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441results about How to "Uniform electric field distribution" patented technology

Measuring device and measuring method for trap parameter of solid dielectric material

The invention discloses a measuring device and method for a trap parameter of solid dielectric. The solid dielectric material is charged by using a three-electrode corona discharge system; a material sample to be tested is placed below a single-needle electrode and a metal mesh electrode; the sample is adhered to a metal disc electrode through conductive silicone grease and is charged by the three-electrode system; after charging is ended, an external voltage is removed, and short circuit discharge is performed to remove surface free loads; surface potential of the measured sample is attenuated; and the trap energy level and the trap density parameter of the material can be calculated through a signal conditioning circuit and a data acquisition system. The measuring device comprises a constant temperature box, the three-electrode coronate charging system, a surface potential measuring system, a sample preheating system, a rotary electrode and a temperature and humidity control system. The invention provides an effective analysis means for research in representation of an aging condition of a polymer insulating material and an aging rule of polymer by the trap parameter and research in aspects such as a solid dielectric surface electrification phenomenon and surface flashover performance influence.
Owner:XI AN JIAOTONG UNIV

Flow type electroporation device and system

The invention discloses a flow type electroporation device and a system, and the system comprises the flow type electroporation device, a channel, an injection pump and a voltage source, wherein the flow type electroporation device comprises a substrate and electrodes which are made on the substrate and are arranged in parallel and in pairs, and each pair of the electrodes comprise an anode and acathode which are oppositely arranged; the channel is arranged above the electrodes and limits fluid to flow; an initial end of the channel is provided with a plurality of inlet branch channels whichconverge into a main channel, a terminating end is provided with a plurality of outlet branch channels, and a plurality of head covers for fluid inlets and outlets are arranged above the channel; theinjection pump is connected to inlets and outlets of the head covers in the flow type electroporation device and limits the flow speed of the fluid; and the voltage source is connected with the electrodes through electrical connectors and sets and produces pulse voltage. The flow type electroporation system utilizes the fluid channel and the connected injection pump to realize continuous flow of various suspensions in the fluid channel, thereby enabling the process that cells are subjected to electroporation to be continuous and realizing rapid treatment of a large number of samples.
Owner:PEKING UNIV

HEMT device with junction type semiconductor layer

ActiveCN105097911AImprove the electric field concentration effectImprove off-state breakdown voltageSemiconductor devicesP type dopingSemiconductor
The invention belongs to the technical field of a semiconductor and specifically relates to an HEMT device with a junction type semiconductor layer. The device is mainly constructed in such a way that the junction type semiconductor layer is grown on the upper surface of a barrier layer between a grid and a drain and the junction type semiconductor layer and the barrier layer form two-dimensional cavity gas (2DHG). On one hand, grid metal and the junction type semiconductor layer form a rectification structure so that leakage currents of grid-2DHG-2DEG caused when the grid is positively pressurized are avoided, and at the same time, a separating layer is employed between a drain electrode and the junction type semiconductor layer for blocking the 2DHG; and on the other hand, the 2DHG between the grid and the drain and the 2DEG form polarized super junctions, in case of a blocking state, a drift region is exhausted under assistance, the electric field concentration effect of the end, nearby the drain, of the grid of the device is effectively improved, at the same time, a new electric field peak is introduced to the contact portion between a P-type doping area and an N-type doping area, electric field distribution on the surface of the device is enabled to be more uniform, and breakdown voltage of the device at a switching-off state is improved. The HEMT device with the junction type semiconductor layer is especially suitable for an HEMT device.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Narrow slit and large slit combination type microwave plasma reaction cavity

The present invention relates to a narrow gap-big gap combined microwave plasma reaction cavity, belonging to microwave plasma excitation technique field. The reaction comprises a vacuum column shape reaction cavity which is arranged vertically, and the upper part and the lower part of the reaction cavity are both sealed by a demountable flange. An annular wave guide with a rectangular-shaped cross section is winded in the middle part of the reaction cavity. The inner wall of the annular wave guide is coincided with the outer wall of the cavity. The inner wall of the annular wave guide is opened with a narrow gap which is corresponding to the wave node quantity of the standing wave inside the annular wave guide. The narrow gap is positioned at the standing wave node. The outer wall of the annular wave guide is opened with a through hole which is used for connecting with the drop-leaf mode wave guide switch or with the coupled antenna. The present invention is characterized in that the inner wall of the annular wave guide is opened with a big gap which is used for forming a symmetric high field inside the reaction cavity, and the high filed is strongest in the middle and then decreased periphery outward gradually; and the high filed is complemented with the electric field formed by the narrow gap to make the electric field is evenly distributed inside the reaction cavity. The present invention has the advantages of effectively improving the distribution of the electric field, producing more even plasma which can also exist inside the middle of the cavity.
Owner:TSINGHUA UNIV

Auxiliary anode mask micro electrolytic machining array micro-pit system and method

The invention provides an auxiliary anode mask micro electrolytic machining array micro-pit system and method, and belongs to the technical field of micro electrolytic machining. The system comprises an upper clamp (1), a lower clamp (7), a tool cathode (2) which is arranged on the upper clamp (1), a tool anode (6) which is arranged on the lower clamp (7), mask plates (5) which are arranged on the surface of the tool anode (6) and of group drilling structures, and auxiliary anodes (4) which are fixed on the lower clamp (7) and surround edges of the tool anode (6); an electrolyte flow pass is formed between the tool cathode (2) and the tool anode (6), and the system further comprises a main power supply (9) and an auxiliary power supply (8), wherein the positive pole of the main power supply (9) and the positive pole of the auxiliary power supple (8) are connected with the tool anode (6) and the auxiliary anode (4) respectively, and the negative pole of the main power supply (9) and the negative pole of the auxiliary power supple (8) are both connected with the tool cathode (2). The auxiliary anode mask micro electrolytic machining array micro-pit system and a method are characterized in that an auxiliary power supply voltage is smaller than a main power supply voltage, and a potential difference exists between the auxiliary power supply voltage and the main power supply voltage, so that the electric current density in all mask holes of the work piece surface is consistent, and the dimensional homogeneity of array micro-pits is improved.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

A vivaldi antenna and a dual-polarized probe

The invention provides a vivaldi antenna and a dual-polarized probe, which solves the problems of poor high-frequency cross-polarized levels and low port coupling isolation of existing probe antennas.The technical points are that the vivaldi antenna comprises three metal layers and dielectric plates arranged between each two adjacent metal layer; the intermediate metal layer is provided with a feeding structure, and the other two metal layers are provided with vivaldi antenna radiation structures electrically connected to the feeding structure; and the two vivaldi antenna radiation structuresare symmetric along the center line of the antenna to realize the double-grooved vitaldi structure, which effectively improves low-end standing waves, so that the antenna has a good high-frequency cross-polarization level and has a relatively high isolation degree. Meanwhile, by arranging a clamping groove in the center line position of each antenna, the orthogonal connection of two vivodi antennas can be realized by using the clamping grooves to form a dual-polarized probe, and the vivaldi structures are respectively arranged on the two sides of each clamping groove to avoid destroying the circular back cavities of the vitaldi structures. The phase centers of the two antennas of the probe can be aligned without destroying the circular slit back cavities of the vitaldi structures.
Owner:GUANGDONG MIKWAVE COMM TECH

High voltage pulse electric field sterilization common-field treatment chamber with adjustable electrode distance

The invention discloses a high voltage pulse electric field sterilization common-field treatment chamber with adjustable electrode distance. The treatment chamber consists of two metallic hollow tubular electrodes and an insulator isolation tube, wherein the insulator isolation tube is positioned in a treatment cavity formed between the two metallic hollow tubular electrodes. The metallic hollow tubular grounding electrodes are in threaded fit with the insulator isolation tube, so that the adjustability of the electrode distance in the common-field treatment chamber is realized. The inner ports of the metallic hollow tubular electrodes in the treatment chamber are rounded, so that the strength of a peak electric field nearby the electrodes is reduced, the 'discharge' problem caused by over high local electric field in the treatment chamber is solved, and the electric field in the flowing direction of a material is distributed relatively uniformly. The treatment chamber is simple in structure, low in cost, convenient to process and convenient to disassemble and assemble; the adjustability of the electrode distance in the common-field treatment chamber is realized; and the electrode distance in the treatment chamber can be adjusted according to different application requirements, so that the electric field strength and the electric field distribution in the treatment chamber are improved.
Owner:JIANGNAN UNIV

Configuration structure for homo-tower dual-loop compact transmission line insulator equalizing ring

InactiveCN101442197AReasonable configuration structureProtective seal structureSuspension arrangements for electric cablesSuspension/strain insulatorsCorona dischargeEngineering
The invention discloses an insulator grading-ring allocation structure for same-tower double-circuit compact-type transmission lines. The allocation structure comprises insulator strings symmetrically arranged on two sides of a T-shaped tower. The insulator strings are connected into three V-shaped structures through a plurality of bundle conductor hardware tools, and the three V-shaped structures are divided into an upper phase and a lower phase which are hung in a T-shaped tower window, wherein the upper phase is a W-shaped structure formed by two V-shaped dually-connected strings and is hung on a tower crossarm; the lower phase is a V-shaped dually-connected string of which one side is hung on a tower body, and the other side is hung on the tower crossarm and is connected into a structure with a shape of a down arrow through an intermediate insulator string hung on the middle part of the tower crossarm; and one side of the insulator string in the V-shaped structure and one side of the intermediate insulator string, which are close to a power transmission conductor, are both provided with annular grading rings, are connected to the bundle conductor hardware tools by use of a bracket, and are equipotential with the power transmission conductor. The grading-ring allocation can realize the homogenization of voltage distribution and electric field distribution of the insulator strings, prevents the corona discharge and electrical erosion loss on the high-voltage sides of the insulator strings, and improves the operation reliability of same-tower double-circuit compact-type lines.
Owner:NORTHWEST CHINA GRID +1

Avalanche photodetector and preparation method thereof

The embodiment of the invention discloses a lateral structure avalanche photodetector and a preparation method thereof. The lateral structure avalanche photodetector comprises a substrate, a first epitaxial growth layer and a second epitaxial growth layer, wherein the substrate comprises a first semiconductor material region; an avalanche region is formed in the first semiconductor material region; the first epitaxial growth layer is formed as an absorption region; the upper surface of the first epitaxial growth layer is a light absorption surface and protrudes out of the upper surface of thefirst semiconductor material region; the lower surface of the first epitaxial growth layer is lower than the upper surface of the first semiconductor material region; the second epitaxial growth layerat least comprises a first part and a second part which are located on the two sides of the first epitaxial growth layer in the first direction, the first part and the second part cover two side walls, which protrude out of the first semiconductor material region, of the first epitaxial growth layer respectively, and the first part and the second part form at least one part of a first charge region and a second charge region respectively; and the first charge region, the absorption region, the second charge region, and the avalanche region at least partially overlap in the first direction.
Owner:WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD

Method for repairing composite insulator testing sampling part

The invention discloses a method for repairing a composite insulator testing sampling part. The method includes: cleaning the composite insulator testing sampling part, evenly coating RTV coatings on the composite insulator testing sampling part, and curing the RTV coatings coated on the composite insulator testing sampling part at normal temperature. The method has the advantages that the RTV coatings are used to repair the surface of the composite insulator testing sampling part, and a new surface with excellent performance can be formed on a composite insulator; the dielectric constants of the RTV coatings and the materials of the composite insulator are identical, the two are even in electric field distribution, and local electric field intensity concentration can be avoided; by the RTV coatings, the repaired composite insulator is excellent in hydrophobicity and hydrophobicity mobility, and safe and stable operation of the composite insulator is guaranteed; the repairing of the composite insulator can be performed without shutting down power supply, the problem that traditional composite insulator replacement needs to shut down power supply is solved, power failure caused by line maintenance can be avoided, and operation reliability of a power grid is increased.
Owner:STATE GRID CORP OF CHINA +1
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