100 results about "Antenna substrate" patented technology

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

An antenna assembly can include an internal ground plane, a base PCB, and a plurality of antennas. The base PCB can be positioned above the internal ground plane. The base PCB can include a plurality of individual ground planes spaced circumferentially about a center of the base PCB, with the plurality of individual ground planes being electrically connected to the internal ground plane. Each antenna of the plurality of antennas can be electrically connected to an individual ground plane of the plurality of individual ground planes. The plurality of antennas can include a plurality of multi-band antennas and one or more WiFi antennas.

The invention provides an integrated antenna integrating Beidou, low-orbit and Tiantong satellite communication and high-precision navigation positioning. A low-orbit satellite microstrip antenna, a GNSS high-precision microstrip antenna, a Tiantong microstrip antenna and a Beidou short message microstrip antenna are sequentially stacked on the upper surface of a PCB in a conical mode. A shielding cover is arranged on the lower side of the PCB; antenna radiation patches of the low-orbit satellite microstrip antenna are arranged on the outer edges of the upper surface and the lower surface of the low-orbit satellite antenna substrate and are not covered by the GNSS high-precision microstrip antenna; circuits of the low-orbit satellite microstrip antenna and the sky-pass microstrip antenna are arranged on the upper surface of the PCB circuit substrate. And circuits of the GNSS high-precision microstrip antenna and the Beidou short message microstrip antenna are arranged on the lower surface of the PCB. According to the invention, the four-in-one combined design of the antenna, the low-orbit satellite antenna, the Beidou short message antenna and the high-precision navigation antenna is adopted, so that the problem of performance insufficiency when each antenna is used independently is solved, complementation among the antenna, the low-orbit satellite antenna, the Beidou short message antenna and the high-precision navigation antenna is realized, and the cost is reduced; the electromagnetic compatibility between the antennas is improved through frequency band and polarization isolation design, and the stability of a communication link is guaranteed through interference resistance of the peripheral low-orbit satellite antenna.

The present disclosure relates an antenna assembly that includes an antenna structure and a substrate. The antenna structure may be formed from a single contiguous piece of metal. The antenna structure may include at least one slot antenna formed in the single contiguous piece of metal. The substrate may include at least one dielectric layer, and a waveguide comprising a metallized cavity that extends through the at least one dielectric layer. The antenna structure may be attached to the substrate, may be disposed at an upper surface of the substrate, and may cover the metallized cavity of the waveguide. The substrate may be a printed circuit board (PCB) substrate, an in-mold electronics (IME) substrate, a molded interconnect device (MID) substrate, or another suitable substrate.

An ultra-wideband end-fire antenna with a common aperture embedded in a metal carrier includes a metal cavity with a coaxial cable compartment on one side. A radiator module is connected to the bottom of the metal cavity via a radiator fixing slot. The radiator module includes a common aperture antenna substrate. A low-frequency radiator is printed on the side of the common aperture antenna substrate closer to the coaxial cable compartment, and a high-frequency radiator is printed on the side farther from the coaxial cable compartment. This invention utilizes a dual-band antenna in a common aperture design to enhance the channel capacity and anti-fading capability of the communication system. At the same time, by achieving the antenna's carrier conformal characteristics, high isolation, and miniaturization, it enriches the antenna's application scenarios and improves the overall performance of the communication system.

The invention discloses printing equipment for RFID antenna production, which comprises a printing table and a printing unit, a pressing mechanism is arranged on the top surface of the printing table, the pressing mechanism is used for pressing an RFID antenna base material and a template on the top surface of the printing table, the printing unit is arranged on the top surface of the printing table, and the printing unit comprises a scraping printing assembly and an adjusting assembly. The printing unit comprises a scraping and printing assembly and an adjusting assembly, the scraping and printing assembly is used for scraping and printing conductive ink on a template and an RFID antenna base material, the adjusting assembly is used for adjusting the scraping and printing assembly so as to scrape and print the RFID antenna base material and the template with different thicknesses, and the gathering unit is arranged on the outer side of the printing unit and used for gathering the diffused conductive ink. The gathering unit is arranged on the printing unit to ensure that the printing unit performs uniform scraping printing on the RFID antenna base material and the template, and the mixing unit is arranged on the outer side of the gathering unit and is used for mixing the stored conductive ink in real time.

An antenna element includes a ground conductor, an energization patch conductor positioned on an upper side relative to the ground conductor, and a non-energization patch conductor positioned on an upper side relative to the energization patch conductor. The energization patch conductor includes a first side and a second side extending along a resonance direction. The non-energization patch conductor includes a plurality of segments. The plurality of segments include a first segment positioned along the first side and a second segment positioned along the second side. In plan view, a total area of the non-energization patch conductor is smaller than an area of the energization patch conductor.

This invention provides a silicon-based dielectric resonant antenna with adjustable beamwidth, comprising a beamwidth adjustment structure, an antenna substrate and a dielectric resonator, an excitation antenna, and solder bumps. The multilayer antenna substrate and dielectric resonator are arranged sequentially from top to bottom, with an air cavity formed in the middle. The excitation antenna is located at the bottom of the air cavity. The beamwidth adjustment structure is located on top of the top layer of the antenna substrate and dielectric resonator. A through-silicon via (TSV) is located in the middle of the bottom layer of the antenna substrate and dielectric resonator, with solder bumps located at the bottom of the TSV. This invention significantly reduces the antenna size and improves its radiation efficiency by using high-resistivity silicon as the antenna dielectric. By introducing an air cavity structure and adjusting the beamwidth through the top-layer beamwidth adjustment structure, the antenna application frequency can be changed according to usage, the feeding method can be modified and optimized according to application conditions, and it can be stacked with chips to achieve three-dimensional heterogeneous high-density integration.

A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.

An antenna module includes an antenna substrate and a feed circuit. The antenna substrate has an upper surface and a lower surface, and a radiating element having a flat plate shape is arranged in the antenna substrate. The feed circuit 105 is mounted on the lower surface of the antenna substrate and supplies a radio frequency signal to the radiating element. The antenna substrate includes a dielectric substrate on which the radiating element is arranged, a ground electrode, a feed wiring, and carbides. The ground electrode is arranged between the radiating element and the lower surface in the dielectric substrate. The feed wiring transmits the radio frequency signal supplied from the feed circuit to the radiating element. The carbides are disposed on at least a part of a side surface connecting the upper surface and the lower surface in the dielectric substrate.

The invention relates to the technical field of ceramic materials, in particular to temperature-stable low-loss low-dielectric tetragonal lithium-based microwave dielectric ceramic and a preparation method thereof, the chemical formula of the microwave dielectric ceramic is LiScO2, and the preparation raw materials are Li2CO3 and Sc2O3. The preparation method comprises the following steps: weighing Li2CO3 powder and Sc2O3 powder according to a certain proportion, mixing, sequentially carrying out wet grinding and drying, pre-sintering for 4-8 hours in an air atmosphere at the temperature of 700 DEG C to obtain pre-sintered powder, carrying out secondary ball milling and drying on the pre-sintered powder, adding a binder, granulating, carrying out compression molding, and finally sintering for 4-8 hours in an air atmosphere at the temperature of 875-925 DEG C, so as to obtain the Li2CO3 / Sc2O3 composite material. The tetragonal lithium-based microwave dielectric ceramic can be obtained. The LiScO2 microwave dielectric ceramic prepared at the sintering temperature of 900 DEG C has a near-zero temperature coefficient of resonance frequency (-3.4 ppm / DEG C), can ensure the thermal stability of devices, and is widely used for manufacturing various dielectric antenna substrates, resonators, filters and other microwave devices.

An antenna module as a radio-frequency (RF) integrated circuit (IC) semiconductor die (“die”) with an integrated antenna substrate. The die with the integrated antenna substrate can be provided as part of a single IC chip that is fabricated as part of a wafer-level fabrication process as an example. The antenna elements are formed in one more antenna layers as part of an antenna substrate. The antenna layers may be formed as re-distribution layers (RDLs) for example to support smaller line-spacing (LS) and / or smaller pitched metal interconnects for forming and interconnecting to smaller wavelength antenna elements for supporting higher frequency communications. The antenna substrate is formed on a semiconductor wafer of an IC as part of the die. In this manner, the antenna layers can be formed as part of a wafer-level fabrication process used to form the die to form the antenna layers.

The application discloses a flat building block type antenna array, which comprises an antenna unit and a metal floor, and the building block type antenna unit is composed of an antenna substrate, a hard foam plate, a multifunctional metal disc and a slanted wedge connector, and is fastened to the metal floor by four medium screws. A group of 4*4 circular metal patches are distributed on the upper surface of the antenna substrate, and a group of 5*5 circular through holes penetrate through the whole substrate, and two pairs of rhombus-like metal patches are distributed on the lower surface of the substrate, thereby forming the radiation arms of a dual-polarized dipole antenna. The multifunctional metal disc comprises one metal disc and five metal cylinders. The slanted wedge connector is composed of a metal inner core, a Teflon cylinder and a metal shell. Since the building block type antenna unit adopts a flat and modular design, the low profile and lightweight design of the UHF frequency band phased array antenna are realized, and the flexible and expandable array scale can be realized by changing the size of the metal floor.

An antenna substrate includes a main body having a first surface and a second surface opposite to each other and a side surface connecting the first surface and the second surface to each other, an antenna part disposed on the first surface of the main body, and a pad part disposed in the main body, exposed to the side surface of the main body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the main body toward the first surface of the main body. When viewed in the first direction, a width of at least one pad layer of the plurality of pad layers in a second direction is greater than a width in a third direction perpendicular to the second direction.

A radiation patch, an antenna substrate, an antenna, and a communication device. The communication device has an antenna, the antenna has an antenna substrate, and the antenna substrate has a radiation patch, wherein a plurality of branches are disposed at the periphery of the radiation patch; the plurality of branches are symmetrical about the center of the radiation patch; and a starting end of each branch is connected to the radiation patch and is suitable for disposing an open-circuit stub, and a tail end of the branch is suitable for disposing a short-circuit stub.

An antenna substrate includes a dielectric substrate having a main surface; and first to third planar radiation electrodes and first and second feed lines located on the main surface of the dielectric substrate. A size difference between the first and second radiation electrodes and a size difference between the first and third radiation electrodes are larger than a size difference between the second and third radiation electrodes. The first and second feed lines are connected to at least one of the first to third radiation electrode at first and second connection points different from each other. The first radiation electrode is adjacent to the second radiation electrode in a first direction and is adjacent to the third radiation electrode in a second direction different from the first direction.

A substrate connection structure includes a first substrate, a second substrate partially facing the first substrate, and a transmission line extending over the first and second substrates. The transmission line includes a first transmission line on a first surface of the first substrate facing the second substrate, a second transmission line on a second surface of the second substrate facing the first substrate. A through-hole wiring is located at a position not overlapping with the second transmission line. A connection conductor is on the first surface and connects to the through-hole wiring. The first transmission line connect the connection conductor to the second transmission line. A size of the first transmission line is smaller than a size of the connection conductor in a direction orthogonal to a direction in which the first transmission line extends.

The application discloses a kind of ultra-wideband miniaturized Vivaldi antenna based on normalized length space method and manufacturing method, and relates to an ultra-wideband miniaturized Vivaldi antenna and manufacturing method.The present application is to solve the problem that the existing miniaturization method generally faces bandwidth narrowing and design complexity improvement.The antenna substrate according to the present application is provided with a slot line on the front surface, and the bottom of the slot line is connected with a circular slot line.The back surface of the substrate is provided with a fan-shaped metal patch, and the fan-shaped metal patch is connected with the bottom edge of the substrate through a feed line.The steps of the antenna manufacturing method according to the present application include step 1, etching process is used to manufacture a traditional Vivaldi antenna structure on a selected substrate;step 2, after the traditional Vivaldi antenna structure is manufactured, a K value is introduced into the slot line function using the normalized length space method, and the ultra-wideband miniaturized Vivaldi antenna is manufactured.The application belongs to the field of communication technology.

To provide a planar antenna equipped with a temperature-controllable metal-insulator phase transition element using a thin-film transistor circuit.SOLUTION: A planar antenna 1 includes an antenna substrate 11 on which are arranged at least one patch antenna P, a signal line LS electromagnetically coupled to the patch antenna P, and a metal-insulator phase transition element V provided on the signal line LS, and a temperature control substrate including a thin-film transistor circuit, having at least one heating element H temperature-controlled using the thin-film transistor circuit as a drive circuit. The antenna substrate and the temperature control substrate are laminated together such that heat from the heating element H can be conducted to the metal-insulator phase transition element V.SELECTED DRAWING: Figure 2

The utility model provides a temperature sensing unit and a detection device. The temperature sensing unit comprises a magnetic material, an antenna substrate, a diamond, a condensing lens, an optical filter, a photoelectric detector and a laser output port. According to the scheme, on the basis of the principle that the magnetic field of the magnetic material can change along with the temperature, the temperature is reversely deduced by measuring the magnetic field change of the magnetic material through the diamond NV color center, and due to the fact that the magnetic field detection sensitivity of the diamond NV color center is extremely high, higher temperature measurement sensitivity can be obtained in a wide temperature range through temperature inversion through the scheme. Meanwhile, the utility model provides a detection device suitable for monitoring the temperature of the cold plate of the dilution refrigerator, and the application feasibility of the NV color center sensing technology in the field is verified.

The invention discloses a flexible composite material and a preparation method thereof, the flexible composite material comprises a polydimethylsiloxane matrix and a dielectric modified filler dispersed in the polydimethylsiloxane matrix, and the polydimethylsiloxane matrix is formed by crosslinking and curing a polydimethylsiloxane precursor and a curing agent; wherein the dielectric modified filler comprises surface-modified CaO-Li2O-Sm2O3-TiO2 ceramic powder and boron nitride powder covering the surface of the surface-modified CaO-Li2O-Sm2O3-TiO2 ceramic powder, and the dielectric constant of the surface-modified CaO-Li2O-Sm2O3-TiO2 ceramic powder is larger than that of the boron nitride powder. The antenna substrate and the antenna made based on the flexible composite material have the characteristics of high flexibility, low dielectric loss, adjustable dielectric constant, compact size and low-temperature large-scale production.

Methods, systems, and devices for an antenna subsystem are described. An antenna subsystem may include multiple printed wiring boards and multiple antenna substrates mounted on multiple sides of the printed wiring boards. The antenna substrates may include one or more planar-oriented elements that emit or receive in a planar orientation and one or more edge-oriented elements that emit or receive in an edge orientation. The antenna elements of one side of the antenna may be offset relative to antenna elements of another side of the antenna, creating a triangular lattice arrangement of antenna elements. The various antenna elements may be connected to one or more analog-to-digital converters that may convert signals received at the antenna elements to obtain digital component receive signals to be processed by one or more signal processors according to a set of beam weights to obtain a signal of a radio frequency beam.

The utility model provides a polarized antenna, comprising a first antenna substrate on which a horizontal polarized antenna array is arranged; the first edge of the second antenna substrate is connected with the second edge of the first antenna substrate, and a preset angle is formed between the first antenna substrate and the second antenna substrate; and a dual-polarized antenna array is arranged on the second antenna substrate. The polarized antenna is installed on an antenna holding pole beside a track or a building, so that the second antenna substrate is right opposite to the track or the building, a wave beam formed by the dual-polarized antenna array correspondingly covers an area at a small incident angle, and a polarization diversity effect is reserved in an area where vertical polarized waves have good penetrability. The first antenna substrate is correspondingly arranged on the side face of the antenna holding pole, a wave beam formed by the horizontal polarization antenna array corresponds to a coverage area at a large incidence angle, and horizontal polarization has better projectability compared with vertical polarization, so that the problem that a part of energy is wasted due to the fact that vertical polarization components of the antenna are reflected is solved.

The invention relates to the technical field of spaceborne planar antenna unfolding, in particular to a passive high-precision space planar antenna unfolding mechanism which comprises a passive unfolding structure composed of an execution unit and a driving unit, a male hinge and a female hinge. Two ends of the passive unfolding structure are respectively connected with the bottoms of the two antenna substrates through a male hinge and a female hinge; the bottom protruding end of the execution unit is hinged to the bottom protruding end of the driving unit. A volute spring is arranged at the hinged part to drive the driving unit to rotate; the execution unit and the driving unit are matched to form two groups of locking structures; a female hinge push rod of the driving unit serves as a key and is inserted into a lock hole of the execution unit to form a first locking structure. A flat spring is arranged at one end, limited in the lock hole, of the pre-tightening spring piece and extends to the outer portion of the execution unit shell to be connected with a locking piece of the driving unit in a matched shackle mode, and a second locking structure is formed. The device is purely mechanically driven, is less affected by the environment, and is simple in principle and high in reliability.

The antenna substrate of the present disclosure includes: a plurality of antenna layers stacked to be spaced apart from each other in a vertical direction; an antenna insulating layer disposed between the plurality of antenna layers; and a transmission line including a capacitive power feeding unit disposed so as to face the plurality of antenna layers across the antenna insulating layer. A plurality of antenna layers including a plurality of high-frequency antenna layers disposed above the capacitance feed unit to be stacked in a vertical direction and configured to radiate a high-frequency signal in a first radio frequency band, and a low-frequency antenna layer; the low-frequency antenna layer is disposed below the capacitive feed unit and is configured to radiate a low-frequency signal in a second radio frequency band lower than the first radio frequency band.

Methods, systems, and devices for an antenna subsystem are described. An antenna subsystem may include multiple printed wiring boards and multiple antenna substrates mounted on multiple sides of the printed wiring boards. The antenna substrates may include one or more planar-oriented elements that emit or receive in a planar orientation and one or more edge-oriented elements that emit or receive in an edge orientation. The various antenna elements may be connected to one or more analog-to-digital converters that may convert signals received at the antenna elements to obtain digital component receive signals that may be processed by one or more signal processors according to a set of beam weights to obtain a signal of a radio frequency beam that may have a field of view greater than (180) degrees.

This application provides an antenna for a high-Earth orbit (HEO) and low-Earth orbit (LEO) integrated satellite communication terminal, and the HEO and LEO integrated satellite communication terminal. The antenna of the HEO and LEO integrated satellite communication terminal includes: a frustum-shaped antenna substrate; a HEO satellite communication module including multiple HEO phased array antenna elements distributed on the upper surface of the frustum-shaped antenna substrate; a LEO satellite communication module including multiple LEO phased array antenna elements distributed on the side surface of the frustum-shaped antenna substrate; and a Global Navigation Satellite System (GNSS) module including a GNSS antenna disposed at the center of the upper surface of the frustum-shaped antenna substrate. This application improves the satellite switching speed of the antenna. This application also provides a HEO and LEO integrated satellite communication terminal.

An antenna substrate according to an embodiment includes: an insulating layer; and a metal pattern disposed on the insulating layer, in which a first gap is disposed between the metal pattern and the insulating layer, and in which a height of the first gap is 0.1% to 10% of a thickness of the insulating layer.

The invention relates to the technical field of antennas, in particular to a radiation patch, an antenna substrate, an antenna, communication equipment and a vehicle. A plurality of branches are arranged on the periphery of the radiation patch, the branches are symmetrical about the center of the radiation patch, the starting ends of the branches are connected with the radiation patch and are suitable for being provided with open circuit columns, and the tail ends of the branches are suitable for being provided with short circuit columns. Due to the arrangement of the branches in the radiation patch, the input impedance of the radiation patch can be adjusted, the port isolation ISO is improved, and the polarization discrimination XPD is increased, so that the efficiency and gain of the antenna provided with the radiation patch are improved, and the signal-to-noise ratio and the communication quality of the antenna are improved.

A wireless communication device manufacturing system is provided that includes a conveyor that conveys an antenna base material in a manner passing through a mounting position, a mounter that mounts an RFIC module on the antenna base material with an insulating adhesive layer interposed therebetween, a roller pair that nips the antenna base material having the RFIC module mounted thereon in a thickness direction of the antenna base material and presses the RFIC module against the adhesive layer, a first dancer roller freely movably placed on the antenna base material on an upstream side of the mounter, and a second dancer roller freely movably placed on the antenna base material on a downstream side of the roller pair. Moreover, each of the first and second dancer rollers includes a cylindrical portion placed on the antenna base material and locking portions provided at respective ends of the cylindrical portion.