The invention belongs to the technical field of a 
semiconductor and specifically relates to an HEMT device with a junction type 
semiconductor layer. The device is mainly constructed in such a way that the junction type 
semiconductor layer is grown on the upper surface of a 
barrier layer between a grid and a drain and the junction type semiconductor layer and the 
barrier layer form two-dimensional cavity gas (2DHG). On one hand, grid 
metal and the junction type semiconductor layer form a rectification structure so that leakage currents of grid-2DHG-2DEG caused when the grid is positively pressurized are avoided, and at the same time, a separating layer is employed between a drain 
electrode and the junction type semiconductor layer for blocking the 2DHG; and on the other hand, the 2DHG between the grid and the drain and the 2DEG form polarized super junctions, in case of a blocking state, a drift region is exhausted under assistance, the 
electric field concentration effect of the end, nearby the drain, of the grid of the device is effectively improved, at the same time, a new 
electric field peak is introduced to the contact portion between a P-type 
doping area and an N-type 
doping area, 
electric field distribution on the surface of the device is enabled to be more uniform, and 
breakdown voltage of the device at a switching-off state is improved. The HEMT device with the junction type semiconductor layer is especially suitable for an HEMT device.