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707results about How to "High hole mobility" patented technology

High mobility heterojunction complementary field effect transistors and methods thereof

InactiveUS7057216B2High hole mobilitySimilar current carrying capabilityTransistorSolid-state devicesHeterojunctionPresent day
In all representative embodiments presented, the Ge concentration in the source and drain 10 and the SiGe epitaxial channel layer 20 is in the 15% to 50% range, preferably between about 20% to 40%. The SiGe thicknesses in the source / drain 10 are staying below the critical thickness for the given Ge concentration. The critical thickness is defined such that above it the SiGe will relax and defects and dislocations will form. The thickness of the SiGe epitaxial layer 20 typically is between about 5nm and 15nm. The thickness of the epitaxial Si layer 30 is typically between about 5nm and 15nm. FIG. 1A shows an embodiment where the body is bulk Si. These type of devices are the most common devices in present day microelectronics. FIGS. 1B and 1C show representative embodiment of the heterojunction source / drain FET device when the Si body 40 is disposed on top of an insulating material 55. This type of technology is commonly referred to as silicon on insulator (SOI) technology. The insulator material 55 usually, and preferably, is SiO2. FIG. 1B shows an SOI embodiment where the body 40 has enough volume to contain mobile charges. Such SOI devices are called partially depleted devices. FIG. 1C shows an SOI embodiment where the volume of the body 40 is insufficient to contain mobile charges. Such SOI devices are called fully depleted devices. For devices shown in FIG. 1B and 1C there is, at least a thin, layer of body underneath the source and drain 10. This body material serves as the seed material onto which the epitaxial SiGe source and drain 10 are grown. In an alternate embodiment, shown in FIG. 1D. for extremely thin fully depleted SOI devices, one could grow the source and drain 10 laterally, from a lateral seeding, in which case the source and drain 10 would penetrate all the way down to the insulating layer 55.
Owner:GLOBALFOUNDRIES US INC

SOI three-dimensional CMOS integrated component and preparation method thereof

The invention discloses a 3D SOI CMOS integrated device and a manufacturing method thereof, relates to the technical field of microelectronics, and mainly solves the problem of low speed of the existing 3D integrated circuits. The proposal is that an SSOI substrate and an SSGOI substrate are employed to construct two active layers of a new 3D CMOS integrated device; wherein, the lower active layer is the SSOI substrate and is made into a strained Si nMOSFET device by utilizing the characteristic of high electron mobility of a strained Si material in the SSOI substrate; the upper active layer is the SSGOI substrate and is made into a strained SiGe surface channel pMOSFET device by utilizing the characteristic of high hole mobility of the strained Si material in the SSGOI substrate; the upper active layer and the lower active layer form a 3D active layer structure by a bonding process, and are connected by an interconnection line to form the 3D CMOS integrated device with a conducting channel of 65nm to 130nm. Compared with the existing 3D integrated devices, the 3D SOI CMOS integrated device manufactured by the manufacturing method has the advantages of high speed and good performance, and can be applied to manufacturing large-scale and high-speed 3D CMOS integrated circuits.
Owner:XIDIAN UNIV

Spiro-OMeTAD/PbS composite hole transport layer based perovskite solar cell and preparation method therefor

The invention discloses a Spiro-OMeTAD/PbS composite hole transport layer based perovskite solar cell and a preparation method therefor. The perovskite solar cell comprises a transparent conductive substrate, an oxide electron transport layer, a perovskite solar light absorption layer, the Spiro-OMeTAD/PbS composite hole transport layer and a metal electrode. The perovskite thin film solar cell adopts a simple process; a lead sulfide thin film can be prepared by a large-area evaporation method; and the lead sulfide thin film can be inserted between the Spiro-OMeTAD and the metal electrode layer to be used as a buffer layer. The Spiro-OMeTAD/PbS composite hole transport layer based perovskite solar cell achieves a high photoelectric conversion efficiency which is as high as 15.11%; the lead sulfide, which is used as the buffer layer between the hole transport layer and the metal electrode, has higher hole mobility, and higher humidity stability and light and heat stability, so that the recombination of electron-hole pairs can be reduced; meanwhile, the stability of the cell can be improved; compared with other buffer layer materials, the lead sulfide can protect a device and improve the performance of the device as well; and therefore, a positive promotion effect is realized on the industrial development of the solar cell.
Owner:WUHAN UNIV

Method for preparing diamond substrate for high-heat-conductivity integrated circuit

The invention belongs to the technical field of preparation of substrate materials for semiconductor basic circuits and particularly provides a method for preparing a composite doped diamond-film substrate for a high-heat-conductivity electronic device. The method comprises the following steps of: firstly carrying out high-density diamond nucleation growth on a metal substrate or a graphite transition layer substrate, depositing an element-doped diamond film, and carrying out the growth of the diamond film to reach a required thickness; carrying out vacuum heat treatment on a diamond gradient composite substrate after demoulding for homogenizing and destressing; and carrying out double-surface grinding and polishing on the doped diamond gradient composite substrate and meeting the requirements on the surface finish quality and the thickness of a substrate for a semiconductor integrated circuit. The invention has the advantages that a boron-doped diamond film has high electron and hole mobility; a boron-undoped diamond film is taken as a substrate support of the doped diamond film; and the heat conductivity of the relatively thicker boron-undoped diamond film is five times of that of copper, thus the heat can be transferred to a radiator in time.
Owner:UNIV OF SCI & TECH BEIJING
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