Vapor chamber semi-shearing forming method

A technology of vapor chamber and cover plate, which is applied in the direction of semiconductor devices, indirect heat exchangers, lighting and heating equipment, etc. It can solve the problems of weak support and negative impact on the strength of the vapor chamber, so as to maintain integrity and avoid deformation effect
CN110779362AActive Publication Date: 2020-02-11DONGGUAN LINGJIE PRECISION MACHINING TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DONGGUAN LINGJIE PRECISION MACHINING TECH CO LTD
Publication Date
2020-02-11

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Abstract

The invention discloses a vapor chamber semi-shearing forming method. The vapor chamber semi-shearing forming method includes the following steps of providing a first cover plate and a second cover plate, forming a plurality of supporting columns in the middle of the first cover plate in a semi-shearing stamping mode, performing semi-shearing on the edge to form a welding flange edge, reserving anair outlet, buckling the second cover plate on the first cover plate and performing sealing along the welding flange edge after a heat adsorption core body is adsorbed into the first cover plate or the second cover plate to form a cavity, vacuumizing the cavity after injecting working fluid into the cavity through the air outlet to form negative pressure, and finally sealing the air outlet to prepare a vapor chamber. The vapor chamber cover plates are manufactured in the semi-shearing stamping mode, production cost is reduced, and the environmental protection is facilitated; by arranging positioning blocks, the positioning precision is ensured, and the percent of pass of the product is improved; and through a welding mode, the production cycle of the whole technological process is greatlyshortened, and efficient production is realized.
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Description

technical field

[0001] The invention relates to the technical field of vapor chamber manufacturing, in particular to a method for forming a vapor chamber by half-shearing. Background technique

[0002] With the rapid development of 5G wireless communications, radar, drones, satellites and other fields, the application prospects of high-power radio frequency chips are becoming more and more broad. The operating speed of the chip will be greatly improved, and the heat generated by it will also increase accordingly. Ensuring its stable operation has become the top priority. Therefore, the demand and challenges for the vapor chamber will also follow, and its industrial layout will be accelerated. There is no delay.

[0003] The upper and lower covers of the traditional vapor chamber are manufactured by wet etching. This method uses a large amount of oxidants and strong acids, and the waste water generated causes great pollution to the environment. At the same time, this process...

Claims

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