The invention discloses a method for rapidly cleaning and transferring a
wafer-level two-dimensional material without damage. According to the method, a
covalent bond is formed and a stable and regular self-assembled monomolecular layer is constructed by utilizing a
strong binding force between a modifier molecule and a growth substrate, and the monomolecular layer effectively reduces the
surface energy of the growth substrate, so that the interaction force between the growth substrate and a two-dimensional material is remarkably weakened, and the performance of the two-dimensional material is improved. The material is more easily stripped from the growth substrate; secondly, according to the method, low-
viscosity PDMS is selected as a transfer medium, the medium can provide proper
adhesive force, and it is ensured that the two-dimensional material cannot fall off due to insufficient
adhesive force in the transfer process and cannot be damaged or residues due to too high
adhesive force; and after the transfer is completed, the low-
viscosity PDMS is more easily stripped from the target substrate, so that residues, bubbles and defects are reduced, and the original electrical and optical characteristics of the two-dimensional material can be effectively maintained.