177 results about "Antenna substrate" patented technology

An antenna apparatus includes an antenna substrate with opposite first and second surfaces; and a PCB having opposite first and second surfaces. Antenna elements are disposed at the first surface of the antenna substrate. Electrically conductive columns, each having a first end attached to the second surface of the PCB and a second end attached to the second surface of the antenna substrate, secure the PCB to the antenna substrate and provide an electrical interconnect between the PCB and the antenna substrate. RFIC chips are each attached to the second surface of the antenna substrate and are coupled to the antenna elements. At least one circuit element is attached to the first surface of the PCB and electrically coupled to at least one of the RFIC chips through at least one of the electrically conductive columns.

A hybrid antenna substrate of an embodiment comprises: a core part including a core layer and a core wiring layer laminated in the vertical direction; and an antenna part disposed on the core part, wherein: the antenna part comprises a plurality of antenna wiring layers successively laminated on the core part and antenna insulating layers disposed between the plurality of antenna wiring layers; and the core layer has a greater dielectric constant than the antenna insulating layers.

An antenna substrate, electronic package and manufacturing method thereof are provided in which an antenna substrate including a silicon core layer, a circuit structure and conductive pillars, and the circuit structure has a first dielectric layer, a first circuit layer and a first antenna portion. The circuit structure and the conductive pillars are formed on opposite sides of the silicon core layer, and the antenna substrate is stacked and bonded to a circuit board having a second antenna portion through the conductive pillars. Thereby, the present disclosure can thin a thickness of the antenna substrate and the electronic package, or precisely control a distance between the antenna substrate and the circuit board.

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

An antenna assembly can include an internal ground plane, a base PCB, and a plurality of antennas. The base PCB can be positioned above the internal ground plane. The base PCB can include a plurality of individual ground planes spaced circumferentially about a center of the base PCB, with the plurality of individual ground planes being electrically connected to the internal ground plane. Each antenna of the plurality of antennas can be electrically connected to an individual ground plane of the plurality of individual ground planes. The plurality of antennas can include a plurality of multi-band antennas and one or more WiFi antennas.

The invention provides an integrated antenna integrating Beidou, low-orbit and Tiantong satellite communication and high-precision navigation positioning. A low-orbit satellite microstrip antenna, a GNSS high-precision microstrip antenna, a Tiantong microstrip antenna and a Beidou short message microstrip antenna are sequentially stacked on the upper surface of a PCB in a conical mode. A shielding cover is arranged on the lower side of the PCB; antenna radiation patches of the low-orbit satellite microstrip antenna are arranged on the outer edges of the upper surface and the lower surface of the low-orbit satellite antenna substrate and are not covered by the GNSS high-precision microstrip antenna; circuits of the low-orbit satellite microstrip antenna and the sky-pass microstrip antenna are arranged on the upper surface of the PCB circuit substrate. And circuits of the GNSS high-precision microstrip antenna and the Beidou short message microstrip antenna are arranged on the lower surface of the PCB. According to the invention, the four-in-one combined design of the antenna, the low-orbit satellite antenna, the Beidou short message antenna and the high-precision navigation antenna is adopted, so that the problem of performance insufficiency when each antenna is used independently is solved, complementation among the antenna, the low-orbit satellite antenna, the Beidou short message antenna and the high-precision navigation antenna is realized, and the cost is reduced; the electromagnetic compatibility between the antennas is improved through frequency band and polarization isolation design, and the stability of a communication link is guaranteed through interference resistance of the peripheral low-orbit satellite antenna.

An ESA antenna includes a layer of filters between the layer of radiating elements and the ground layer. The filter layer obviates certain post processing steps. The filters define a passband at the operating range of the antenna and a stopband defined to prevent crosstalk or reduce known external interference. Each filter includes alternating cells of a resonator cell formed by two split ring resonators and a resonator cell formed by a complementary split ring resonator and a complementary patch / stub. A particular implementation of the filter defines an operating range around 23 gigahertz with a passband to stopband transition of less than 500 megahertz. Vias may connect the filter layer to a surface component layer with beamforming integrated circuits, bypassing the routing layer.

The present disclosure relates an antenna assembly that includes an antenna structure and a substrate. The antenna structure may be formed from a single contiguous piece of metal. The antenna structure may include at least one slot antenna formed in the single contiguous piece of metal. The substrate may include at least one dielectric layer, and a waveguide comprising a metallized cavity that extends through the at least one dielectric layer. The antenna structure may be attached to the substrate, may be disposed at an upper surface of the substrate, and may cover the metallized cavity of the waveguide. The substrate may be a printed circuit board (PCB) substrate, an in-mold electronics (IME) substrate, a molded interconnect device (MID) substrate, or another suitable substrate.

An ultra-wideband end-fire antenna with a common aperture embedded in a metal carrier includes a metal cavity with a coaxial cable compartment on one side. A radiator module is connected to the bottom of the metal cavity via a radiator fixing slot. The radiator module includes a common aperture antenna substrate. A low-frequency radiator is printed on the side of the common aperture antenna substrate closer to the coaxial cable compartment, and a high-frequency radiator is printed on the side farther from the coaxial cable compartment. This invention utilizes a dual-band antenna in a common aperture design to enhance the channel capacity and anti-fading capability of the communication system. At the same time, by achieving the antenna's carrier conformal characteristics, high isolation, and miniaturization, it enriches the antenna's application scenarios and improves the overall performance of the communication system.

The invention discloses printing equipment for RFID antenna production, which comprises a printing table and a printing unit, a pressing mechanism is arranged on the top surface of the printing table, the pressing mechanism is used for pressing an RFID antenna base material and a template on the top surface of the printing table, the printing unit is arranged on the top surface of the printing table, and the printing unit comprises a scraping printing assembly and an adjusting assembly. The printing unit comprises a scraping and printing assembly and an adjusting assembly, the scraping and printing assembly is used for scraping and printing conductive ink on a template and an RFID antenna base material, the adjusting assembly is used for adjusting the scraping and printing assembly so as to scrape and print the RFID antenna base material and the template with different thicknesses, and the gathering unit is arranged on the outer side of the printing unit and used for gathering the diffused conductive ink. The gathering unit is arranged on the printing unit to ensure that the printing unit performs uniform scraping printing on the RFID antenna base material and the template, and the mixing unit is arranged on the outer side of the gathering unit and is used for mixing the stored conductive ink in real time.

Antennas, user equipment, windows and vehicles are described. Some embodiments may include an antenna a substrate; an antenna layer disposed on the substrate comprising a conductive mesh; a solder resist applied on the substrate and the antenna layer and containing a pigment having a tone matching with that of the antenna layer. Other embodiments may be described and / or claimed.

An antenna substrate includes a substrate including a first main surface and a second main surface, and a coil including a first portion supported on the first main surface, and a second portion supported on the second main surface. A communicating portion is formed in the substrate. The communicating portion communicates the first main surface with the second main surface. The first portion and the second portion are electrically connected to each other, through the communicating portion. A winding direction of the first portion and a winding direction of the second portion are identical, when viewed from a direction along a normal line of the first main surface or a normal line of the second main surface.

An antenna element includes a ground conductor, an energization patch conductor positioned on an upper side relative to the ground conductor, and a non-energization patch conductor positioned on an upper side relative to the energization patch conductor. The energization patch conductor includes a first side and a second side extending along a resonance direction. The non-energization patch conductor includes a plurality of segments. The plurality of segments include a first segment positioned along the first side and a second segment positioned along the second side. In plan view, a total area of the non-energization patch conductor is smaller than an area of the energization patch conductor.

This invention provides a silicon-based dielectric resonant antenna with adjustable beamwidth, comprising a beamwidth adjustment structure, an antenna substrate and a dielectric resonator, an excitation antenna, and solder bumps. The multilayer antenna substrate and dielectric resonator are arranged sequentially from top to bottom, with an air cavity formed in the middle. The excitation antenna is located at the bottom of the air cavity. The beamwidth adjustment structure is located on top of the top layer of the antenna substrate and dielectric resonator. A through-silicon via (TSV) is located in the middle of the bottom layer of the antenna substrate and dielectric resonator, with solder bumps located at the bottom of the TSV. This invention significantly reduces the antenna size and improves its radiation efficiency by using high-resistivity silicon as the antenna dielectric. By introducing an air cavity structure and adjusting the beamwidth through the top-layer beamwidth adjustment structure, the antenna application frequency can be changed according to usage, the feeding method can be modified and optimized according to application conditions, and it can be stacked with chips to achieve three-dimensional heterogeneous high-density integration.

A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.

An antenna module includes an antenna substrate and a feed circuit. The antenna substrate has an upper surface and a lower surface, and a radiating element having a flat plate shape is arranged in the antenna substrate. The feed circuit 105 is mounted on the lower surface of the antenna substrate and supplies a radio frequency signal to the radiating element. The antenna substrate includes a dielectric substrate on which the radiating element is arranged, a ground electrode, a feed wiring, and carbides. The ground electrode is arranged between the radiating element and the lower surface in the dielectric substrate. The feed wiring transmits the radio frequency signal supplied from the feed circuit to the radiating element. The carbides are disposed on at least a part of a side surface connecting the upper surface and the lower surface in the dielectric substrate.

The utility model discloses a slot waveguide array antenna attached to the outer side of an elastic wall. The slot waveguide array antenna comprises a protection base embedded in the elastic wall and an antenna substrate attached to the outer side of the elastic wall. The bottom of the antenna substrate is welded with a connecting socket, the connecting socket is inserted into the protection base, one side of the upper surface of the antenna substrate is provided with an inclined chamfer, and the upper surface of the antenna substrate is provided with slot guided waves. The utility model provides a detection antenna which is suitable for being used on a missile, can save the space of the whole missile, is high in performance and narrow in radiation pattern of a pitching surface, and in order to improve the available design space of the antenna, reduce the design difficulty and save the space of the whole missile, a transmitting-receiving antenna which is conventionally arranged on the inner side of the missile wall and is conformal with the missile wall is improved into a transmitting-receiving antenna which is attached to the outer side of the missile wall. The available design space of the antenna is increased to a great extent by arranging the antenna on the outer side of the missile wall, so that the design difficulty is reduced, the antenna performance is improved, and the whole missile space is saved.

The invention relates to the technical field of ceramic materials, in particular to ultralow-loss orthogonal strontium-based microwave dielectric ceramic and a preparation method thereof, the chemical formula of the ultralow-loss orthogonal strontium-based microwave dielectric ceramic is SrYb2O4, and preparation raw materials are SrCO3 and Yb2O3. The preparation method comprises the following steps: firstly, weighing SrCO3 powder and Yb2O3 powder according to a certain proportion, mixing, sequentially carrying out wet grinding treatment and drying treatment, pre-sintering for 4-8 hours in an air atmosphere at the temperature of 1100 DEG C to obtain pre-sintered powder, carrying out secondary ball milling and drying, adding a binder, granulating, carrying out compression molding, and finally sintering for 4-8 hours in an air atmosphere at the temperature of 1400-1500 DEG C to obtain the SrBO3-Yb2O3 composite material. The orthogonal strontium-based microwave dielectric ceramic can be obtained. The orthogonal strontium-based microwave dielectric ceramic has an ultrahigh quality factor, can improve the selectivity of the working frequency of a device, simplifies the heat dissipation design, and is widely used for manufacturing various dielectric antenna substrates, resonators, filters and other microwave devices.

The present application relates to the field of intelligent health monitoring technology, and in particular to a miniaturized card-type human vital signs monitoring device, comprising a millimeter-wave radar module, a flexible substrate, an ADC conversion unit, and a signal processing unit; wherein the millimeter-wave radar module comprises an antenna array unit and an antenna substrate; the antenna array unit is etched on the antenna substrate using folded antenna technology; the flexible substrate and the antenna substrate are bonded; the ADC conversion unit is connected to the millimeter-wave radar module; and the signal processing unit is connected to the ADC conversion unit, for extracting human vital signs signals and calculating medical parameters. The present application adopts flexible substrate and folded antenna array technology, which greatly reduces the core module area of ​​the monitoring device, making it the size of a credit card, and can adapt to a variety of application scenarios. It can be made into the shape of a mobile phone case and coupled with a mobile phone to achieve a closed-loop monitoring system. It is simple to use and easy to carry, does not need to be worn on the surface of the human body, and can achieve non-contact medical-grade health monitoring.

The invention relates to the technical field of ceramic materials, in particular to temperature-stable low-loss low-dielectric tetragonal lithium-based microwave dielectric ceramic and a preparation method thereof, the chemical formula of the microwave dielectric ceramic is LiScO2, and the preparation raw materials are Li2CO3 and Sc2O3. The preparation method comprises the following steps: weighing Li2CO3 powder and Sc2O3 powder according to a certain proportion, mixing, sequentially carrying out wet grinding and drying, pre-sintering for 4-8 hours in an air atmosphere at the temperature of 700 DEG C to obtain pre-sintered powder, carrying out secondary ball milling and drying on the pre-sintered powder, adding a binder, granulating, carrying out compression molding, and finally sintering for 4-8 hours in an air atmosphere at the temperature of 875-925 DEG C, so as to obtain the Li2CO3 / Sc2O3 composite material. The tetragonal lithium-based microwave dielectric ceramic can be obtained. The LiScO2 microwave dielectric ceramic prepared at the sintering temperature of 900 DEG C has a near-zero temperature coefficient of resonance frequency (-3.4 ppm / DEG C), can ensure the thermal stability of devices, and is widely used for manufacturing various dielectric antenna substrates, resonators, filters and other microwave devices.

An antenna module as a radio-frequency (RF) integrated circuit (IC) semiconductor die (“die”) with an integrated antenna substrate. The die with the integrated antenna substrate can be provided as part of a single IC chip that is fabricated as part of a wafer-level fabrication process as an example. The antenna elements are formed in one more antenna layers as part of an antenna substrate. The antenna layers may be formed as re-distribution layers (RDLs) for example to support smaller line-spacing (LS) and / or smaller pitched metal interconnects for forming and interconnecting to smaller wavelength antenna elements for supporting higher frequency communications. The antenna substrate is formed on a semiconductor wafer of an IC as part of the die. In this manner, the antenna layers can be formed as part of a wafer-level fabrication process used to form the die to form the antenna layers.

The present invention provides an antenna module in which a first radiation pattern of a first antenna base is formed as a cross-sectional pattern, and both ends of the first radiation pattern are connected to a terminal pattern via a connection base to reduce the manufacturing costs of the antenna module.

The application discloses a flat building block type antenna array, which comprises an antenna unit and a metal floor, and the building block type antenna unit is composed of an antenna substrate, a hard foam plate, a multifunctional metal disc and a slanted wedge connector, and is fastened to the metal floor by four medium screws. A group of 4*4 circular metal patches are distributed on the upper surface of the antenna substrate, and a group of 5*5 circular through holes penetrate through the whole substrate, and two pairs of rhombus-like metal patches are distributed on the lower surface of the substrate, thereby forming the radiation arms of a dual-polarized dipole antenna. The multifunctional metal disc comprises one metal disc and five metal cylinders. The slanted wedge connector is composed of a metal inner core, a Teflon cylinder and a metal shell. Since the building block type antenna unit adopts a flat and modular design, the low profile and lightweight design of the UHF frequency band phased array antenna are realized, and the flexible and expandable array scale can be realized by changing the size of the metal floor.

A semiconductor package includes a redistribution substrate including a first surface and a second surface that are opposite to each other, an antenna substrate on the first surface and including a first insulating portion and antenna patterns on a top surface of the first insulating portion, and a first semiconductor chip on the second surface. The redistribution substrate includes a second insulating portion, and a redistribution pattern in the second insulating portion. The redistribution pattern includes an interconnection portion extending parallel to a top surface of the second insulating portion, and a via portion protruding from the interconnection portion toward the first surface. A width of the via portion decreases as a height in a direction from the second surface toward the first surface increases. The active surface of the first semiconductor chip is adjacent to the second surface.

The present invention provides a semiconductor package, which includes: a connection structure including one or more redistribution layers; a core structure arranged on a surface of the connection structure; a semiconductor chip arranged on the surface and including connection pads electrically connected to the redistribution layers of the connection structure; a first encapsulant arranged on the surface and covering at least a portion of each of the core structure and the semiconductor chip; an antenna substrate arranged on the first encapsulant and including one or more wiring layers, at least a portion of the wiring layers including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the core structure, the first encapsulant and the antenna substrate.

An antenna substrate includes a main body having a first surface and a second surface opposite to each other and a side surface connecting the first surface and the second surface to each other, an antenna part disposed on the first surface of the main body, and a pad part disposed in the main body, exposed to the side surface of the main body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the main body toward the first surface of the main body. When viewed in the first direction, a width of at least one pad layer of the plurality of pad layers in a second direction is greater than a width in a third direction perpendicular to the second direction.

A radiation patch, an antenna substrate, an antenna, and a communication device. The communication device has an antenna, the antenna has an antenna substrate, and the antenna substrate has a radiation patch, wherein a plurality of branches are disposed at the periphery of the radiation patch; the plurality of branches are symmetrical about the center of the radiation patch; and a starting end of each branch is connected to the radiation patch and is suitable for disposing an open-circuit stub, and a tail end of the branch is suitable for disposing a short-circuit stub.

An antenna substrate according to an embodiment includes an insulating layer, a circuit layer disposed on the insulating layer, and a protective layer disposed on the insulating layer and the circuit layer, wherein the protective layer is disposed to overlap with the circuit layer in a vertical direction and a horizontal direction, and has a permittivity (Dk) of between 20 and 40.

An antenna substrate includes a dielectric substrate having a main surface; and first to third planar radiation electrodes and first and second feed lines located on the main surface of the dielectric substrate. A size difference between the first and second radiation electrodes and a size difference between the first and third radiation electrodes are larger than a size difference between the second and third radiation electrodes. The first and second feed lines are connected to at least one of the first to third radiation electrode at first and second connection points different from each other. The first radiation electrode is adjacent to the second radiation electrode in a first direction and is adjacent to the third radiation electrode in a second direction different from the first direction.

A substrate connection structure includes a first substrate, a second substrate partially facing the first substrate, and a transmission line extending over the first and second substrates. The transmission line includes a first transmission line on a first surface of the first substrate facing the second substrate, a second transmission line on a second surface of the second substrate facing the first substrate. A through-hole wiring is located at a position not overlapping with the second transmission line. A connection conductor is on the first surface and connects to the through-hole wiring. The first transmission line connect the connection conductor to the second transmission line. A size of the first transmission line is smaller than a size of the connection conductor in a direction orthogonal to a direction in which the first transmission line extends.