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Epoxy resin composition, glue film made of same and preparation method

A technology of epoxy resin and production method, which is applied in the field of epoxy resin composition, can solve the problem of poor thermal conductivity, moisture absorption resistance, punching resistance, low thermal resistance stability of metal-based copper-clad laminates, and difficult Ensure the thickness of the thermally conductive adhesive layer, etc., to achieve the effect of smooth appearance, material saving and convenient operation

Active Publication Date: 2009-09-23
广东全宝科技股份有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The thermally conductive insulating layer is the core technology of metal-based copper-clad laminates. At present, it is generally a bonding sheet made of ordinary glass cloth dipped in glue. It has good performance in terms of thermal conductivity, moisture absorption resistance, and punching resistance. Poor; Another method is to apply thermal conductive adhesive on the aluminum plate, but this method is difficult to ensure that the thermal conductive adhesive layer has a uniform thickness, and the thermal resistance stability of the metal-based copper-clad laminate produced is not high

Method used

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  • Epoxy resin composition, glue film made of same and preparation method

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Embodiment 1

[0037] 100 parts by weight of brominated epoxy resin (450g / eq of epoxy equivalent, 20% of bromine content, 80% of solid content), 60 parts by weight of modified epoxy resin of carboxy-terminated nitrile rubber (product model RF928, produced by U.S. CVC Company) , dicyandiamide (2.4 parts by weight produced by Ningxia Darong Chemical Industry Co., Ltd., 0.06 parts by weight of dimethylimidazole (produced by Shikoku Chemical Industry in Japan), 200 parts by weight of aluminum oxide (produced by Wanjing, Hangzhou), with methyl ethyl ketone as the solvent regulation system solid content is 75%.

Embodiment 2

[0039] 100 parts by weight of brominated epoxy resin (450g / eq of epoxy equivalent, 20% of bromine content, 80% of solid content), 60 parts by weight of modified epoxy resin of carboxy-terminated nitrile rubber (product model RF928, produced by U.S. CVC Company) , 30 parts by weight of phenolic resin, 200 parts by weight of aluminum oxide (produced by Hangzhou Wanjing), and using butanone as a solvent to adjust the solid content of the system to be 75%.

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PUM

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Abstract

The invention discloses an epoxy resin composition, a continuous glue film made of the same and a preparation method. The epoxy resin composition comprises solid ingredients and organic solvents, wherein the solid ingredients comprise epoxy resin (A), thermoplastic resin or / and synthetic nitrile rubber (B), solidified agents (C), curing accelerators (D) and inorganic heat-conducting fillers (E). In addition, the invention also relates to the continuous glue film made of the epoxy resin composition and the preparation method. Because the continuous glue film is made by automated equipment, thecontinuous glue film has good consistency on thickness and performance, so that the breakdown voltage of a metal based copper-clad laminate and the stability of thermal resistance are ensured. The product made by the invention has good heat-conducting performance and electric insulation performance.

Description

technical field [0001] The invention relates to an epoxy resin composition, a continuous adhesive film made by using it and a manufacturing method. Background technique [0002] With the development of electronic products to be light, thin, small, high density and multifunctional, the assembly density and integration of components on printed boards are getting higher and higher, the power consumption is getting bigger and bigger, and the heat dissipation requirements of the substrate are getting higher and higher. Urgently, if the heat dissipation of the substrate is not good, it will cause overheating of the components on the printed circuit board, thereby reducing the reliability of the whole machine. Under this background, a high heat dissipation metal-based copper clad laminate was born. [0003] The most widely used metal-based copper-clad laminates are aluminum-based copper-clad laminates. This product was invented by Japan's Sanyo National Policy in 1969 and was appli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L9/02C08L67/00C08L33/00C08L13/00C08L71/12C08K13/02C08K3/22C08K3/38C08J5/18
Inventor 罗君林晨
Owner 广东全宝科技股份有限公司
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