9results about "Current conducting devices" patented technology

In one embodiment of the present invention, an electrolytic plating apparatus is disclosed. The electrolytic plating apparatus includes an electrolytic plating tank, a clamp, a positioning cylinder, and an anode. In the electrolytic plating apparatus, the positioning cylinder is located in the electrolytic plating tank, and one end of the positioning cylinder is open. The anode is located inside the positioning cylinder, and the positioning cylinder is in sealing contact with the anode. Furthermore, of the total surface area of ​​the anode, only a first surface is in contact with the electrolytic plating solution, the first surface faces the substrate in parallel, the center is aligned with the center of the substrate, and the size of the first surface is similar to the size of the effective electrolytic plating area of ​​the substrate. The electrolytic plating apparatus allows the electric field generated by the anode to be uniformly distributed on the surface of the substrate, thereby improving the uniformity of the electrolytic plating height on the surface of the substrate. Furthermore, in one embodiment of the present invention, an electrolytic plating method using the electrolytic plating apparatus is disclosed.

The present disclosure is applicable to the technical field of electroplating solar cells, and provides horizontal electroplating equipment for a solar cell plate. A plurality of electroplating baths are successively arranged in the horizontal electroplating equipment at intervals in a horizontal direction, and include first side walls and second side walls opposite to the first side walls in the horizontal direction. The solar cell plate remains in contact with at least one cathode structure in an electroplating process. In the horizontal direction, a spacing between the first side wall of the Mth electroplating bath and the first side wall of the (M+1)th electroplating bath is less than a length of the solar cell plate, and a spacing between the first side wall of the Mth electroplating bath and the second side wall of the (M+1)th electroplating bath is greater than the length of the solar cell plate. As such, the solar cell plate can be in contact with the at least one cathode structure regardless of a state of the solar cell plate, enabling continuous electroplating. In addition, in the electroplating process, the number of the electroplating baths covered by the solar cell plate is less than 2, which can improve the electroplating efficiency of a single electroplated region while reducing the cost and the failure rate.

The application discloses a method and device for horizontal electroplating of a battery piece, wherein a flexible conductive piece is fixedly attached to an opening of a mask on a plated surface of the battery piece, so that an electrical connection is formed between the flexible conductive piece and the battery piece, and metal material can be electroplated in the opening of the mask on one side or two sides of the battery piece, thereby avoiding the problems of cracked or broken pieces caused by clamping of the battery piece by a hard conductive point in the prior art.

Forming plural bumps on a substrate in such a manner that the bumps have uniform heights. A plating apparatus for forming bumps on a substrate is provide. The plating apparatus comprises: a substrate holder constructed to hold the substrate; a plating tank constructed to store plating liquid and the substrate holder; an anode arranged in the inside of the plating tank in such a manner that the anode faces the substrate held by the substrate holder; an electric power source constructed to supply electric current flowing between the substrate and the anode; and a controller; wherein the controller is constructed to make the electric power source output electric current that comprises a first period during that positive-direction electric current is supplied for depositing metal on the substrate from the plating liquid, a second period during that at lest one reverse-current pulse, that flows in a direction opposite to a direction of the positive-direction electric current, is supplied, and a third period during that supplying of electric current is stopped, wherein the third period is a period in the middle of a transition from the reverse-current pulse to the positive-direction electric current.

The present invention relates to an electroplating composition for plating a chromium coating on a substrate, the electroplating composition comprising: (i) a source of hexavalent chromium; (ii) one or more quaternary nitrogen-containing betaines and / or salts thereof; and (iii) one or more polyorganosiloxanes.

Methods and apparatus for electroplating metal onto a substrate are provided herein. For instance, such an electrodeposition apparatus may include: (a) a plating chamber configured to contain an electrolyte and an anode while electroplating metal onto a substrate; (b) a substrate holder configured to hold the substrate and maintain separation between a plating face of the substrate and the anode during electroplating; and (c) an ionically-resistive ionically-permeable element including a substrate-facing surface and an opposing surface, where the ionically-resistive ionically-permeable element allows for flow of ionic current through the ionically-resistive ionically-permeable element towards the substrate during electroplating, and where the ionically-resistive ionically-permeable element and the substrate holder are configured to mate with one another and rotate together relative to the plating chamber.

The present invention relates to a method for pretreatment of a substrate containing copper and / or its alloys, comprising at least step 1), i.e., contacting at least one surface of at least one substrate (the surface being made of copper and / or at least one of its alloys) with an aqueous composition in at least a portion thereof, thereby forming a film on at least a portion thereof, wherein the aqueous composition comprises water and at least one of components a1) and a2), i.e., as component a1), at least one of zirconium cation, titanium cation, and hafnium cation, each calculated as a metal in the respective case, preferably in an amount in the range of 5 to 2000 mg / L, and / or as component a2), at least one organosilane and / or at least one hydrolysate and / or condensate thereof, wherein the contact step 1) is performed in an electrolytic cell apparatus in which the substrate made of copper and / or its alloys serves as the cathode during the execution of step 1). The present invention also relates to a method for applying at least one coating film onto the surface of a pre-treated substrate, a substrate that can be obtained by any of these methods, a current collector, conductor, copper-clad laminate, anode material, and battery cell that can be obtained from the substrate, and a method for using the aforementioned aqueous composition for electrolytically forming a film on a substrate made of copper and / or its alloy.

A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3 -epoxy- 1 -propanol and aminic alcohol or ammonium alcohol.