2results about How to "High surface precision" patented technology

First, a wafer 1a having, on a front surface FS1 thereof, a pattern 1b having a shape in which concave portions and convex portions are alternately arranged is prepared. Next, a metal film 3 is formed on the front surface FS1 of the wafer 1a, and a transfer area 3a to which the shape of the pattern 1b is transferred is formed on a part of a front surface FS2 of the metal film 3. Next, the metal film 3 is removed from the wafer 1a. Next, a back surface BS2 of the metal film 3 is bonded to a glass substrate 5 via a bonding agent 4. In this way, a diffraction grating 7 is manufactured.

This invention discloses an optimized cutter head structure and tool assembly for an ultra-precision flying cutter, addressing the problems of low natural frequency and resonance-induced insufficient machining accuracy in existing cutter heads. The optimized cutter head structure includes a cutter head body, which is a centrally symmetric structure reconstructed from the irregular spoke structure of the original cutter head through topological optimization. The cutter head body achieves its natural frequency higher than the machining excitation frequency range through a combination of local weight reduction and structural stiffness enhancement. This invention effectively increases the natural frequency of the cutter head, reduces tool tip vibration displacement and warping, avoids the impact of resonance on machining, significantly improves the surface accuracy of ultra-precision flying cutter machining, and is compatible with existing machine tools for easy replacement.