339 results about "Antenna substrate" patented technology

The invention relates to the technical field of antenna equipment, in particular to a multi-frequency resonant circularly polarized antenna array and a communication performance test method thereof, and solves the problem that an antenna cannot communicate through different frequencies at the same time. The antenna array comprises an antenna substrate, a circular antenna assembly and a radio frequency signal line; the circular antenna assembly comprises a feeding point, a feeder line and a radiation unit; when the circular antenna assembly works in a low-frequency working frequency band, the first branch knot and the second branch knot in the radiation unit form a first equivalent resonance length, and when the circular antenna assembly works in a high-frequency working frequency band, the part, close to the feeder line, of the second branch knot in the radiation unit and the third branch knot form a second equivalent resonance length. And when the circular antenna assembly works in a working frequency band with higher frequency, the part, close to the feeder line, of the second branch knot in the radiation unit and the fourth branch knot form a third equivalent resonance length. According to the invention, multi-band radiation and receiving can be realized, and the flexibility of the antenna is improved.

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

An antenna apparatus includes an antenna substrate with opposite first and second surfaces; and a PCB having opposite first and second surfaces. Antenna elements are disposed at the first surface of the antenna substrate. Electrically conductive columns, each having a first end attached to the second surface of the PCB and a second end attached to the second surface of the antenna substrate, secure the PCB to the antenna substrate and provide an electrical interconnect between the PCB and the antenna substrate. RFIC chips are each attached to the second surface of the antenna substrate and are coupled to the antenna elements. At least one circuit element is attached to the first surface of the PCB and electrically coupled to at least one of the RFIC chips through at least one of the electrically conductive columns.

The present invention discloses a wide microstrip antenna array based antenna system for millimeter wave applications. The microstrip antenna array based antenna system of the present invention includes plurality of patch antennas and each of the patch antennas includes a U-slot of unequal arms. This patch antenna with the U-slot acts as the array element. The array elements are placed in a linear array at a distance of λ / 2 from each other on the antenna substrate to achieve desired scan performance. The microstrip corporate feed network with T-junction power divider is used. The antenna elements are fed by electromagnetic coupling with the feed network. The antenna array with dummy elements on both sides of the linear array together with an extra ground plane is used to achieve improved array performance with high main lobe gain and reduced side lobe.

An electronic device is provided. The electronic device includes an antenna substrate and an antenna array comprising a sub array, the sub array includes a plurality of antenna elements, feeding network circuitry including a first power divider for first polarization and a second power divider for second polarization, which differs from the first polarization, and network circuitry for decoupling of a first signal of the first power divider and a second signal of the second power divider, wherein the sub array is disposed on a first surface of the antenna substrate, and wherein the feeding network circuitry disposed on the first side or a second side opposite to the first side of the antenna substrate, and wherein the network circuitry for decoupling is disposed in a region between the first power divider and the second power divider in the first side or the second side of the antenna substrate.

A hybrid antenna substrate of an embodiment comprises: a core part including a core layer and a core wiring layer laminated in the vertical direction; and an antenna part disposed on the core part, wherein: the antenna part comprises a plurality of antenna wiring layers successively laminated on the core part and antenna insulating layers disposed between the plurality of antenna wiring layers; and the core layer has a greater dielectric constant than the antenna insulating layers.

The invention relates to the technical field of ceramic materials, in particular to vanadium-based zircon microwave dielectric ceramic and a preparation method thereof.The vanadium-based zircon microwave dielectric ceramic is prepared from, by weight, Bi2O3, La2O3, CeO2, Nd2O3, Sm2O3 and NH4VO3, the chemical formula of the vanadium-based zircon microwave dielectric ceramic is (Bi < 0.2 > La < 0.2 > Ce < 0.2 > Nd0. 2Sm < 0.2 >) VO4, powder of Bi2O3, La2O3, CeO2, Nd2O3, Sm2O3 and NH4VO3 is obtained based on the components of the vanadium-based zircon microwave dielectric ceramic by weight, and original powder is obtained; stirring and mixing the original powder, performing wet grinding treatment and drying treatment to obtain dried powder, and pre-sintering the dried powder in the air atmosphere to obtain pre-sintered powder; a binder is added into the pre-sintered powder for granulation, compression molding is carried out, sintering is carried out in the air atmosphere, the vanadium-based zircon microwave dielectric ceramic is obtained, the vanadium-based zircon microwave dielectric ceramic has the near-zero resonant frequency temperature coefficient, the thermal stability of a device can be guaranteed, and the service life of the device is prolonged. The method is widely used for manufacturing microwave devices such as various dielectric antenna substrates, resonators and filters.

A phased array antenna may include an antenna substrate, an array of antenna elements carried by the antenna substrate, and time delay units (TDUs) coupled to the array of antenna elements. Each time delay unit may include a circuit substrate, and delay circuits carried by the circuit substrate and coupled in series. Each delay circuit has a controllable respective signal delay value. At least one first delay circuit of the delay circuits may include a bypassable delay circuit having a bypassable signal loss, and at least one second delay circuit of the delay circuits may include a non-bypassable delay circuit having a non-bypassable signal loss.

An ESA antenna includes a layer of filters between the layer of radiating elements and the ground layer. The filter layer obviates certain post processing steps. The filters define a passband at the operating range of the antenna and a stopband defined to prevent crosstalk or reduce known external interference. Each filter includes alternating cells of a resonator cell formed by two split ring resonators and a resonator cell formed by a complementary split ring resonator and a complementary patch / stub. A particular implementation of the filter defines an operating range around 23 gigahertz with a passband to stopband transition of less than 500 megahertz. Vias may connect the filter layer to a surface component layer with beamforming integrated circuits, bypassing the routing layer.

An antenna substrate, electronic package and manufacturing method thereof are provided in which an antenna substrate including a silicon core layer, a circuit structure and conductive pillars, and the circuit structure has a first dielectric layer, a first circuit layer and a first antenna portion. The circuit structure and the conductive pillars are formed on opposite sides of the silicon core layer, and the antenna substrate is stacked and bonded to a circuit board having a second antenna portion through the conductive pillars. Thereby, the present disclosure can thin a thickness of the antenna substrate and the electronic package, or precisely control a distance between the antenna substrate and the circuit board.

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

An antenna assembly can include an internal ground plane, a base PCB, and a plurality of antennas. The base PCB can be positioned above the internal ground plane. The base PCB can include a plurality of individual ground planes spaced circumferentially about a center of the base PCB, with the plurality of individual ground planes being electrically connected to the internal ground plane. Each antenna of the plurality of antennas can be electrically connected to an individual ground plane of the plurality of individual ground planes. The plurality of antennas can include a plurality of multi-band antennas and one or more WiFi antennas.

An antenna and an electronic device are provided. The antenna includes a phase shifting unit, a reference electrode layer, and an antenna substrate; the phase shifting unit includes at least one phase shifter, each includes a first transmission structure, a second transmission structure, and a phase shifting structure therebetween; the reference electrode layer is provided with at least one and second first openings; the antenna substrate includes a first dielectric substrate, and a feed structure and at least one first radiation portion on a side of the first dielectric substrate away from the reference electrode layer; the feed structure includes at least one first and second feed ports; for each phase shifter, the first transmission structure is electrically connected to a corresponding second feed port through a corresponding first opening; and the second transmission structure is electrically connected to a corresponding first radiation portion through a corresponding second opening.

The invention provides an integrated antenna integrating Beidou, low-orbit and Tiantong satellite communication and high-precision navigation positioning. A low-orbit satellite microstrip antenna, a GNSS high-precision microstrip antenna, a Tiantong microstrip antenna and a Beidou short message microstrip antenna are sequentially stacked on the upper surface of a PCB in a conical mode. A shielding cover is arranged on the lower side of the PCB; antenna radiation patches of the low-orbit satellite microstrip antenna are arranged on the outer edges of the upper surface and the lower surface of the low-orbit satellite antenna substrate and are not covered by the GNSS high-precision microstrip antenna; circuits of the low-orbit satellite microstrip antenna and the sky-pass microstrip antenna are arranged on the upper surface of the PCB circuit substrate. And circuits of the GNSS high-precision microstrip antenna and the Beidou short message microstrip antenna are arranged on the lower surface of the PCB. According to the invention, the four-in-one combined design of the antenna, the low-orbit satellite antenna, the Beidou short message antenna and the high-precision navigation antenna is adopted, so that the problem of performance insufficiency when each antenna is used independently is solved, complementation among the antenna, the low-orbit satellite antenna, the Beidou short message antenna and the high-precision navigation antenna is realized, and the cost is reduced; the electromagnetic compatibility between the antennas is improved through frequency band and polarization isolation design, and the stability of a communication link is guaranteed through interference resistance of the peripheral low-orbit satellite antenna.

An ESA antenna includes a layer of filters between the layer of radiating elements and the ground layer. The filter layer obviates certain post processing steps. The filters define a passband at the operating range of the antenna and a stopband defined to prevent crosstalk or reduce known external interference. Each filter includes alternating cells of a resonator cell formed by two split ring resonators and a resonator cell formed by a complementary split ring resonator and a complementary patch / stub. A particular implementation of the filter defines an operating range around 23 gigahertz with a passband to stopband transition of less than 500 megahertz. Vias may connect the filter layer to a surface component layer with beamforming integrated circuits, bypassing the routing layer.

The invention discloses a magnetic control chained polyaniline-based broadband bionic wave-absorbing material and a preparation method thereof, and relates to the technical field of electromagnetic wave absorbing materials and space functional composites.The magnetic control chained polyaniline-based broadband bionic wave-absorbing material achieves multi-band impedance matching through the cooperation of orientation arrangement of magnetic nano chains and the polarization effect of a polyaniline interface, is extremely low in average reflection loss at 8-18 GHz under the thickness of 1.5 mm, and can be applied to the field of electromagnetic wave absorbing materials and space functional composites. The composite material covers an X-Ku wave band, the material density is less than or equal to 1.6 g / cm < 3 >, the mechanical strength is high, the composite material can be directly compounded on a flexible film antenna substrate, the satellite load mass is saved by more than or equal to 40%, and the wave absorbing performance attenuation is less than or equal to 5% after 100 times of alternating circulation from-180 DEG C (liquid nitrogen) to + 120 DEG C (vacuum), which is superior to that of a traditional carbon-based material (the attenuation is more than or equal to 20%); magnetic field induction and chemical synthesis are combined, the process temperature is smaller than or equal to 250 DEG C, and a flexible processing production line of an existing satellite film antenna is compatible.

The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments of the disclosure, an antenna module in a wireless communication system may include: a plurality of antenna elements; a first antenna substrate; a second antenna substrate; and a Printed Circuit Board (PCB). A first side of the first antenna substrate may be coupled to each of the plurality of antenna elements, and a second side of the first antenna substrate opposite to the first side of the first antenna substrate may be coupled to the PCB. A first side of the second antenna substrate may be coupled to each of the plurality of antenna elements, and a second side of the second antenna substrate opposite to the first side of the second antenna substrate may be coupled to the PCB. A face between the first side of the first antenna substrate and the second side of the first antenna substrate may face a face between the first side of the second antenna substrate and the second side of the second antenna substrate.

An antenna that is coupled to and integrated with a projector, such as a projector included with smart glasses including eyewear. The projector has a housing and includes optical components configured to display an image. At least one antenna is coupled to the projector, wherein the optical components operate and function as an antenna substrate. The optical components are nonmetallic such that the antenna generates a strong E-field. The antenna may be coupled to the projector housing, such as on the inside or the outside surface of the housing. Multiple antennas can be included to generate multiple resonances simultaneously in different frequency bands.

The present disclosure relates an antenna assembly that includes an antenna structure and a substrate. The antenna structure may be formed from a single contiguous piece of metal. The antenna structure may include at least one slot antenna formed in the single contiguous piece of metal. The substrate may include at least one dielectric layer, and a waveguide comprising a metallized cavity that extends through the at least one dielectric layer. The antenna structure may be attached to the substrate, may be disposed at an upper surface of the substrate, and may cover the metallized cavity of the waveguide. The substrate may be a printed circuit board (PCB) substrate, an in-mold electronics (IME) substrate, a molded interconnect device (MID) substrate, or another suitable substrate.

The invention relates to the field of dual-frequency circularly polarized antennas, in particular to a dual-frequency circularly polarized antenna based on a thermal protection system and an artificial reflection surface design method. The dual-frequency circularly polarized antenna based on the thermal protection system comprises the thermal protection system 1 and an artificial reflection surface 7, the thermal protection system 1 is a planar double-layer thermal protection sheet body, the thermal protection system 1 covers the dual-frequency circularly polarized antenna 2 to separate the antenna from an external heat source, and the artificial reflection surface 7 replaces a grounding plate of the antenna. And the grounding plate is placed at the bottom of the antenna substrate, is separated from the antenna by a set distance and is used for repairing the damage of the loading thermal protection system and the grounding plate to the antenna circular polarization performance. The antenna grounding plate is replaced by the artificial reflection surface, the performance of the circularly polarized antenna can be effectively improved under the condition that a thermal protection system is not changed, and good balance between the overall electrical performance and the thermal protection performance of the system is achieved.

An ultra-wideband end-fire antenna with a common aperture embedded in a metal carrier includes a metal cavity with a coaxial cable compartment on one side. A radiator module is connected to the bottom of the metal cavity via a radiator fixing slot. The radiator module includes a common aperture antenna substrate. A low-frequency radiator is printed on the side of the common aperture antenna substrate closer to the coaxial cable compartment, and a high-frequency radiator is printed on the side farther from the coaxial cable compartment. This invention utilizes a dual-band antenna in a common aperture design to enhance the channel capacity and anti-fading capability of the communication system. At the same time, by achieving the antenna's carrier conformal characteristics, high isolation, and miniaturization, it enriches the antenna's application scenarios and improves the overall performance of the communication system.

The invention discloses printing equipment for RFID antenna production, which comprises a printing table and a printing unit, a pressing mechanism is arranged on the top surface of the printing table, the pressing mechanism is used for pressing an RFID antenna base material and a template on the top surface of the printing table, the printing unit is arranged on the top surface of the printing table, and the printing unit comprises a scraping printing assembly and an adjusting assembly. The printing unit comprises a scraping and printing assembly and an adjusting assembly, the scraping and printing assembly is used for scraping and printing conductive ink on a template and an RFID antenna base material, the adjusting assembly is used for adjusting the scraping and printing assembly so as to scrape and print the RFID antenna base material and the template with different thicknesses, and the gathering unit is arranged on the outer side of the printing unit and used for gathering the diffused conductive ink. The gathering unit is arranged on the printing unit to ensure that the printing unit performs uniform scraping printing on the RFID antenna base material and the template, and the mixing unit is arranged on the outer side of the gathering unit and is used for mixing the stored conductive ink in real time.

Antennas, user equipment, windows and vehicles are described. Some embodiments may include an antenna a substrate; an antenna layer disposed on the substrate comprising a conductive mesh; a solder resist applied on the substrate and the antenna layer and containing a pigment having a tone matching with that of the antenna layer. Other embodiments may be described and / or claimed.

Proposed is an antenna module that includes an antenna substrate including an antenna, a package substrate to which a radio-frequency integrated circuit chip is mounted, and in which a signal transmission line configured to transmit a signal of the radio-frequency integrated circuit chip is provided; and an interconnection member positioned between the antenna substrate and the package substrate to connect the antenna substrate and the package substrate, and provided with a slot through which a radio frequency signal passes.

The invention provides an antenna packaging heat dissipation structure. The antenna packaging heat dissipation structure comprises a circuit board, an antenna substrate, a chip, a plurality of heat dissipation fins, a shell and dielectric fluid. The circuit board has a first surface and a second surface opposite to the first surface. The antenna substrate is arranged on the first surface of the circuit board. The chip is arranged between the antenna substrate and the first surface of the circuit board and is electrically connected with the antenna substrate. The plurality of heat dissipation fins protrude out of the second surface of the circuit board. The housing encapsulates the circuit board, the antenna substrate, the chip and the plurality of heat dissipation fins. The dielectric fluid circularly flows in the housing through the cooling circulation device and is in direct contact with the plurality of heat dissipation fins.

An antenna substrate includes a substrate including a first main surface and a second main surface, and a coil including a first portion supported on the first main surface, and a second portion supported on the second main surface. A communicating portion is formed in the substrate. The communicating portion communicates the first main surface with the second main surface. The first portion and the second portion are electrically connected to each other, through the communicating portion. A winding direction of the first portion and a winding direction of the second portion are identical, when viewed from a direction along a normal line of the first main surface or a normal line of the second main surface.

An antenna element includes a ground conductor, an energization patch conductor positioned on an upper side relative to the ground conductor, and a non-energization patch conductor positioned on an upper side relative to the energization patch conductor. The energization patch conductor includes a first side and a second side extending along a resonance direction. The non-energization patch conductor includes a plurality of segments. The plurality of segments include a first segment positioned along the first side and a second segment positioned along the second side. In plan view, a total area of the non-energization patch conductor is smaller than an area of the energization patch conductor.

The present invention relates to the field of antenna technology in wireless communication transmission, and discloses an air dielectric antenna device, which includes an antenna substrate, a metal sheet antenna, a feeder circuit and a U-shaped metal wall; wherein the antenna substrate includes a first surface and a second surface; the first surface is a metal surface, constituting a ground potential metal plate; the second surface is provided with an antenna circuit and components and includes a circuit shielding cover; the metal sheet antenna is connected to a circuit signal source on the second surface of the antenna substrate through a feeder circuit, and two mutually orthogonal current resonance modes of the metal sheet antenna are excited; the first surface of the antenna substrate is welded with a U-shaped metal wall, and the U-shaped metal wall is close to the diagonal of the metal sheet antenna to generate electric field line reflection. The present invention utilizes the U-shaped metal wall structural design to realize the miniaturization and lightweight of the antenna under air dielectric conditions, reduce the dielectric loss of the antenna, optimize the directivity of the antenna, and ultimately achieve the effect of enhancing the radiation gain of the antenna.

A phased array antenna may include an antenna substrate, an array of antenna elements carried by the antenna substrate, and time delay units (TDUs) coupled to the array of antenna element. Each time delay unit may include a circuit substrate, and delay circuits carried by the circuit substrate and coupled in series. Each delay circuit may have a respective signal delay value. At least one external bypass connection is carried by the circuit substrate and is coupled to the delay circuits to configure an overall time delay of the time delay unit.

This antenna module comprises an antenna substrate provided with at least one radiation electrode, and a high-frequency circuit module mounted on the antenna substrate. The high-frequency circuit module has a rectangular shape having two long sides and two short sides in a plan view, and has a first side surface and a second side surface corresponding to the two long sides, and a third side surface and a fourth side surface corresponding to the two short sides. The antenna substrate has a first substrate side surface, a second substrate side surface, a third substrate side surface, and a fourth substrate side surface. In the plan view, the first substrate side surface of the antenna substrate is positioned in the same plane as the first side surface of the high-frequency circuit module, or is positioned inward of the first side surface while overlapping the high-frequency circuit module. At least one of the second substrate side surface, the third substrate side surface, and the fourth substrate side surface of the antenna substrate is positioned in a region that does not overlap the high-frequency circuit module in the plan view.