The invention discloses a high-performance
silicon carbide trench gate VDMOSFET (vertical double-diffused
metal oxide semiconductor field effect transistor) device structure and a working principle thereof, and belongs to the technical field of power semiconductors. According to the device, multiple structural innovations are provided aiming at the core problem that the
on resistance and the
voltage resistance of a traditional VDMOSFET are difficult to consider in a middle-
high voltage application scene. The method is mainly characterized in that 1, P-type and N-type alternately arranged epitaxial
layers are adopted to replace a traditional single N-type drift region, the mutual depletion effect of P / N junctions is utilized to optimize
electric field distribution and improve
breakdown voltage, meanwhile, the N-type epitaxial
layers are allowed to adopt higher
doping concentration, and on-resistance is remarkably reduced; 2, a
trench gate structure penetrating through the depth of the whole device is adopted, a gate medium filled in a trench is
silicon carbide, and a PNP type
doping layer from top to bottom is formed; during conduction, the gate potential effectively extends to the bottom of the groove through a
minority carrier injection effect, and an
electron accumulation layer and a body channel are formed through induction to form a low-resistance path together; the structure fully utilizes the material advantages of wide forbidden band, high critical breakdown
electric field,
high electron saturation speed and the like of
silicon carbide, is particularly suitable for high-frequency, high-temperature and high-
power density application, and can also be adapted to other
semiconductor materials such as silicon,
gallium arsenide,
gallium nitride and the like.