AlGaN/GaN heterojunction field effect transistor with partial P type GaN cap layer

A heterojunction field effect, transistor technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as threshold voltage and output current reduction, device avalanche breakdown, and reliability reduction, and achieve higher breakdown voltage. , the effect of increased peak electric field drop and improved device reliability

Inactive Publication Date: 2017-05-31
XIDIAN UNIV
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Problems solved by technology

[0004] In order to solve a series of problems such as avalanche breakdown, current collapse effect, threshold voltage and output current reduction, and reliability reduction caused by the peak electric field at the gate edge of the AlGaN / GaN heterojunction field effect transistor in the prior art , the present invention provides a novel AlGaN / GaN heterojunction field effect transistor

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  • AlGaN/GaN heterojunction field effect transistor with partial P type GaN cap layer
  • AlGaN/GaN heterojunction field effect transistor with partial P type GaN cap layer

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Embodiment Construction

[0027] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0028] The invention aims at the problem that the gate edge of the existing AlGaN / GaN heterojunction field effect transistor has a peak electric field, and provides a novel AlGaN / GaN heterojunction field effect transistor with a partial P-type GaN cap layer.

[0029] Its structure is as figure 1 As shown, it mainly includes: semi-insulating substrate 0; heteroepitaxially grown AlN nucleation layer 1 on the semi-insulating substrate; GaN buffer layer 2 epitaxially grown on the AlN nucleation layer; epitaxially grown on the GaN buffer layer The AlGaN barrier layer 3; the gate 4, the drain 5 and the source 6 located on the AlGaN barrier layer; the P-type GaN cap layer 7 located on the AlGaN barrier layer and adjacent to the edge of the g...

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Abstract

The invention discloses an AlGaN/GaN heterojunction field effect transistor with a partial P type GaN cap layer. According to the transistor structure, the P type GaN cap layer is introduced into the grid edge of the transistor and will reduce the two-dimensional electron gas concentration of a conducting channel of the region to achieve the electric field modulation effect. By generating a new electric field peak, high electric field of the grid edge is reduced, and the electric field on the surface of the transistor is more uniform. Compared with a traditional structure, the breakdown voltage and reliability of the field effect transistor are obviously improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to an AlGaN / GaN heterojunction field effect transistor. Background technique [0002] Due to the limitations of the first-generation and second-generation semiconductor materials represented by Si and GaAs, the third-generation wide-bandgap semiconductor materials have been developed rapidly because of their excellent performance. As one of the cores of the third-generation semiconductor materials, GaN material is special in its polarization effect compared with Si, GaAs and SiC. Taking advantage of this particularity, people have developed AlGaN / GaN high electron mobility transistors, and AlGaN / GaN HEMTs are GaN-based microelectronic devices based on AlGaN / GaN heterojunction materials. The AlGaN / GaN heterojunction forms a high-density two-dimensional electron gas (2DEG) at the heterojunction interface through spontaneous polarization and piezoelectric polarization ef...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/06H01L29/778
CPCH01L29/063H01L29/7787
Inventor 段宝兴郭海君谢慎隆袁嵩杨银堂
Owner XIDIAN UNIV
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