The invention relates to the technical field of kits, in particular to a MoS2 back gate
field effect transistor based on a wet transfer process and a preparation method of the MoS2 back gate
field effect transistor. The MoS2 back gate
field effect transistor is formed by sequentially arranging a
silicon-based substrate, a SiO2 insulating layer, a MoS2
conducting channel layer and an Ag source drain
electrode from bottom to top; a high-quality single-layer MoS2 thin film is prepared through a
chemical vapor deposition (CVD) method, PMMA is adopted as a supporting layer, clean Van der Waals contact of the MoS2 thin film and a SiO2 /
Si substrate is achieved through a wet transfer process of NaOH solution
etching, deionized water cleaning and
acetone stripping of the supporting layer, and finally a source
electrode and a drain
electrode are prepared by combining photoetching and thermal
evaporation processes. According to the method, the problems of
pollutant residues and traps of an interface between MoS2 and the substrate in the traditional process are effectively solved, the carrier mobility,
transconductance and on-state current of the device are remarkably improved, the sub-threshold swing is reduced, and the method is suitable for manufacturing a two-dimensional material
integrated circuit device with low
power consumption and high performance.