62results about How to "Reduce gate charge" patented technology

A vertical trench double-diffused metal-oxide-semiconductor (DMOS) field effect transistor characterized by a reduced drain-to-source resistance and a lower gate charge and providing a high transconductance and an enhanced frequency response.

A trench MOSFET device comprising: (a) a silicon substrate of a first conductivity type (preferably N-type conductivity); (b) a silicon epitaxial layer of the first conductivity type over the substrate, the epitaxial layer having a lower majority carrier concentration than the substrate; (c) a body region of a second conductivity type (preferably P-type conductivity) within an upper portion of the epitaxial layer; (d) a trench having trench sidewalls and a trench bottom, which extends into the epitaxial layer from an upper surface of the epitaxial layer and through the body region of the device; (f) an oxide region lining the trench, which comprises a lower segment covering at least the trench bottom and upper segments covering at least upper regions of the trench sidewalls; (g) a conductive region within the trench adjacent the oxide region; and (h) a source region of the first conductivity type within an upper portion of the body region and adjacent the trench. The lower segment of the oxide region is thicker than the upper segments of the oxide region in this embodiment.

A power semiconductor power device having composite trench bottom oxide and multiple trench floating gates is disclosed. The gate charge is reduced by forming a pad oxide surrounding a HDP oxide on trench bottom. The multiple trenched floating gates are applied in termination for saving body mask.

A process for manufacturing a semiconductor device of the trench variety with reduced feature sizes and improved characteristics which process includes forming a termination structure having a field oxide disposed in a recess below the surface of the semiconductor die in which the active elements of the device are formed, and forming source regions after the major thermal steps have been performed.

The invention discloses a silicon carbide VDMOS device and manufacturing method thereof, and belongs to the technical field of power semiconductors. A trench is etched on a JFET region surface of a traditional silicon carbide VDMOS device, P type doping is introduced into the bottom of the trench, and at the same time, a polycrystalline silicon layer is formed in the trench, so that the polycrystalline silicon layer and a side wall of the trench are in contact to form a Si/SiC heterojunction. A diode is integrated in the device, and the device has the advantages of low conduction voltage drop, fast switching speed and good reverse recovery characteristic in a diode working mode, and has the advantages of high breakdown voltage, small grid capacitance and fast switching speed in an MOS working mode. The proposed device structure optimizes application of the device in the field of inverter circuits, chopper circuits and the like, and has the advantage that the process is simple, and is compatible with a traditional silicon carbide VDMOS device process.

The invention provides a silicon carbide MOSFET device and a manufacturing method thereof. Silicon carbide deep P injection is performed in a specified region, groove etching and deposition of metal or polysilicon are performed above a silicon carbide deep P doped region, and the deposited metal or polysilicon is in direct contact with the silicon carbide N-epitaxy to form a Schottky contact or aSi/SiC heterojunction contact having rectifying characteristics. Therefore, the integration of multiple sub-rectifiers is achieve while optimizing the basic performance of the conventional silicon carbide UMOSFET, the working performance of the third quadrant of the device is greatly optimized, the gate-drain capacitance of the device is reduced and the switching speed of the device is improved.

A trench type power semiconductor device includes proud gate electrodes that extend out of the trenches and above the surface of the semiconductor body. These proud gate electrodes allow for making ultra-shallow source regions within the semiconductor body using, for example, a low temperature source drive. In addition, a method for manufacturing the trench type power semiconductor device includes a low temperature process flow once the gate electrodes are formed.

The invention provides a silicon carbide MOSFET device and a manufacturing method thereof. The invention improves device structure design and finally integrates Schottky contact or heterojunction contact with rectifying characteristics on the basis of traditional silicon carbide UMOSFET structure. At that same time of optimize the basic characteristics of the traditional silicon carbide UMOSFET structure, the improvement realize the integration of multi-sub rectifier devices, greatly optimizes the work performance of the third quadrant of the device, and in addition, the invention also optimizes the dynamic performance of the device, and has shorter switching time; In addition, the invention also has the characteristics of simple process and easy realization.

A method of forming a trench within a semiconductor substrate. The method comprises, for example, the following: (a) providing a semiconductor substrate; (b) providing a patterned first CVD-deposited masking material layer having a first aperture over the semiconductor substrate; (c) depositing a second CVD-deposited masking material layer over the first masking material layer; (d) etching the second masking material layer until a second aperture that is narrower than the first aperture is created in the second masking material within the first aperture; and (e) etching the semiconductor substrate through the second aperture such that a trench is formed in the semiconductor substrate. In preferred embodiments, the method of the present invention is used in the formation of trench MOSFET devices.

The invention provides a silicon carbide trench gate metal oxide with semiconductor field effect transistor (SiC UMOSFET) structure integrated Schottky diode (SBD) and a method for manufacturing the same, The structure is characterized by, a p +-type bury layer (50) is formed on the n-type current transport layer (40) by implantation, and further an n-type current transport layer (40) is epitaxially formed so that the p +-type buried layer (50) floats, and the p +-type buried layer (50) can effectively reduce the electric field in the gate trench oxide and the electric field at the Schottky contact position in the blocking mode, so that the SBD integrated SiC UMOSFET has high blocking ability, and the high temperature and high field reliability of the device are greatly improved. At that same time, the relative position of the main trench (80), the main trench (80') and the p +-type buried layer (50) and the n-type current transport layer (40) are adjusted so that when the MOSFET is operated in the first quadrant, the conduction characteristic of the MOSFET does not degrade significantly; When the MOSFET is operated in the third quadrant, the conduction of the parasitic pn diode inthe MOSFET is effectively suppressed and the Schottky diode conduction mode is obtained. SiC UMOSFETs with integrated SBD have a lower total chip area than discrete SBD and MOSFET devices.

The invention provides a trench silicon carbide power device with low on-resistance and a manufacturing process thereof. The cell of the trench silicon carbide power device comprises an N-type substrate, an N-type epitaxial layer and a trench, wherein the trench is internally provided with a gate oxide layer and a polysilicon gate, a P-type body region, an N-type source region and a P+ body contact region are arranged on the two sides of the trench, a P shielding layer is arranged below the trench, and an N-type buried layer is arranged on the side of the P shielding layer. The manufacturing process of the N-type buried layer comprises the steps of epitaxially growing a first part of an N-type drift region on the N-type substrate, forming a P shielding layer and an N-type buried layer on the first part of the N-type drift region by adopting an ion implantation process, continuing to epitaxially form a second part of the N-type drift region, and carrying out a subsequent process flow. According to the invention, two sides of the P shielding layer are provided with the N-type buried layers, the electric field peak is moved downwards, the trench corner electric field is reduced, the interface state density and defects are reduced, and the reliability of the gate oxide layer is improved; and an N-type buried layer below is eliminated, the gate charge of the device is reduced, the switching characteristic is improved, and the withstand voltage of the device is further improved.

A semiconductor device includes a semiconductor-on-insulator region on a substrate. The semiconductor-on-insulator region includes a first semiconductor region overlying a dielectric region. The device includes an MOS transistor and a bipolar transistor. The MOS transistor has a drain region, a body region, and a source region in the first semiconductor region. The MOS transistor also includes a gate. The device also includes a second semiconductor region overlying the substrate and adjacent to the drain region, and a third semiconductor region overlying the substrate and adjacent to the second semiconductor region. The bipolar transistor includes has the drain region of the MOS transistor as an emitter, the second semiconductor region as a base, and the third semiconductor region as a collector. Accordingly, the drain of the MOS transistor also functions as the emitter of the bipolar transistor. Additionally, the gate and the base are coupled by a resistive element.

The invention belongs to semiconductor technology, and specifically relates to an accumulating type shield grid MOSFET integrating a schottky diode. A shield grid MOSFET area formed on a silicon substrate is separated from and adjacent to a schottky diode forming area. The accumulating type shield grid MOSFET has a shield grid structure, and the schottky diode has a groove structure identical to that of the shield grid MOSFET, and the schottky diode is filled in the top of the groove through source electrode metal to form a schottky contact on the side surface of the groove to reduce a chip occupied area. The forming process of the schottky diode is compatible with the forming process of MOSFET, thereby reducing process steps. When the schottky diode is reversely biased, an electric field exists between a polysilicon 7 in the groove 14 and N+ drift region 2, the N+ drift region 2 generates depletion, and the depletion area extends to the N+ drift region 2 until complete depletion. The breakdown of schottky junctions is prevented, and reverse current leakage of schottky diode is minimized.

The invention discloses a low-grid charge power device. A combined type grid oxidation layer composed of a primary grid oxidation layer and a secondary grid oxidation layer is adopted in a grid oxidation layer of a grid area, a step structure is formed between the secondary grid oxidation layer and the primary grid oxidation layer, the width of the primary grid oxidation layer is smaller than or equal to the width of the top face of an N- type drift area, the thickness of the primary grid oxidation layer can be independently increased so that the overall thickness of the grid oxidation layer can be increased and the vertical thickness of the secondary grid oxidation layer in contact with a channel cannot be influenced, therefore, the capacitance between the grid area and a drain electrode is reduced under the premise of not influencing the turn-on and turn-off speed of the device, the aim of reducing grid charges is achieved, and the drive power consumption of turning on and off the device is lowered. The invention further discloses a manufacturing method of the low-grid charge power device. Under the condition of being compatible with an existing process, the primary grid oxidation layer and the secondary grid oxidation layer are formed successively by two steps to obtain the combined type grid oxidation layer, the process steps are simple, and operability is strong.

A III-nitride heterojunction semiconductor device having a III-nitride heterojunction that includes a discontinuous two-dimensional electron gas under a gate thereof.

A trench power semiconductor device including a recessed termination structure (15).

The invention relates to a three-dimensional separated gate trench charge storage type IGBT and a manufacturing method thereof, and belongs to the technical field of power semiconductor devices. According to the present invention, a P-type buried layer and a separated gate electrode equipotential with the emitter metal are introduced on the basis of a traditional CSTBT, the influence of the doping concentration of an N-type charge storage layer on the breakdown characteristic of a device is effectively eliminated through charge compensation, and meanwhile, the conduction voltage drop can be reduced by improving the doping concentration of the N-type charge storage layer. According to the present invention, the gate electrodes and the separated gate electrodes are placed in a same groove, and the gate electrodes are arranged at intervals along the Z-axis direction, so that on one hand, the channel density can be reduced, on the other hand, a parasitic PMOS structure can be formed in a cell, the saturation current density can be reduced, and a short-circuit safe working area can be improved; and meanwhile, the gate capacitance and gate charge are reduced, the switching loss of the device is reduced, the compromise relationship between the forward conduction voltage drop Vceon and the turn-off loss Eoff is further improved; and in addition, the improvement of the current uniformity and the improvement of the reliability of the device are also facilitated.

The invention relates to a SiC MOSFET device integrated with a groove and a body plane gate, and belongs to the technical field of semiconductors. According to the MOSFET, on the basis of a traditional trench gate, a body plane gate structure is introduced into the bottom of the trench gate. The body plane gate is composed of source metal, a gate insulating dielectric layer, a gate bottom N+ source, a gate bottom P electric field shielding region and a gate bottom channel region, and the gate bottom N+ source and the gate bottom P electric field shielding region are in short circuit with the source metal. The body plane gate not only introduces a new channel, but also integrates a new PN junction diode between a P electric field shielding region and an N-drift region. Compared with a traditional groove type SiC MOSFET, the groove gate bottom peak electric field is reduced by 75.3%; the gate-drain charge is reduced by 91.5%; the starting loss is reduced by 66.6% at the frequency of 1MHZ; and the turn-off loss is reduced by 78.0%.

The present invention provides a laterally diffused metal oxide semiconductor structure and a method for forming the same. A conductor layer located above a first dielectric layer and a voltage-withstanding layer is divided into a first conductor which is at least partially located in the first dielectric layer and a second conductor which is at least partially located on the voltage-withstandinglayer, thus the first conductor and the second conductor are spatially isolated and can be connected to different potentials such that the semiconductor structure maintains a high breakdown voltage ina shutdown state. Furthermore, an interface between the first dielectric layer and the voltage-withstanding layer is covered by one of the first conductor and the second conductor, the gate charge ofthe semiconductor structure can be effectively reduced, and so that the semiconductor structure is adapted to high frequency applications.