107results about How to "Thickness variation" patented technology

The liquid ejection head includes: a first SOI substrate which has a first active layer, a first dielectric layer and a first supporting layer; a second SOI substrate which has a second active layer, a second dielectric layer and a second supporting layer, the second active layer being bonded to the first supporting layer; and a nozzle which is formed between the first supporting layer and the second dielectric layer, the nozzle ejecting liquid in an ejection direction perpendicular to a thickness direction of the first SOI substrate and the second SOI substrate, a cross-sectional width of the nozzle perpendicular to the ejection direction being defined by a thickness of the second active layer.

A multiple-gate transistor has an active region with a side that forms an interior angle with the base of the active region of less than 80°. A process for fabricating a FinFET includes the steps of etching a silicon-on-insulator wafer to form an active region, including the source, channel, and drain, with vertically angled sidewalls.

A discharge amount measurement method is configured to measure a discharge amount of a liquid discharged from at least one nozzle of a droplet discharge head. The discharge amount measurement method includes discharging the liquid as a droplet from the at least one nozzle of the droplet discharge head by a number of discharges that is set to obtain a measurable quantity by driving the droplet discharge head based on measurement discharge data that is substantially identical to data used when a drawing pattern is formed by discharging the liquid from the at least one nozzle of the droplet discharge head, measuring the discharge amount of the liquid discharged from the at least one nozzle of the droplet discharge head, and calculating an average discharge amount based on the discharge amount and the number of discharges.

A pole layer incorporates: a first portion having an end face located in a medium facing surface; and a second portion having a thickness greater than that of the first portion. A surface of the first portion closer to a substrate is located farther from the substrate than a surface of the second portion closer to the substrate. A surface of the first portion farther from the substrate is located closer to the substrate than a surface of the second portion farther from the substrate. At least a portion of the pole layer is placed in an encasing groove formed in a region extending from a first encasing layer through a second encasing layer to a nonmagnetic metal layer.

A base fabric for a hollow-woven air bag, including: a bag portion (multiple fabric portion) formed by connecting a plurality of cloth pieces by hollow weaving; a fastened portion A connected to the bag portion (multiple fabric portion); and a fastened portion B of a weave structure different from that of the fastened portion A, which is formed in a boundary portion between the bag portion (multiple fabric portion) and the fastened portion A.

A susceptor for epitaxial layer forming apparatus provided in a layer forming chamber of an epitaxial layer forming apparatus includes: a recessed portion which is provided to accommodate a semiconductor wafer therein and has an approximately circular shape in plan view; and a protruding portion which is provided in the recessed portion in order to support the semiconductor wafer and has an approximately circular shape in plan view. The diameter of the protruding portion is smaller than that of the recessed portion, and the diameter of the protruding portion is set to be a size allowing reaction gas supplied for vapor-phase growth reaction to circulate through an entire boundary between the protruding portion and the semiconductor wafer when the semiconductor wafer is placed in the recessed portion.

A band spring including fiber composite material and extending in an undulating way, wherein a spring band can be provided to meander in the form of one single wave train composed of reversal regions and intermediate portions around a longitudinal center line L which can substantially correspond to the direction of force introduction K, and wherein, there can be provided an increased resistance moment of the spring band in the reversal regions of the wave train.

An organic EL device includes a first organic EL element and a second organic EL element on an underlying layer that includes a first drive circuit unit for driving the first organic EL element and a second drive circuit unit for driving the second organic EL element. The organic EL device includes a partition on the underlying layer defining a first region including a first light-emitting layer of the first organic EL element and a second region including a second light-emitting layer of the second organic EL element. The partition defines the first film-forming region such that the first film-forming region includes the first drive circuit unit and the second film-forming region such that the second film-forming region does not include at least part of the second drive circuit unit. The first light-emitting layer is formed by a different method from that used for the second light-emitting layer.

The invention makes uniform, in a plane, optical properties of optical members, such as the distribution properties of light transmission of a color filter, the color display properties of a liquid crystal device, and the light emission properties of an EL luminescent plane. During main scanning of color filter formation areas of a board in the X direction with an ink jet head having a nozzle row formed of a plurality of nozzles arranged in a row, a filter material is selectively discharged from the plurality of the nozzles to each of filer element areas arranged in a dot matrix to form filter elements, producing a color filter. First, the nozzle row is moved to positions “a” and “b” by main scanning in the X direction to enhance wettability of the surface of the areas and then main scanning is executed at each of the positions while successively moving the nozzle row to positions “c” through “k” by sub-scanning, thereby repeatedly discharging ink in the same portion of the areas.

A magnetic tape comprising a non-magnetic support, a magnetic layer containing magnetic powder which is formed on one side of the non-magnetic support, a primer layer containing non-magnetic powder which is formed between the non-magnetic support and the magnetic layer, and a backcoat layer containing non-magnetic powder which is formed on the other side of the non-magnetic support, wherein the magnetic layer contains the magnetic powder which comprises plate, granular or ellipsoidal magnetic particles with a particle diameter of 5 to 50 nm, and has a thickness of 0.09 μm or less, and wherein at least one of the primer layer and the backcoat layer contains non-magnetic plate particles with a particle diameter of 10 to 100 nm.

A multilayer array electronic component includes a multilayer composite including a helical coil and a capacitor that are defined by stacking a coil conductor, a capacitor conductor, and a ceramic sheet on one another. External electrodes are arranged on the surface of the multilayer composite and electrically connected to the helical coil or the capacitor. A direction identification mark is arranged on the upper surface of the multilayer composite and electrically connected to any of the external electrodes through the helical coil or the capacitor.

A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.

The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit board 10 according to the present invention includes a step of selectively forming a plating layer 16 for lands 22a and 22b on a metal foil 14 on the printed circuit board 10, a step of adjusting the thickness of the plating layer 16, and a step of forming the metal foil 14 into lines 14a. The aspect ratio of via holes 28 formed on lands 22a and 22b can be adjusted by adjusting the thickness of the lands 22a and 22b.

A method of protecting a charge trapping dielectric flash memory cell from UV-induced charging, including fabricating a charge trapping dielectric flash memory cell in a semiconductor device; depositing and planarizing an interlevel dielectric layer over the charge trapping dielectric flash memory cell and depositing over the planarized interlevel dielectric layer at least one UV-protective layer, the UV-protective layer including a substantially UV-opaque material.