261results about How to "Low peel strength" patented technology

Provided is a touch panel. The touch panel includes a base and a pressure-sensitive adhesive layer attached to the base and including an acryl-based polymer containing an acryl polymer containing 5 to 30 parts by weight of isobornyl (meth)acrylate, and 5 to 40 parts by weight of methyl (meth)acrylate in a polymerized form. Accordingly, it can effectively inhibit penetration of oxygen, moisture or other impurities at an interface between the base and the pressure-sensitive adhesive layer, or at an interface between a conductor thin film and the pressure-sensitive adhesive layer, and prevent degradation in optical properties such as visibility, etc. due to bubbles generated at the pressure-sensitive adhesive interface. In addition, when the pressure-sensitive adhesive layer is directly attached to the conductor thin film and even exposed to severe conditions such as high temperature or high temperature and high humidity, a change in the resistance of the conductor thin film may be effectively inhibited, and thus the touch panel can be stably driven for a long time.

Disclosed is a multi-layer paper suitable as a material for preparing heat-sensitive stencil printing masters. The multi-layer paper is produced by combining a plurality of thin paper layers by paper making. The multi-layer paper has a peel strength of 10 N / m or less and may be delaminated into at least two tissue sheets.

The invention relates to a high-dielectric-constant resin composition, as well as a prepreg and a copper-clad laminate (CCL) which are manufactured thereby. The prepreg manufactured by the high-dielectric-constant resin composition comprises high-dielectric-constant glass fiber fabric and a high-dielectric-constant resin composition subjected to impregnation drying and then attached to the high-dielectric-constant glass fiber fabric. The CCL manufactured by the high-dielectric-constant resin composition comprises at least one overlapped prepreg and copper foils pressed and coated on both sides of the overlapped prepregs. The CCL manufactured by the high-dielectric-constant resin composition has the performances of high dielectric constant, low dielectric loss, high glass transition temperature, high peel strength and the like and can meet the performance requirement of the high-dielectric-constant antenna substrate.

A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.

A dicing die-bonding film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film on the pressure-sensitive adhesive layer, which, even if the semiconductor wafer is thin, is excellent in balance between holding strength of the semiconductor wafer during dicing and peeling property of its semiconductor chip obtained by dicing upon being peeled together with the die-bonding film. A dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer comprising an acrylic acid ester as a main monomer, 10 to 30 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and the die-bonding film comprises an epoxy resin.

A pressure-sensitive adhesive composition for an optical film of the present invention comprises 100 parts by weight of a (meth)acrylic polymer comprising 45 to 99.99% by weight of an alkyl (meth)acrylate monomer unit and 0.01 to 2% by weight of a tertiary amino group-containing monomer unit; and 0.01 to 2 parts by weight of a peroxide as a crosslinking agent. The pressure-sensitive adhesive composition can form an pressure-sensitive adhesive layer that has satisfactory reworkability such that optical films can be easily peeled from liquid crystal panels with no adhesive residue and also has satisfactory processability such that it can be worked without pressure-sensitive adhesive fouling or dropout.

A surface treated copper foil having high frequency characteristics, capable of forming fine pattern and having sufficient peel strength, wherein surface roughness Rz of roughening treated surface made by adhering roughening particles on at least one surface side of untreated copper foil is 0.6 to 1.5 μm and a brightness value is 35 or smaller; and a circuit board, on which wiring pattern is formed by the same surface treated copper foil, are provided.

An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility with fine pattern processes, which a copper foil being deposited with roughening particles to make the treated copper foil having a roughening treated side with surface roughness of 1.5 to 4.0 μm and luminosity of not more than 30, having projections formed from the roughening particles with a height of 1 to 5 μm, preferably 6 to 35 thereof are uniformly distributed in a 25 μm of surface length of copper foil cross-section observed, and its maximum width being at least 0.01 μm and not more than twice of 25 μm divided by the number of projections in the 25 μm surface length.

A retortable, easily openable closure of the type having a metal end and a membrane closure heat-sealed thereto, wherein the metal end has a coating of a heat-seal composition comprising a food-compatible metal-coating composition blended with polypropylene. The polypropylene disperses within the food-compatible metal-coating composition during curing of the coating on the metal end such that an outer surface of the coating defines a multitude of separate, spaced islands of polypropylene dispersed within the food-compatible metal-coating composition so as to form bonding sites. The membrane closure's lower surface has a heat-seal layer of polypropylene for sealing to the coating on the metal end.

The invention provides an easy-stripping type room temperature vulcanizing silicone rubber, which contains hydroxy-terminated dimerization organic group siloxane, a functional filling material, a crosslinking agent, gas phase silicon dioxide, a catalyst, an additive and a plasticizer. The invention also provides a method for preparing the easy-stripping type room temperature vulcanizing silicone rubber, which comprises the following steps: firstly, vacuum-stirring the hydroxy-terminated dimerization organic group siloxane, the plasticizer and the functional filling material in formula proportions in a closed reaction kettle evenly; secondly, adding the crosslinking agent, the gas phase silicon dioxide, the catalyst and the additive in formula proportions in to the closed reaction kettle, and vacuum-stirring the mixture for 30 to 60 minutes; and thirdly, releasing the vacuum by using nitrogen gas, and putting the mixture into a closed packaging container. The easy-stripping type room temperature vulcanizing silicone rubber is particularly suitable for sealing a joint on the surface of a component of a motor vehicle, has excellent sealing performance and stripping performance, and simultaneously is of room temperature vulcanizing type, is cured by moisture, is molded in place and can replace various solid gaskets, so the easy-stripping type room temperature vulcanizing silicone rubber is suitable for manufacturing and maintaining various types of motor vehicles, and can shorten the labour hour and save the cost.

Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a “nickel zinc layer”) on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180 μg / dm2 or more and 3500 μg / dm2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight / (nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.

A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of filler is provided. The method is characterized in that, when a surface of a resin layer on which a metal film is formed by plating is roughened by a desmear treatment and, then, the thus-roughened surface of the resin layer is cleaned, the surface of the resin layer formed with a resin compounded with a filler in an amount of 20 wt % or more such that a difference of a coefficient of thermal expansion between the resin layer and the metal film is allowed to be reduced is roughened by subjecting it to the desmear treatment and, secondly, the filler which is deposited on the thus-roughened surface of the resin layer is removed by ultrasonic cleaning in which ultrasonic vibration of a frequency of from 35 to 50 kHz is applied.

Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a “nickel zinc layer”) on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180 μg / dm2 or more and 3500 μg / dm2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight / (nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.

The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness.The adhesive composition of the present invention comprises:(A) an acrylic polymer;(B) an epoxy resin;(C) a thermosetting agent; and(D) a silicone compound,wherein the silicone compound (D) has one kind of reactive organic functional group and a kinematic viscosity within a specific range.

A photo-responsive UV pressure-sensitive adhesive and a preparation method of same. The pressure-sensitive adhesive is composed of four parts including 30-70% of an acrylate-type copolymer, 3-21% of a photo-responsive monomer, 21-63% of a photo-polymerization monomer, and 0.6-1.4% of a photoinitiator. The pressure-sensitive adhesive is prepared through the steps of: dissolving the polymer in the photo-polymerization monomer, adding the photo-responsive monomer and the photoinitiator and uniformly mixing the components; and irradiating the mixture by means of ultraviolet light of which the wavelength [lambda] is more than 390 nm and is less than 450 nm to cure the mixture to prepare the pressure-sensitive adhesive, and meanwhile, performing mask exposure to form patterns. The pressure-sensitive adhesive is reduced in stripping strength after being irradiated by means of ultraviolet light of which the wavelength [lambda] is more than 300 nm and is less than 360 nm, so that the pressure-sensitive adhesive is easy to strip. The stripping strength is recovered after the pressure-sensitive adhesive is irradiated by means of ultraviolet light of which the wavelength [lambda] is more than 200 nm and is less than 270 nm. The pressure-sensitive adhesive, when being used, has high stripping strength and good adhesion performance. When the pressure-sensitive adhesive is used or is mis-adhered, stripping strength of the pressure-sensitive adhesive can be reduced just by irradiating the pressure-sensitive adhesive by light, so that the pressure-sensitive adhesive is easy to strip. The stripping strength is recovered when the stripped pressure-sensitive adhesive is irradiated by light, and the pressure-sensitive adhesive can be used continuously. The pressure-sensitive adhesive is energy-saving, environment-protective and can be used repeatedly.

A release agent composition includes a poly(meth)acrylate (A) containing a structural unit (1) represented by the following formula (1); in which R1 represents hydrogen or a methyl group and R2 represents a long-chain alkyl group having 12 to 28 carbon atoms, a liquid polymer (B) and a crosslinking agent (C), wherein at least one of the poly(meth)acrylate (A) and the liquid polymer (B) has a reactive functional group, and the crosslinking agent (C) is a compound having a functional group capable of reacting with the reactive functional group.

The object of the present invention is to provide a curable resin composition which is excellent in cracking elongation rate, is low in arithmetic average roughness of an insulating layer surface in a wet roughing process, is also low in root mean square roughness, can form a plated and inlaid conductor layer having enough peel strength, and is also low in coefficient of linear thermal expansion. The curable resin composition provided by the present invention comprises a phenoxy resin (A) having an anthracene structure, an epoxy resin (B) and a curing agent (C),and is characterized in that the total quantity of the phenoxy resin (A), the epoxy resin (B) and the curing agent (C) is set as 100% by mass, the above phenoxy resin (A) is 1-15% by mass, and the epoxide equivalent of the above phenoxy resin (A) is more than 5000.

The invention discloses an easy-to-peel cover film, which comprises a hot sealing layer, an easy-to-peel layer, a blocking layer, a bonding layer and a weatherproof layer in sequence arrangement, wherein the hot sealing layer is an ethylene-vinyl acetate copolymer film layer modified by low-density polyethylene and metallocene low-density polyethylene, the easy-to-peel layer is a low-density polyethylene layer, the blocking layer is a soft-state aluminum foil layer, the bonding layer is a polyester type polyurethane layer, and the weatherproof layer is a polyester layer. The easy-to-peel cover film is an easy-to-peel cover film with the advantages that the integral performance is excellent, the easy-to-peel cover film is particularly suitable for various containers, and the easy-to-peel performance, the sealing performance and the ventilation performance are better.

The invention relates to a polaroid stripping machine and a method for stripping a polaroid. The polaroid stripping machine comprises an operation platform and a conveying device with a translatable surface, wherein the operation platform is provided with a gap which is used as a polaroid stripping position; the translatable surface of the conveying device is located below the gap; when the polaroid is stripped, a glass substrate with the polaroid to be stripped slides through the gap along the upper surface of the operation platform; and the stripped polaroid downwards extends and is paved on the translatable surface of the conveying device by the gap, and horizontally moves along with the translatable surface of the conveying device. The polaroid stripping machine and the method for stripping the polaroid, disclosed by invention, change the polaroid stripping operation into a continuous process, can eliminate the damages of static electricity accumulation in the polaroid stripping process to a panel and an operator, can heat the polaroid, and reduce the stripping strength and the fragmenting possibility.

The invention provides an ultralow-viscosity pressure-sensitive adhesive and an ultralow-viscosity protective film. The ultralow-viscosity pressure-sensitive adhesive is composed of the following components in parts by weight: 100 parts of monomer, 0.1-1.2 parts of initiator, 50-150 parts of water, 0.3-2 parts of emulsifier, 3-5 parts of inner crosslinking agent, 0.3-0.6 part of outer crosslinking agent, 0.1-1.6 parts of assistant and 0.1-1 part of buffering agent. Compared with the prior art, the glass transition temperature of the monomer is lower, thereby ensuring the softness required by the adhesive layer; the inner crosslinking agent is added to increase the molecular weight of the ultralow-viscosity pressure-sensitive adhesive part, so that macromolecules and micromolecules are distributed in a certain state, thereby compromising the balance between the initial viscosity and cohesive force; and the outer crosslinking agent is added into the ultralow-viscosity pressure-sensitive adhesive, so that molecular chains are further crosslinked in the film formation process of the pressure-sensitive adhesive, thereby effectively lowering the peel strength of the pressure-sensitive adhesive and enhancing the high temperature resistance.

The invention belongs to the technical field of electronic functional ceramic materials, and particularly relates to an ultrahigh-purity aluminum oxide ceramic metallization method. Aiming at the problems of low strength, poor heat conductivity, and poor air tightness of a ceramic matrix caused by an aluminum oxide ceramic metallization sintering process, the invention provides an ultrahigh-purityaluminum oxide ceramic metallization method. The method comprises the following steps: a, weighing raw material powder, dispersing the raw material powder into alcohol, ball-milling, and drying to prepare a metallized slurry additive; b, mixing molybdenum powder, molybdenum trioxide powder, manganese powder and the metallized slurry additive to obtain powder, and ball-milling the powder to obtainmetallized powder; c, subjecting the metallized powder to vibration grinding to obtain metallized slurry; and d, printing or coating the metallized slurry, and sintering to obtain a metallized product. The sintering temperature of the metallized slurry is lower than an existing sintering temperature, multiple times of metallized sintering can be achieved, the thickness of a metallized layer is increased, and after nickel plating, the metallized layer is good in stripping effect, high in stripping strength and good in metallized tensile strength performance.

The invention discloses a highly-smooth polyethylene film and a manufacturing method thereof. The highly-smooth polyethylene film comprises an outer layer, a middle layer and an inner layer. The outer layer is made of, by weight ratio, 10:90-90:10 of low-density polyethylene and linear low-density polyethylene. The middle layer is made of, by weight ratio, 10:90-90:10 of low-density polyethylene and linear low-density polyethylene. The inner layer is made of, by weight ratio, 50:50:0.5-50:50:10 of low-density polyethylene, linear low-density polyethylene and anti-plastering agents. The manufacturing method includes mixing the outer layer, the middle layer and the inner layer by a quantitative batcher, adding the layers to an extruder to be subjected to plastifying extrusion, extruding the layers into film tubes by triple coextrusion die heads, and wrapping up the layers after the layers are blown up. Compared with the prior art, the highly-smooth polyethylene film is more precise and stable in friction coefficient and well solves the problems of slipping of composite films on a package machine and slipping agent precipitation.

The invention belongs to the technical field of acrylic coatings, and discloses an acrylic organosilicone water-emulsion coating as well as a preparation method and an application for the same. The acrylic organosilicone water-emulsion coating comprises the following components in the following parts by weight: 100 parts of water, 0.1-4 parts of an emulsifier, 5-20 parts of liquid hydrogen-containing polymethyl siloxane, and 5-50 parts of acrylic polymers. The organosilicone content of the acrylic organosilicone water-emulsion coating disclosed by the invention is up to more than 10% in the polymers, organosilicone and the acrylic polymers are compounded in a wide range, and curing film-forming is performed at a room temperature. The preparation process disclosed by the invention is simple, and the obtained emulsion is good in stability; and after curing film-forming, the acrylic organosilicone water-emulsion coating is good in mechanical performance (wherein the hardness can be up to 3 H), excellent in waterproof and hydrophobic performances, acid-base resistance, weather resistance, and adhesive force (which can be up to 2.5 MPa), and proper in peel strength (which can be up to 23 g / cm).

The present invention relates to a self-adhesive coating for electrical steel and its uses. The coating comprises 81-99.9 weight parts of aqueous epoxy resin emulsion, 0.07-17 weight parts of curing agent, and optionally 0.3 weight parts of accelerant. If required, said coating can optionally contain additives selected from diluent, filler, toughener, colorant, fire retardant, antirusting agent, antisettling agent, thixotropic agent or antifoamer, thickener, pigment dispersant, preservative, and the like. The coating can be used as electrical steel coating. The present coating is capable of making electrical steel with a self-adhesive coating in a way of heat by naked-flame, and also there are no poisonous organic solvents to volatilize during the entire process. Furthermore, the coating permits to omit apparatus for burning organic solvents, and the cost is thereby reduced.

The invention discloses an adhesive for a flexible electronic substrate and a preparation method thereof. The adhesive is prepared by mixing the following components in parts by weight: 100 parts of modified acrylate resin, 10-100 parts of epoxy resin, 1-10 parts of a photoinitiator, 8-15 parts of a reactive diluent and 1-15 parts of a thermal initiator. The invention also discloses application of the adhesive in manufacturing procedure of the flexible electronic substrate. The BDB (Bonding and Debonding) adhesive prepared by the invention combines the advantages of the epoxy resin and the acrylate resin, solves the problem that an ordinary adhesive cannot be stripped or greatly remains after being stripped, has the characteristics of being firm in combination with glass and flexible plastic electronic substrates, liable to strip, small in adhesive residual amount and convenient in construction, being safe and environment friendly and the like, can replace the traditional unpeelable type adhesive and is used for preparation of flexible display screens of electronic equipment such as tablet personal computers, mobile phones, kindle.

The present invention provides a surface protective film that exhibits small differences in peel strength on account of the surface state of an adherend and that is excellent in anti-contamination to adherends, and a pressure-sensitive adhesive (PSA) composition for the protective film. The PSA composition provided by the present invention comprises 0.01 to 5 parts by weight of a compound containing an oxypropylene group with respect to 100 parts by weight of an acrylic polymer as a base polymer. A surface protective film 10 provided by the present invention has a PSA layer 2, formed using the above PSA composition, on one or both sides of a support 1.

A precoated metal sheet which comprises a metal sheet and, formed on a surface thereof, a resin coating film comprising a fluororesin, wherein the concentration proportion of fluorine in an uppermost layer of the resin coating film, as calculated using the equation (1), is 20% or higher and the concentration proportion of fluorine in an inner layer located in a position about 1 / 2 the thickness of the coating film, as calculated using the following equation (1), is 15% or lower. A(%) = {F / (F+C+O+N100 (1) (In the equation (1), A is the concentration proportion of fluorine; F is the amount of fluorine in mass%; C is the amount of carbon in mass%; O is the amount of oxygen in mass%; and N is the amount of nitrogen in mass%.