and the target inner circuit layer, so that the position precision of the jump layer blind hole can be improved, and the quality of the product is improved. And the quality of the circuit board is improved.

The invention relates to the technical field of PCB (Printed Circuit Board) mixed-pressing stack-up structure, in particular to a method for simplifying PCB mixed-pressing stack-up structure design, which comprises the following steps of: accurately positioning and cutting a CCL supplied material, positioning and cutting the CCL to a uniform size, cleaning a board surface, covering photosensitive ink, curing, exposing, developing, etching to form a required pattern, manufacturing an inner-layer circuit pattern, browning an inner-layer board, fusing and riveting, and then, manufacturing a printed circuit board. And pressing according to parameters. According to the method, the exposure energy parameters are optimized, so that the precision of the PCB circuit pattern is accurately controlled, the definition and the accuracy of the circuit pattern are ensured, the qualified rate of a conduction test, an insulation test and AVI scanning of a PCB product is remarkably improved by the optimal exposure energy value determined by an experiment, the reliability and the stability of the product are improved, and the product quality is improved. 6 lattices and 7 lattices are used as optimal exposure energy values, so that the product quality is ensured, the stability and the cost effectiveness in the production process are also considered, and the production cost is reduced and the production efficiency is improved.

An apparatus for exposing a printing plate including at least a front source array of LEDs that emits a radiation field incident on the front side of the plate and a back source array of LEDs that emits a radiation field incident on the back side of the plate. A controller connected to the front source and the back source causes movement of at least the front radiation field relative to the plate fixed on a substrate that receives the printing plate in a fixed configuration between the front source and the back source. The apparatus commences a first exposure step of one side of the plate with one of the sources and then a second exposure step of the opposite side of the plate with the other source, imposing a user-definable time delay (t) between commencing the first exposure step and commencing the second exposure step.

A method for producing a flexible printed wiring board using a photoresist includes placing the photoresist, including a first region and a second region, on a substrate, placing a first photomask including a first light-transmitting portion such that the first light-transmitting portion faces the first region to expose the photoresist through the first light-transmitting portion, and placing a second photomask including a second light-transmitting portion such that the second light-transmitting portion faces the second region to expose the photoresist through the second light-transmitting portion. The first region is adjacent to the second region such that an edge portion of the first region overlaps an edge portion of the second region. The first light-transmitting portion has a linear shape including a first tip having a tapered shape.

Methods for filling a recessed feature on a substrate employing metal sequential infiltration synthesis processes are disclosed. The disclosed methods include forming an organic layer within a recessed feature and introducing metal species into the organic layer to allow the formation of a metal seed layer. A bulk metal layer can subsequently be formed from the metal seed layer to fill the recessed feature.

The present invention relates to the field of circuit board manufacturing, and more particularly to a method for manufacturing an embedded substrate with a cavity embedded in a base material layer. The method for manufacturing an embedded substrate with a cavity embedded in a base material layer provided by the present invention differs from conventional drilling methods, which can only produce circular embedded cavities. Plasma equipment, acting on ABF dielectric materials, can produce embedded cavities of varying sizes and shapes, and thickness control is more effective than laser or mechanical drilling. Furthermore, the present invention overcomes the difficulty of fabricating embedded circuitry in existing base material layers, providing a method for fabricating embedded circuitry in a base material layer, with better control over the width and thickness of the embedded circuitry.

Methods of filling recessed features on a substrate using a metal sequential penetration synthesis process are disclosed. The disclosed method includes forming an organic layer within the recessed feature and introducing a metal species into the organic layer to allow formation of a metal seed layer. A bulk metal layer may then be formed from the metal seed layer to fill the recessed features.

The invention provides a preparation method and application of a PCB deep micropore, and relates to the technical field of PCB manufacturing. Specifically, dry film attachment, exposure, development and etching are sequentially carried out on the surface of a substrate to obtain a circuit pattern on the surface of a dry film, and the dry film and a copper layer at preset positions of deep micropores are removed; laser drilling is carried out on the preset position of the deep micropore through a hole stacking method, and the deep micropore is obtained; and carrying out first copper plating treatment on the deep micropores, then filling resin in the pores, and then carrying out second copper plating treatment to obtain the filled deep micropores. According to the invention, through a specific hole stacking method and an electroplating process, laser drilling and filling of the deep micro-hole with a high aperture and a high depth can be satisfied, no extra requirement for equipment and process parameters is needed, the operation difficulty of the deep micro-hole technology is greatly simplified, and the requirements for electrical performance and reliability of a high-quality PCB product can be met.

The application discloses a kind of exposure methods of gantry double-sided photoetching system, comprising the following steps: assemble PCB assembly, and PCB assembly is placed to gantry upper platform;Gantry upper platform is moved to the position of CCD component, and the alignment camera of upper and lower sides is positioned simultaneously on the upper and lower sides of PCB;Gantry upper platform is moved to the position of photoetching component, and the photoetching lens of upper and lower sides is photoetched simultaneously on the upper and lower sides of PCB;The PCB assembly on the photoetched gantry upper platform returns to original position, and the PCB assembly on the photoetched gantry lower platform repeats steps 1-3 and is photoetched, and the photoetching system of the application only needs to increase a station on the side of equipment, and the photoetching work of two platforms can be crossed;And photoetching component and CCD component are set in upper and lower two, so that two sides photoetching work can be carried out simultaneously on PCB.

A method of manufacturing a printed circuit board having a metallic conductor structure is described. The method comprises: providing a base substrate (101) in the form of a film or sheet, the base substrate having a first substrate side (101a) and a second substrate side, the base substrate being at least partially composed of a non-conductive organic polymer material, the first substrate side (101a) being covered with a covering metal layer (102); and removing the cover metal layer (102) in some regions of the first substrate side (101a). In order to remove the cover metal layer (102), a mask layer (103) is applied to the cover metal layer (102). The mask layer (103) is removed in some regions such that the first substrate side (101a) is divided into at least one first sub-region (104), in which the first substrate side (101a) is covered only by the cover metal layer (102), and at least one second sub-region (105), in which the first substrate side (101a) is covered by the cover metal layer (102) and the mask layer (103). The covering metal layer (102) is then removed in the at least one first sub-region (104). According to the invention, the mask layer (103) is removed by an etching process using an etching solution, and a phase change or a chemical conversion is carried out in the mask layer (103) in the first sub-region (104) prior to the etching process.

Techniques for low- or zero-misaligned vias are disclosed. In one embodiment, a high-photosensitivity, medium-photosensitivity, and low-photosensitivity layer are applied to a substrate and exposed at the same time with use of a multi-tone mask. After being developed, one layer forms a mold for a first via, one layer forms a mold for a conductive trace and a second via, and one layer forms an overhang over the position for the second via. The molds formed by the photosensitive layers are filled with copper and then etched. The overhang prevents the top of the copper infill below the overhang region from being etched. As such, the region under the overhang forms a pillar or column after etching, which can be used as a via. Other embodiments are disclosed.

The application discloses a processing method of a long-service-life flat vibration motor circuit board and belongs to the technical field of circuit board processing. The processing method of the long-service-life flat vibration motor circuit board comprises the following steps: sequentially performing cutting, drilling, electroplating, outer layer circuit manufacturing, gold plating, resistance manufacturing, primary solder mask printing, primary exposure and development, secondary solder mask printing, secondary exposure and development, surface treatment, punching and plate dividing and performance testing on a PCB base material, and a long-service-life flat vibration motor circuit board is obtained. The service life of the flat vibration motor circuit board can be improved by developing a new process line, on the one hand, the rotor self-weight is reduced, on the other hand, the distance between the PCB and the magnetic cylinder is increased, and the magnetic size is reduced, and then the service life of the flat vibration motor circuit board is improved.

The invention discloses a composite insulating circuit board containing a ceramic filler enhancement layer and a preparation method of the composite insulating circuit board, and belongs to the technical field of circuit board preparation. A preparation method of the composite insulation circuit board containing the ceramic filler enhancement layer comprises the following steps: step 1, adding the dried ceramic filler into a silane coupling agent mixed solution, stirring, mixing and drying to obtain a pretreated ceramic filler; 2, adding the pretreated ceramic filler, the modified composite resin, a curing agent and N, N-dimethylformamide into a reaction container, stirring and grinding to obtain mixed slurry; and 3, coating the surface of a metal substrate with the mixed slurry, carrying out curing treatment, covering a copper foil, forming a metal substrate-mixed slurry-copper foil structure, carrying out high-temperature and high-pressure treatment, manufacturing a circuit diagram, and carrying out surface anti-oxidation treatment to obtain the composite insulating circuit board containing the ceramic filler enhancement layer. The circuit board prepared by the method has excellent dielectric property and heat resistance.

Method for manufacturing a printed circuit board with a metallic conductor structure (109, 119) comprising the steps a. Provision of a base substrate (101) formed as a film or plate with a first substrate side (101a) and a second substrate side, which consists at least partially of an electrically non-conductive organic polymer material and in which the first substrate side (101a) is covered with a cover metal layer (102), and b. partial removal of the top metal layer (102), where the top metal layer is removed in sections (102) c. a mask layer (103) is applied to the top metal layer (102), d. the mask layer (103) is removed in sections, so that the first substrate side (101a) is divided into at least one first sub-area (104) in which the first substrate side (101a) is covered only with the cover metal layer (102), and into at least one second sub-area (105) in which the first substrate side (101a) is covered with the cover metal layer (102) and by the mask layer (103), and e. the cover metal layer (102) in which at least one first sub-area (104) is removed, characterized by the fact that f. the mask layer (103) in the first sub-area (104) is removed by an etching treatment using an etching solution and prior to the etching treatment to remove the mask layer (103) in the first sub-area (104) a phase transformation or a chemical transformation is effected in the mask layer (103), wherein the mask layer (103) consists of an inorganic semiconductor or a compound of an inorganic semiconductor or of a polymer material which can assume at least a partially crystalline state and an amorphous state.

The invention discloses a PCB solder mask watermark solving method. The method comprises the following steps: S1, confirming the influence on the gold-melting watermark after enhancing the photopolymerization reaction rate and the thermal polymerization reaction rate; s2, after solder mask exposure and development, UV light is added to make up for insufficient light reaction for testing; s3, UV illumination energy is increased according to the condition of insufficient light supplement in the step S2, the energy generated by the solder resist ink under irradiation of different UV light energy, the intensity of a cross-linking reaction generated by photocuring molecules in the photosensitive ink and the hardening strength of the ink surface are analyzed through testing, the purpose is to avoid the watermark defect in the manufacturing process of the PCB, the quality is guaranteed, and the production efficiency is improved. The production is rapid.

A method includes receiving data of an image of a circuit pattern having multiple circuit pattern slices, and providing the data to a light projector aimed toward at least one light-sensitive material over a substrate of an object. The method also includes generating a patterned light-sensitive material, including projecting at least one temporal sequence of frames from the light projector. Each frame within a single temporal sequence has an image of a different one of the circuit pattern slices and projected so that each circuit pattern slice forms a contour line on the light-sensitive material. The method includes moving the light projector, the substrate, or both after an individual frame projection so that each contour line in the same temporal sequence is formed at a different location on the at least one light-sensitive material. The patterned light-sensitive material is used to pattern a conductive material over the substrate.

The invention discloses a rigid-flex board uncovering process and a rigid-flex board, and the rigid-flex board uncovering process comprises the steps: preparing an inner-layer flexible board, a first rigid board base material, a second rigid board base material, a first single-sided flexible board, a second single-sided flexible board and a laminated thermosetting adhesive, the first hard board base material, the second hard board base material and the laminated thermosetting adhesive are all provided with avoiding areas matched with the area to be uncovered. Laminating the second single-sided soft board, the second hard board base material, the inner-layer soft board, the first hard board base material and the first single-sided soft board from bottom to top, wherein the laminated thermosetting adhesive is laminated between the soft board and the hard board base material which are adjacent to each other; processing a second metal circuit and an uncovering groove surrounding the to-be-uncovered area on the surfaces of the first single-sided soft board and the second single-sided soft board; and carrying out uncovering treatment on areas, positioned in the uncovering grooves, on the first single-sided soft board and the second single-sided soft board. According to the method, the uncovering groove can be machined through the etching process, a laser depth-controlled cutting process does not need to be adopted, and the equipment cost of small-batch production is reduced.

The application provides an exposure method of photopolymer, comprising: providing a printed circuit board with a photopolymer layer on a top surface; exposing the photopolymer layer by a digital micromirror device with a UV light source for a first time, and the power of the UV light source is less than 0.2 kW; stopping the first exposure; covering a photomask on the photopolymer layer, and a bottom surface of the photomask contacts the photopolymer layer; exposing the photopolymer layer by the photomask with a mercury lamp for a second time, and the power of the mercury lamp is greater than 5 kW.

An acrylate based photopolymer with high yellowing resistance, excellent photo sensitivity, high toughness, and high glass transition temperature, methods of preparation and used thereof, and solders comprising the same.

A method of manufacturing an electrode substrate for a transparent light emitting device display according to an exemplary embodiment of the present application comprises: laminating copper foil on a transparent base material; forming a copper foil pattern by etching the copper foil; forming a transparent photosensitive resin composition layer on a front surface of the transparent base material and the copper foil pattern; and exposing at least a part of the copper foil pattern by removing at least a part of the transparent photosensitive resin composition layer provided on the copper foil pattern.