84results about How to "Unnecessary removal" patented technology

A NAND flash memory device includes a plurality of continuous conductors disposed on a common level of a multilayer substrate, the plurality of continuous conductors including respective conductive lines extending in parallel along a first direction, respective contact pads disposed at ends of the respective conductive lines and respective conductive dummy lines extending in parallel from the contact pads along a second direction.

A portal is provided with a detector for detecting trace amounts of substances of interest that may be retained on the surface or interior of a vehicular subject. The portal relies upon the continuous process by which microscopic flakes of dust, dirt, pollen, and other surface and interior contaminants as well as adsorbed analyte media and analyte vapors continuously separate from the surface of vehicular subjects and escape from the interior of vehicular subjects. The portal further leverages the existence of a vehicular thermal plume consisting of a layer of warm air adjacent to the vehicular subject. The warm air rises in the cooler surrounding air and transports the microscopic flakes of surface contaminants, desorbed analyte, and analyte vapors upwardly. The portal capitalizes on this phenomenon by providing at least a partial enclosure with a funnel-shaped collector above the vehicular subject. A low speed flow of relatively dense cool air may be introduced into the portal to buoyantly lift the warmer air of the vehicular thermal plume upwardly. The air stream defined by the vehicular thermal plume and the contaminant particles, analyte media, and analyte vapors therein moves to a trap in the funnel-shaped collector above the portal. The trap cooperates with a detector for detecting the presence of molecules of interest.

A method of forming fine patterns of a semiconductor device, in which a plurality of conductive lines formed in a cell array region are integrally formed with contact pads for connecting the conductive lines to a peripheral circuit. In this method, a plurality of mold mask patterns, each including a first portion extending in a first direction and a second portion which is integrally formed with the first portion and extends in a second direction, are formed within a cell block on a substrate comprising a film which is to be etched. A first mask layer covering sidewalls and an upper surface of each of the plurality of mold mask patterns is formed on the substrate. First mask patterns are formed by partially removing the first mask layer so that a first area of the first mask layer remains and a second area of the first mask layer is removed. The first area of the first mask layer covers sidewalls of adjacent mold mask patterns from among the plurality of mold mask patterns by being located between the adjacent mold mask patterns, and the second area of the first mask layer covers portions of the sidewalls of the plurality of mold mask patterns, the portions corresponding to an outermost sidewall of a mold mask pattern block.

A shift knob structure includes a shift knob body and a cover member. Movement of the shift knob body in a direction of shaft axis is restricted by a securing member supported by a support part of the shift knob body being locked by a locking groove in the shift shaft. When the cover member is rotated relative to the shaft knob body, the securing member is deformed radially outward and the securing member is unlocked from the locking groove in the shift shaft so that the shift knob body can be removed from the shift shaft.

When a sintered body of ceramic is shot-blasted at normal temperatures to plastically deform the crystal structure of the shot-blasted surface to apply residual stress and is heat-treated to recrystallize fine cracks, dislocated cells in the grain boundary are formed, crystals are finely divided, and the fracture toughness is significantly improved. When the sintered body of ceramic is a thin product, an effective toughening can be attained by shot blasting both the front and back sides. After heat treatment, mechanical strength is significantly improved by removing a part of the modified surface layer by an abrasion treatment.