The present application relates to a kind of
chip glue removal device and glue removal method, its device includes
sander, bottom plate, rotating platform and be used for clamping
chip clamping linkage mechanism,
sander is installed at the one end of the upper surface of bottom plate, rotating platform is slidably arranged at the other end of the upper surface of bottom plate, clamping linkage mechanism is arranged on rotating platform, and can rotate with rotating platform, and clamping linkage mechanism can slide with rotating platform on bottom plate, to approach or away from
sander, sander can be polished to the glue of the edge of
chip clamped on clamping linkage mechanism remains.By clamping linkage mechanism, chip can be clamped, and the
polishing range of chip to sander is adjusted by the sliding of rotating platform to polish, the orientation of chip is adjusted by the rotation of rotating platform, so that the glue on the surface of chip can be removed conveniently by once clamping, simple structure, easy and safe to operate, greatly improve glue removal efficiency, avoid chip damage.