The invention belongs to the technical field of a
semiconductor and specifically relates to an HEMT device with a junction type
semiconductor layer. The device is mainly constructed in such a way that the junction type
semiconductor layer is grown on the upper surface of a
barrier layer between a grid and a drain and the junction type semiconductor layer and the
barrier layer form two-dimensional cavity gas (2DHG). On one hand, grid
metal and the junction type semiconductor layer form a rectification structure so that leakage currents of grid-2DHG-2DEG caused when the grid is positively pressurized are avoided, and at the same time, a separating layer is employed between a drain
electrode and the junction type semiconductor layer for blocking the 2DHG; and on the other hand, the 2DHG between the grid and the drain and the 2DEG form polarized super junctions, in case of a blocking state, a drift region is exhausted under assistance, the
electric field concentration effect of the end, nearby the drain, of the grid of the device is effectively improved, at the same time, a new
electric field peak is introduced to the contact portion between a P-type
doping area and an N-type
doping area,
electric field distribution on the surface of the device is enabled to be more uniform, and
breakdown voltage of the device at a switching-off state is improved. The HEMT device with the junction type semiconductor layer is especially suitable for an HEMT device.