The invention discloses a photosensitive resin composition. The photosensitive resin composition comprises a thermosensitive compound (b), a coloring agent (d) and a thermal cross-linking agent (e). Wherein the heat-sensitive compound (b) includes a compound containing at least two phenolic hydroxyl groups, the colorant (d) has a maximum absorption
wavelength in any range of 490-800 nm, the
absorbance at the maximum absorption
wavelength is Absmax, the ratio of the
absorbance Abs365 at 365 nm to Absmax is 0.1% or more and less than 40%, and the thermal crosslinking agent (e) includes 1, 3-bis (methoxymethyl)
urea, 1, 3-bis (methoxymethyl)-4, 4, 6-trimethyl-1, 3-bis (methoxymethyl)-1, 3-bis (methoxymethyl)-1, 3-bis (methoxymethyl)-1, 3-bis (methoxymethyl)-1, 3-bis (methoxymethyl)-1, 3-bis (methoxymethyl)-1, 3-bis (methoxymethyl)-1, 3-bis (methoxymethyl)-1, 3- The composition is one or a combination of more of 4, 5-diethoxy-1, 3-bis (
hydroxymethyl)-2-
imidazolidinone, 4, 5-dimethoxy-2-
imidazolidinone, 4, 5-diethoxy-1, 3-bis (
hydroxymethyl)-2-
imidazolidinone and tetramethoxymethyl
glycoluril. According to the photosensitive resin composition, the light
transmittance within the
wavelength range of 350-450 nm is not obviously reduced before
exposure, so that the
exposure sensitivity is prevented from being reduced. Meanwhile, after high-temperature curing, the cured film has excellent shading performance within the
wavelength range of 350-780 nm through the change of the structure of the thermosensitive compound and the combination of the thermosensitive compound and two or more dyes or pigments, namely, the cured film has the
optical density larger than or equal to 1.0.