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Resin composition used for forming dielectric layer of dielectric substrate for antenna and application of resin composition

A technology of resin composition and dielectric substrate, applied in the field of antenna materials, can solve the problems of increasing thickness change and affecting antenna performance, etc.

Active Publication Date: 2013-10-16
江苏生益特种材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, when the coefficient of thermal expansion (CTE) of the dielectric material is large, the change in thickness will also increase when the antenna is used in an extremely cold and extremely hot environment (-55°C ~ 150°C), which will affect the performance of the antenna

Method used

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  • Resin composition used for forming dielectric layer of dielectric substrate for antenna and application of resin composition
  • Resin composition used for forming dielectric layer of dielectric substrate for antenna and application of resin composition
  • Resin composition used for forming dielectric layer of dielectric substrate for antenna and application of resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Take a container, add naphthalene ring type epoxy resin (component (A)), o-cresol type novolac epoxy resin (component (B)), phenoxy resin ((C) resin melt viscosity regulator), linear Stir for a certain period of time with phenolic curing agent and an appropriate amount of solvent, then add an appropriate amount of accelerator, continue to stir evenly, and finally add (D) pre-fired spherical barium titanate ceramic powder, fully stir, and emulsify and disperse to form a gel liquid. Use glass cloth to impregnate the above glue solution, and control it to a suitable thickness, then dry to remove the solvent to obtain a prepreg. The prepregs obtained by using several sheets are superimposed on each other, and a copper foil is laminated on each of its two sides, and put into a hot press machine to solidify to form the copper clad laminate. The glue formula composition is shown in Table 1, and the property evaluation table is shown in Table 3.

Embodiment 2

[0073] Take a container, add naphthalene ring type epoxy resin (component (A)), phenol novolac epoxy resin (component (B)), styrene maleic anhydride copolymer (the molar ratio of styrene to maleic anhydride 8:1) ((C) resin melt viscosity regulator), and an appropriate amount of solvent to stir for a certain period of time, then add an appropriate amount of accelerator, continue to stir evenly, and finally add (D) spherical strontium barium titanate that has been pre-calcined Ceramic powder, fully stirred, emulsified and dispersed to form a glue. Use glass cloth to impregnate the above glue solution, and control it to a suitable thickness, then dry to remove the solvent to obtain a prepreg. The prepregs obtained by using several sheets are superimposed on each other, and a copper foil is laminated on each of its two sides, and put into a hot press machine to solidify to form the copper clad laminate. The glue formula composition is shown in Table 1, and the property evaluation...

Embodiment 3

[0075]Take a container, add biphenyl type epoxy resin (component (A)), trisphenol methane type epoxy resin (component (B)), active ester resin ((C) resin melt viscosity regulator), linear Stir the phenolic curing agent and an appropriate amount of solvent for a certain period of time, then add an appropriate amount of accelerator, continue to stir evenly, and finally add (D) spherical calcium-zirconium-barium titanate ceramic powder that has been pre-fired, fully stir, and emulsify and disperse. into glue. Use glass cloth to impregnate the above glue solution, and control it to a suitable thickness, then dry to remove the solvent to obtain a prepreg. The prepregs obtained by using several sheets are superimposed on each other, and a copper foil is laminated on each of its two sides, and put into a hot press machine to solidify to form the copper clad laminate. The glue formula composition is shown in Table 1, and the property evaluation table is shown in Table 3.

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Abstract

The invention relates to a resin composition used for forming a dielectric layer of a dielectric substrate for an antenna. The resin composition comprises (A), epoxy resin containing a naphthalene nucleus or diphenyl structure, (B), any one of or a mixture of at least two of tri(4-hydroxyphenyl) methane type epoxy resin, o-cresol type novolac epoxy resin and phenol type novolac epoxy resin, (C), a resin fusion viscosity modifier, and (D), spherical ceramic powder after presintering treatment. With the adoption of the resin composition, the obtained dielectric substrate has a high dielectric constant, high peeling strength, a low thermal expansion coefficient and very good thickness consistency, and can meet a performance requirement of the high dielectric constant antenna substrate.

Description

technical field [0001] The invention belongs to the technical field of antenna materials, and relates to a resin composition for forming a dielectric layer of a dielectric substrate for an antenna and its application, in particular to a method for manufacturing a high dielectric constant material applied to a printed antenna and its application Fabrication of antenna substrate materials. Background technique [0002] With the development of satellite navigation, positioning and communication systems, the use and coverage of antennas are getting wider and wider, and they play an important role in the signal receiving and transmitting devices of electronic products. Among them, microstrip antennas have been widely used in the fields of satellite terminals and portable navigation products (car navigators, smart phones, etc.) due to their simple structure, small size, low cost and excellent electrical performance. [0003] The microstrip antenna is an antenna formed by attachin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08K9/00C08K7/18C08K3/22C08K3/24B32B27/04B32B15/092
Inventor 颜善银刘潜发苏民社殷卫峰许永静
Owner 江苏生益特种材料有限公司
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