The present invention relates to a photosensitive resin composition, a solder
resist ink, a dry film and a cured product, the photosensitive resin composition contains an
epoxy acrylic resin having a specific structure, and the
epoxy acrylic resin having the specific structure is formed by adding an alpha, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, beta, and then adding
dibasic acid anhydride to the beta-unsaturated
monobasic acid a1 and the
monobasic acid a2 with a specific structure. According to the invention, a certain proportion of
monobasic acid a2 with a special structure is introduced into
epoxy acrylate, so that the dispersibility of the photosensitive resin composition to pigments and fillers can be effectively improved; and the water absorption of the cured product is reduced, so that the lead-free
tin spraying resistance and the
wave soldering resistance are improved.