79results about How to "Little change in thickness" patented technology

A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.

The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, there is provided a wafer polishing method that can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.

The invention relates to a resin composition used for forming a dielectric layer of a dielectric substrate for an antenna. The resin composition comprises (A), epoxy resin containing a naphthalene nucleus or diphenyl structure, (B), any one of or a mixture of at least two of tri(4-hydroxyphenyl) methane type epoxy resin, o-cresol type novolac epoxy resin and phenol type novolac epoxy resin, (C), a resin fusion viscosity modifier, and (D), spherical ceramic powder after presintering treatment. With the adoption of the resin composition, the obtained dielectric substrate has a high dielectric constant, high peeling strength, a low thermal expansion coefficient and very good thickness consistency, and can meet a performance requirement of the high dielectric constant antenna substrate.

A method for producing gas diffusion electrodes, in particular for use in electrolysis cells, as well as electrodes and their uses are described. A method of the present invention involves first, a sheet-like structure is produced by means of a pair of rolls by rolling a powder mixture containing at least one catalyst or a catalyst mixture and a binder, and then the sheet-like structure is connected to an electrically conductive catalyst support by rolling by means of a pair of rolls. In one embodiment the clamping force of the rolls is preferably kept constant in the range from 0.2 kN/cm to 15 kN/cm.

The invention provides a sizing agent for a near field communication (NFC) magnetic sheet and a manufacturing method thereof. The sizing agent for the NFC magnetic sheet is composed of magnetic powder and organic carriers. The organic carriers contain 15-20wt% of adhesives, 75-83.8wt% of solvents, 0.1-1wt% of defoaming agents, 0.1-1wt% of dispersing agents and 1-5wt% of plasticizers. The adhesives are polyvinyl butyral and/or ethyecellulose. The invention further provides an NFC magnetic sheet manufactured by the sizing agent. The adhesives made of the powder polyvinyl butyral and/or ethyecellulose can replace resin and rubber in the prior art, so that production cycle of the NFC magnetic sheet can be shortened. Magnetic conductivity of the NFC magnetic sheet manufactured by the sizing agent is improved, magnetic powder is evenly distributed, and the magnetic sheet is small in thickness changing in a high-temperature high-humidity environment.

A substrate for inkjet printing, which includes a photoresist layer structure on a base substrate, and a method of manufacturing the same are provided. The substrate, which has high surface tension variation and slight thickness variation, may be manufactured at a low cost. The substrate includes a discontinuous organic layer structure made of a fluorinated hydrocarbon or a polysiloxane on the photoresist layer structure.

The invention provides a grinding machine of an internal combustion abrasive belt of a small-sized steel rail, which is provided with a rack, a transmission device of an abrasive belt, walking contour wheels and an internal combustion engine or a high-speed motor, wherein the transmission device of the abrasive belt and the walking contour wheels are installed on the rack, and the internal combustion engine or the high-speed motor is installed on the transmission device of the abrasive belt. The rack is spanned on a steel rail by a front walking contour wheel and a back walking contour wheel. The transmission device of the abrasive belt comprises a driving wheel, a driven wheel, a tensioning wheel, a tensioning device and an abrasive belt; and the abrasive belt is tightly sleeved on the driving wheel, the driven wheel and the tensioning wheel which are in triangular distribution, and is tensioned by the tensioning device connected with the tensioning wheel. A grinding depth adjustment device adopts a screw adjustment structure and comprises an adjustment hand wheel, a screw, nuts, a fixed sleeve and a guidance key. The grinding machine of the abrasive belt has simple and compact structure, good miniaturization, light weight and high repair welding efficiency and is convenient for the works department of railways to finish the on-line welding and repair welding operation of steel rails within a shorter window time.

The invention discloses a lithium ion battery negative electrode and a preparation method and application thereof. The lithium ion battery negative electrode with stable structure and performance is constructed through a simple method, and the problems of electrode structure degradation and solid-phase electrolyte interface instability are effectively improved. In the preparation of the negative electrode, a substrate adhesive and a coating polymer are used; the substrate adhesive firmly bonds a negative electrode active material through chemical interaction; on one hand, the coating polymer permeates into the electrode to wrap the active material particles for the second time; on the other hand, due to good elasticity, ion conductivity and other functions of the coating polymer, mechanical and chemical protection is provided for the electrode, the construction of an SEI film and the effective transmission of lithium ions between the electrode and an electrolyte can be effectively improved, and the electrochemical stability of the electrode is improved.

Method of manufacturing a non-volatile memory device on a semiconductor substrate in a memory area, said non-volatile memory device comprising a cell stack of a first semiconductor layer, a charge trapping layer and an electrically conductive layer, the charge trapping layer being the intermediate layer between the first semiconductor layer and the electrically conductive layer, the charge trapping layer comprising at least a first insulating layer; the method comprising: providing the substrate having the first semiconductor layer; depositing the charge trapping layer; depositing the electrically conductive layer; patterning the cell stack to form at least two non-volatile memory cells, and creating a shallow trench isolation in between said at least two non-volatile memory cells.

The invention discloses a network structure ionic conductive adhesive as well as a preparation method and an application thereof. The adhesive is synthesized through a 'one-pot method', the preparation process is simple, and the adhesive combines the excellent adhesion performance of polyacrylic acid to an active material and the good ionic conductivity of a polyoxyethylene polyoxypropylene ether block copolymer chain segment; and meanwhile, a three-dimensional cross-linked network structure is formed through condensation reaction. When the adhesive is applied to a lithium ion battery negative electrode, the problem of electrode structure degradation in the charging and discharging process can be effectively solved, and the electrochemical performance of the electrode is improved; by the three-dimensional network structure, the adhesive has excellent mechanical properties, and stress generated by an active material in the charging and discharging process can be effectively relieved; and the ionic conductivity provides a lithium ion migration channel for the electrode, so that the transportation of lithium ions is promoted, and the ionic conductivity has important significance for improving the rate capability of the electrode.

A manufacturing apparatus is provided for manufacturing a tubular resin film of high quality and little thickness variations, which is stretched and given an orientation, and suitable as retardation film or the like. It comprises a stretching section (6) for stretching the tubular resin film (20), and a maintaining section (7) for maintaining a shape of said tubular resin film (20) stretched. Further, said stretching section (6) is arranged to apply a stretching force to said tubular resin film for longitudinally and/or circumferentially stretching said tubular resin film (20).

The invention discloses a forming technology for a metal elastic sealing ring and belongs to the technical field of cold roll forming. The forming technology includes the following specific technology steps that a strip is cut to be in a corresponding width and a corresponding length according to the finished product size demand and welded to be in a ring shape; a strip ring is fixed, and spinning is conducted on the strip ring through a set of cold rolling rollers; the two sides of a circular arc are downwards extruded and deformed, a central bent circular arc (A) and a flat and straight connecting part (B) connected with the central bent circuit arc (A) are obtained, materials on the two sides of a section are bent upwards through a forming roller, and two elastic bent circular arcs (C) are formed; the obtained ring piece is arranged in a die roller, the two wings of the section are bent to form a left outwards-convex circular arc contact face (D) and a right outwards-convex circular arc contact face (D), and the ring piece is deformed after rotating by a circle; the left outwards-convex circular arc contact face (D) and the right outwards-convex circular arc contact face (D) are extruded from the two sides and are gathered in face-to-face mode and are deformed after rotating by a circle. The forming technology has the advantages that the surface quality of a product is good, the size deviation is small, and the variation of thicknesses of all parts of the section is small.

A method for cutting a SiC monocrystal with the size being six inches or larger through a diamond wire and diamond mortar at the same time includes the steps that the diamond wire dipped in the diamond mortar is adopted for cutting the SiC monocrystal. In the method, a cutting wire is electrically plated with diamond particles on the diamond wire, the diamond particles cannot be thrown out along with high-speed movement of the diamond wire and can make contact with the SiC crystal all the time, and the profile quality of a SiC cutting disk is guaranteed; and meanwhile, diamond abrasive particles in the diamond mortar are clamped and embedded at the positions of gaps between the diamond particles solidified on the surface of the diamond wire and are brought into the SiC crystal at high speed along with the diamond wire, the SiC crystal is cut by the diamond wire and the diamond mortar, and therefore the cutting efficiency is improved.

The invention discloses an NiAl-TiB2-TiC-Al2O3 porous membrane and a method for synthesizing the porous membrane with a plasma heating reaction. The method is that a composite material porous membrane is obtained through treating a plasma beam as a heat source, Ni powder, Al powder, Ti powder, B4C powder and B2O3 powder as raw materials, and argon as a plasma generation gas and a protective gas, and carrying out a reaction on the raw materials of powders under the effects of heating by a plasma beam flow and protecting by argon. The composite porous material integrates performance advantages of an Ni-Al intermetallic compound material and ceramic materials of TiB2, TiC, and Al2O3, and allows applications of the materials in aspects of catalysis, filtration, separation and the like to be enlarged.

Provided is an electrolytic copper foil having a surface roughness Rz of 2.0 μm or less, wherein a foil thickness difference in the width direction is 1.5% or less. Also provided is the electrolytic copper foil, wherein the foil thickness difference in the width direction is 1.3% or less. Further provided is the electrolytic copper foil, wherein a variation in the roughness in the width direction (Rzmax−Rzmin)/Rzavg is 15% or less. An object of the present invention is to provide an electrolytic copper foil having low surface roughness, wherein the formation of an “elongation wrinkle” and a discolored streak along the length direction is suppressed by allowing the thickness to be uniform in the width and length directions.

A porous, electrically conductive sheet, which (a) comprises a sheet formed with a number of carbon fibers having an organic substance adhered thereto, (b) has an electrical resistance in the direction of thickness of 50 m OMEGA cm<2> or less, (c) has a maximum diameter for causing fracture of 25 mm or less, and (d) has a compression ratio (the ratio of a thickness of a compressed sheet to that of an original sheet) of 40 % or less. The porous, electrically conductive sheet can be produced by a method comprising (a) a sheet-forming step of scooping a number of carbon fibers being dispersed in a liquid up onto a net to thereby form a carbon fiber sheet, (b) an organic substance adhesion step of rendering an organic substance to adhere to the formed carbon fiber sheet as a binder for carbon fibers, (c) a drying step of drying the sheet having the organic substance adhered thereto, and (d) a pressing step of pressing the dried sheet with a face pressure of 0.49 to 9.8 Mpa and/or of subjecting the sheet to a roll pressing with a clearance of 300 mu m or less.

A manufacturing method of a wafer level package structure includes the following steps. A chip is disposed on a supporting board, wherein the chip includes an active surface and a back surface opposite to the active surface, and a plurality of pads on the active surface, and the back surface of the chip is adhered to the supporting board through a die attach film (DAF). A molding is disposed on the supporting board to perform a wafer level exposed die molding procedure on the chip, wherein the molding surrounds the chip, and the pads of the chip are exposed out of the molding. A redistribution layer (RDL) is formed on the active surface of the chip, wherein the RDL is electrically connected to the pads. The supporting board and the DAF are removed from the chip.