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High heat-resistant low-fluidity adhesive for rigid-flexible printed circuit board, adhesive film and preparation method of high heat-resistant low-fluidity adhesive

The invention provides a high heat-resistant low-fluidity adhesive for a rigid-flexible printed circuit board, an adhesive film and a preparation method of the high heat-resistant low-fluidity adhesive. The high heat-resistant low-fluidity adhesive comprises the following components in parts by weight: 100 parts of a polyacrylate emulsion A, 50-150 parts of a polyacrylate emulsion B, 0.5-5 parts of a fluorene curing catalyst, 0.2-5 parts of a thickener and 30-60 parts of packing; the polyacrylate emulsion A is a multicomponent copolymerized polyacrylate emulsion which is prepared from an acrylate copolymerization monomer, a carboxyl active monomer, deionized water and an initiator by copolymerization; the polyacrylate emulsion B is a multicomponent copolymerized polyacrylate emulsion which is prepared from an acrylate copolymerization monomer, a glycidyl active monomer, deionized water and a initiator by copolymerization; and the adhesive forms the adhesive film. The adhesive film has good flexibility and excellent heat resistance, and simultaneously has relatively low fluidity, relatively high peel strength, and good electrical property and chemical resistance.
Owner:华烁电子材料(武汉)有限公司
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