475 results about "Antenna substrate" patented technology

An RFID device, such as an RFID tag or label, includes a combined reactive coupler electrically coupling a transponder chip to an antenna. The combined reactive coupler includes a magnetic coupler and a capacitive coupler. The magnetic coupler and the reactive coupler may have respective coupling elements on both the interposer and on an antenna substrate.

A compensating multi layer material includes two compensating layers adjacent to one another. A multi-layer embodiment of the invention produces subwavelength near-field focusing, but mitigates the thickness and loss limitations of the isotropic “perfect lens”. An antenna substrate comprises an indefinite material.

Apparatus and methods according to examples of the present invention include providing an electrical interconnection between an RF circuit and an antenna, the electrical interconnection including a transition via through an antenna substrate. The electrical connection can be configured so as to provide low losses.

A non-contact reader/writer for an IC card includes an antenna substrate provided with a loop antenna and a capacitor on its upper surface, a control substrate provided with a transmitting/receiving circuit and a chip coil on its upper surface, and a magnetic sheet disposed between the antenna substrate and the control substrate. A magnetic flux generated by the chip coil on the control substrate passes through the loop antenna to cause magnetic coupling, so that the loop antenna and the transmitting/receiving circuit need not be connected to each other through a communication cable.

The invention relates to a chip package structure and a device. Wafer-scale packaging structures and methods are provided for integrally packaging antenna structures with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems for millimeter wave (mmWave) and Terahertz (THz) applications. For example, a chip package includes an RFIC chip, an antenna structure and an interface layer. The RFIC chip includes a semiconductor substrate having an active surface and an inactive surface, and a BEOL (back end of line) structure formed on the active surface of the semiconductor substrate. The antenna structure includes an antenna substrate and a planar antenna radiator formed on a surface of the antenna substrate, wherein the antenna substrate is formed of a low loss semiconductor material. The interface layer connects the antenna structure to the BEOL structure of the RFIC chip.

Forming antenna structures having turns of wire, foil or conductive material on a an antenna substrate or in a layer of adhesive layer on a carrier substrate, transferring the antenna structures individually or many at once to corresponding transponder sites on an inlay substrate and connecting the aligned termination ends of the antenna structures to terminal areas of RFID chip modules at the transponder sites. Transferring may be performed by various means such as laminating (heat and pressure), or heating the antenna structures directly or indirectly. The antenna substrate may be in web format or sheet format. Automated manufacturing procedures are disclosed. Kits having components for manufacturing inlay substrates, inlays and secure documents are disclosed. Various features of an inlay substrate and chip module are disclosed.

A hybrid multi-antenna system includes a system circuit board, an antenna substrate, at least a dipole antenna, and at least a monopole-slot antenna. The system board has at least a system ground plate, and the system ground plate is served as a reflector of the hybrid multi-antenna system. The antenna substrate and the system ground plate have a first distance therebetween. The dipole antenna having a first signal feed-in source and the monopole-slot antenna having a second signal feed-in source respectively provide a first and second operating band, and they are on a surface of the antenna substrate. The monopole-slot antenna is located nearby the dipole antenna. The monopole-slot antenna and the dipole antenna have a second distance therebetween. The first and second signal feed-in sources are vertical to each other, and have the phase difference of 90°.

Described are RFID structures and methods for forming RFID structures. An RFID structure includes a loop antenna assembly, an antenna substrate supporting the loop antenna assembly, and a shielding layer parallel with a plane defined by the antenna substrate. The loop antenna assembly has a stand-alone resonant frequency of ƒ₁ above or below a standardized reader frequency range. The loop antenna includes an antenna track and at least two contact pads. The loop antenna assembly in combination with the shielding layer has a resonant frequency of ƒ₂ below the standardized reader frequency range. If positioned against a metallic surface, the loop antenna assembly in combination with the shielding layer has a resonant frequency within the standardized reader frequency range.

A circuit board includes an antenna substrate and a main substrate. The antenna substrate has at least one first linking portion. The main substrate has at least one second linking portion. The first linking portion connects with the second portion so that the antenna substrate assembles with the main substrate. Herein, the antenna is substantially perpendicular to the main substrate.

The invention discloses a ferrite-base composite magnetic dielectric antenna substrate material and a preparation method thereof. The ferrite-base composite magnetic dielectric antenna substrate material is formed by combining a main phase material which accounts for 85-90wt% and an auxiliary phase material which accounts for 15-10% in percentage by mass, wherein the main phase material is Co2Z type hexagonal ferrite, with molecular formula represented as Ba3-xSrxCo2Fe24-yO41, wherein x ranges from 0 to 1.5 and y ranges from 0 to 4; the auxiliary phase material is polyimide resin. The magnetic dielectric composite substrate material has a relatively low magnetic conductivity and a relatively high dielectric constant within a frequency range of 300MHz-3GHz, and the composite substrate material is comparatively high in miniaturization factor and is simultaneously comparatively low in both magnetic loss and dielectric loss; the composite substrate material, in comparison with the conventional ceramic substrate material, is better in mechanical shock resistance. The ferrite-base composite magnetic dielectric antenna substrate material is not only favorable for reducing the weight and size of an antenna, but also conductive to improving the bandwidth of the micro-strip antenna and for inhibiting the generation of a surface wave.

A Ultra WideBand (UWB) substrate type dipole antenna is provided which has a stable radiation pattern. The UWB substrate type dipole antenna includes a dielectric substrate, a first radiator formed on a side of the dielectric substrate, a signal line transmitting an energy from a coaxial cable to the first radiator, and a plurality of second radiators formed at a predetermined distance from the first radiator and the signal line, and respectively having therein a plurality of slits of a predetermined configuration. Because there is no leakage of electric current to an outer part of an external conductor of the coaxial cable, even when the connection of the connector and the coaxial cable to the antenna, distortion of the radiation pattern of the antenna is prevented. As a result, the same radiation pattern and the direction of maximum radiation may be obtained before and after connection with the connector and the coaxial cable.

Antennas for use in mobile communication devices are disclosed. The antennas disclosed can include a substrate with a base, a top, a front side and a back side; a first conductor can be located on the first side of the antenna substrate; and a second conductor can be located on the second side of the antenna substrate. The conductors can have single or multiple branches. If a conductor is a single branch it can, for example, be a spiral conductor or a conducting plate. If a conductor has multiple branches, each branch can be set up to receive a different frequency band. A conductor with multiple branches can have a linear branch and a space-filling or grid dimension branch. A conducting plate can act as a parasitic reflector plane to tune or partially tune the resonant frequency of another conductor. The first and second conductors can be electrically connected.

The invention relates to a high-dielectric-constant resin composition, as well as a prepreg and a copper-clad laminate (CCL) which are manufactured thereby. The prepreg manufactured by the high-dielectric-constant resin composition comprises high-dielectric-constant glass fiber fabric and a high-dielectric-constant resin composition subjected to impregnation drying and then attached to the high-dielectric-constant glass fiber fabric. The CCL manufactured by the high-dielectric-constant resin composition comprises at least one overlapped prepreg and copper foils pressed and coated on both sides of the overlapped prepregs. The CCL manufactured by the high-dielectric-constant resin composition has the performances of high dielectric constant, low dielectric loss, high glass transition temperature, high peel strength and the like and can meet the performance requirement of the high-dielectric-constant antenna substrate.

Radiotelephone antennas include rigid antenna elements integral to the antenna substrate or housing. As such, the present invention configures the antenna without requiring a separate flex circuit winding to provide the conductive windings in the antenna. Methods for fabrication of the antenna are also described. Preferably, the antenna is formed in a two-shot molding process.

The invention relates to a resin composition used for forming a dielectric layer of a dielectric substrate for an antenna. The resin composition comprises (A), epoxy resin containing a naphthalene nucleus or diphenyl structure, (B), any one of or a mixture of at least two of tri(4-hydroxyphenyl) methane type epoxy resin, o-cresol type novolac epoxy resin and phenol type novolac epoxy resin, (C), a resin fusion viscosity modifier, and (D), spherical ceramic powder after presintering treatment. With the adoption of the resin composition, the obtained dielectric substrate has a high dielectric constant, high peeling strength, a low thermal expansion coefficient and very good thickness consistency, and can meet a performance requirement of the high dielectric constant antenna substrate.

The invention provides an antenna module-use magnetic core member capable of improving a communication distance without increasing a module thickness, and an antenna module and a portable information terminal provided with this. An antenna module (1) comprising a sheet-formed magnetic core member (4) layered on a looped antenna coil-formed antenna substrate (2), wherein a magnetic core member (4) having a performance index, expressed by mu' * Q, of 300 or higher is used when Q is a reciprocal of a loss factor (tan delta=mu''/mu') expressed by the real part mu' and the imaginary part mu'' of a complex permeability at a frequency used.

An antenna substrate for a non-contact communication apparatus includes a support substrate and an antenna coil provided on or inside of the support substrate. The antenna coil has a first opening and an auxiliary coil. The auxiliary coil has a second opening which has an opening area smaller than the first opening. The auxiliary coil is insulated and isolated from the antenna coil, and arranged so that the second opening is opposed to a part of the first opening when viewed from a direction orthogonal to a surface of the support substrate.

Antenna systems for passive radio-frequency identification (RFID) tags. The antenna systems have a very small form factor with good power harvesting and good performance in proximity to other antennas. The antenna system includes at least one, and preferably two, parallel serpentine antenna elements formed on, or otherwise supported by, an antenna substrate so that a RFID-tag integrated circuit (IC) can be electrically contacted to the antenna system at one end of the antenna substrate. A conducting wire that runs in the same direction as the at least one serpentine antenna element is used to match impedance and enhance antenna performance and power flow between the antenna and the IC. An impedance-matching circuit may be employed in place of the conducting wire to facilitate impedance matching between the antenna and the IC.

Belonging to the technical field of electronic materials, the invention relates to a microstrip antenna composite substrate material and its preparation method. The composite substrate material is formed by compounding 70-90 parts by mass of a main phase material and 10-30 parts by mass of an auxiliary phase material, wherein, the main phase material is a Co2Z hexagonal ferrite which has a molecular formula of Ba3-xSrxCo2Fe24O41 (with x located in the range of 0-1.5), and the auxiliary phase material is polypropylene resin. The preparation method consists of: 1) material weighing, mixing, first ball milling and drying; 2) presintering; 3) secondary ball milling and drying; 4) sintering; 5) tertiary ball milling and drying; 6) compounding and granulation; 7) thermoforming, etc. The composite substrate material has an isomagnetic dielectric property and low loss in a frequency scope of 300MHz-3GHz, and has certain flexibility at the same time. The preparation method in the invention is simple and easy to operate, and convenient for mastering and popularization. Employment of the composite substrate material as a microstrip antenna substrate is conducive to reduce microstrip antenna weight and volume, and is in favor of enhancing the bandwidth and radiation efficiency of microstrip antennas.

A pit transmitter assembly (10) for RF communication of signals representing utility meter data, includes a transmitter (60) supported by a transmitter substrate (61), a planar ground conductor (43) disposed over the transmitter (60), an antenna substrate (42) disposed on edge on the planar ground conductor (43), a flat coil antenna conductor (41) disposed on two opposite sides of the antenna substrate (42) and in which the transmitter (60) includes an L-C circuit (50) connected to the antenna conductor (41) to provide operation of the antenna in the 450 Mhz-470 Mhz frequency range.

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.