13results about "Radiation-sensitive masks exposure" patented technology

The application discloses a kind of composite insulating circuit board with ceramic filler reinforcing layer and preparation method thereof, belong to circuit board preparation technical field.The kind of composite insulating circuit board with ceramic filler reinforcing layer, comprising the following steps: step one: after drying, ceramic filler is added to silane coupling agent mixed solution, stirring mixes, dry, obtain pretreated ceramic filler;Step two: pretreated ceramic filler, modified composite resin, curing agent and N, N-dimethylformamide are added to reaction container, stirring, grinding, obtain mixed slurry;Step three: mixed slurry is coated on the surface of metal substrate, solidification treatment, cover copper foil, form metal substrate-mixed slurry-copper foil structure, high temperature and high pressure treatment, make circuit diagram, surface oxidation resistance treatment, obtain a kind of composite insulating circuit board with ceramic filler reinforcing layer.The circuit board prepared by the method has excellent dielectric properties and heat resistance.

An apparatus for exposing a printing plate including at least a front source array of LEDs that emits a radiation field incident on the front side of the plate and a back source array of LEDs that emits a radiation field incident on the back side of the plate. A controller connected to the front source and the back source causes movement of at least the front radiation field relative to the plate fixed on a substrate that receives the printing plate in a fixed configuration between the front source and the back source. The apparatus commences a first exposure step of one side of the plate with one of the sources and then a second exposure step of the opposite side of the plate with the other source, imposing a user-definable time delay (t) between commencing the first exposure step and commencing the second exposure step.

An apparatus for exposing a printing plate including at least a front source array of LEDs that emits a radiation field incident on the front side of the plate and a back source array of LEDs that emits a radiation field incident on the back side of the plate. A controller connected to the front source and the back source causes movement of at least the front radiation field relative to the plate fixed on a substrate that receives the printing plate in a fixed configuration between the front source and the back source. The apparatus commences a first exposure step of one side of the plate with one of the sources and then a second exposure step of the opposite side of the plate with the other source, imposing a user-definable time delay (t) between commencing the first exposure step and commencing the second exposure step.

A method for producing a flexible printed wiring board using a photoresist includes placing the photoresist, including a first region and a second region, on a substrate, placing a first photomask including a first light-transmitting portion such that the first light-transmitting portion faces the first region to expose the photoresist through the first light-transmitting portion, and placing a second photomask including a second light-transmitting portion such that the second light-transmitting portion faces the second region to expose the photoresist through the second light-transmitting portion. The first region is adjacent to the second region such that an edge portion of the first region overlaps an edge portion of the second region. The first light-transmitting portion has a linear shape including a first tip having a tapered shape.

A method of manufacturing a printed circuit board having a metallic conductor structure is described. The method comprises: providing a base substrate (101) in the form of a film or sheet, the base substrate having a first substrate side (101a) and a second substrate side, the base substrate being at least partially composed of a non-conductive organic polymer material, the first substrate side (101a) being covered with a covering metal layer (102); and removing the cover metal layer (102) in some regions of the first substrate side (101a). In order to remove the cover metal layer (102), a mask layer (103) is applied to the cover metal layer (102). The mask layer (103) is removed in some regions such that the first substrate side (101a) is divided into at least one first sub-region (104), in which the first substrate side (101a) is covered only by the cover metal layer (102), and at least one second sub-region (105), in which the first substrate side (101a) is covered by the cover metal layer (102) and the mask layer (103). The covering metal layer (102) is then removed in the at least one first sub-region (104). According to the invention, the mask layer (103) is removed by an etching process using an etching solution, and a phase change or a chemical conversion is carried out in the mask layer (103) in the first sub-region (104) prior to the etching process.

Method for manufacturing a printed circuit board with a metallic conductor structure (109, 119) comprising the steps a. Provision of a base substrate (101) formed as a film or plate with a first substrate side (101a) and a second substrate side, which consists at least partially of an electrically non-conductive organic polymer material and in which the first substrate side (101a) is covered with a cover metal layer (102), and b. partial removal of the top metal layer (102), where the top metal layer is removed in sections (102) c. a mask layer (103) is applied to the top metal layer (102), d. the mask layer (103) is removed in sections, so that the first substrate side (101a) is divided into at least one first sub-area (104) in which the first substrate side (101a) is covered only with the cover metal layer (102), and into at least one second sub-area (105) in which the first substrate side (101a) is covered with the cover metal layer (102) and by the mask layer (103), and e. the cover metal layer (102) in which at least one first sub-area (104) is removed, characterized by the fact that f. the mask layer (103) in the first sub-area (104) is removed by an etching treatment using an etching solution and prior to the etching treatment to remove the mask layer (103) in the first sub-area (104) a phase transformation or a chemical transformation is effected in the mask layer (103), wherein the mask layer (103) consists of an inorganic semiconductor or a compound of an inorganic semiconductor or of a polymer material which can assume at least a partially crystalline state and an amorphous state.

A method includes receiving data of an image of a circuit pattern having multiple circuit pattern slices, and providing the data to a light projector aimed toward at least one light-sensitive material over a substrate of an object. The method also includes generating a patterned light-sensitive material, including projecting at least one temporal sequence of frames from the light projector. Each frame within a single temporal sequence has an image of a different one of the circuit pattern slices and projected so that each circuit pattern slice forms a contour line on the light-sensitive material. The method includes moving the light projector, the substrate, or both after an individual frame projection so that each contour line in the same temporal sequence is formed at a different location on the at least one light-sensitive material. The patterned light-sensitive material is used to pattern a conductive material over the substrate.

The application provides an exposure method of photopolymer, comprising: providing a printed circuit board with a photopolymer layer on a top surface; exposing the photopolymer layer by a digital micromirror device with a UV light source for a first time, and the power of the UV light source is less than 0.2 kW; stopping the first exposure; covering a photomask on the photopolymer layer, and a bottom surface of the photomask contacts the photopolymer layer; exposing the photopolymer layer by the photomask with a mercury lamp for a second time, and the power of the mercury lamp is greater than 5 kW.

An acrylate based photopolymer with high yellowing resistance, excellent photo sensitivity, high toughness, and high glass transition temperature, methods of preparation and used thereof, and solders comprising the same.

A method of manufacturing an electrode substrate for a transparent light emitting device display according to an exemplary embodiment of the present application comprises: laminating copper foil on a transparent base material; forming a copper foil pattern by etching the copper foil; forming a transparent photosensitive resin composition layer on a front surface of the transparent base material and the copper foil pattern; and exposing at least a part of the copper foil pattern by removing at least a part of the transparent photosensitive resin composition layer provided on the copper foil pattern.

This invention discloses a method for manufacturing PCB characters, comprising the following steps: manufacturing a screen printing stencil and setting a light-transmitting window on the stencil, the window corresponding to the character area to be printed on the production board; screen printing photosensitive ink onto the production board with a solder resist layer already formed using the stencil, so that a layer of photosensitive ink is screen printed at the position corresponding to the window on the production board, and pre-curing the photosensitive ink through pre-baking; preparing an exposure film according to the character graphic to be printed, and exposing the photosensitive ink on the production board through the exposure film, so that the photosensitive ink at the corresponding character graphic is exposed and cured; removing the uncured photosensitive ink outside the character graphic by developing, to form the character; and finally, baking to completely cure the character. This invention solves the problem that screen printing cannot produce dense and small characters due to process limitations, and also solves the problem of character printers losing characters during printing and being unable to produce diverse character colors.

One aspect relates to an apparatus for exposing a printing plate, the printing plate comprising a photosensitive polymer activated by exposure to radiation, the printing plate having a non-printing back side and a printing front side with a mask for defining an image to be printed, the apparatus comprising: - one or more radiation sources collectively arranged to expose the front side and the back side of the printing plate to radiation, and - a holder configured to receive the printing plate in a position to receive incident radiation from the one or more radiation sources, and - a controller connected to the one or more radiation sources, wherein the apparatus is configured to, for each specific coordinate corresponding to a cross-sectional portion of the printing plate, first commence irradiating the non-printing back side of the printing plate, then automatically impose a precisely defined time delay, and then immediately after the time delay elapses, commence irradiating the printing front side of the printing plate.

The invention describes a method for producing a printed circuit board having a metallic conductor structure. The method comprises providing a base substrate (101) which is formed as a film or plate, has a first substrate side (101a) and a second substrate side and at least partially consists of an electrically non-conductive organic polymer material and in which the first substrate side (101a) is covered with a covering metal layer (102), and removing the covering metal layer (102) in regions. In order remove the covering metal layer (102) in regions, a mask layer (103) is applied to the covering metal layer (102). This mask layer is then removed in regions. In the process, the first substrate side (101a) is divided into at least one first subregion (104), in which the first substrate side (101a) is covered only with the covering metal layer (102), and into at least one second subregion (105), in which the first substrate side (101a) is covered with the covering metal layer (102) and by the mask layer (103). The covering metal layer (102) in the at least one first subregion (104) is then removed. The invention proposes removing the mask layer (103) in the first subregion (104) by an etching treatment using an etching solution and implementing a phase transition or a chemical transformation in the mask layer (103) before the etching treatment.