263results about "Current conducting devices" patented technology

The electroplating barrel plating equipment comprises an electroplating bath and a roller, one end of the roller is rotatably installed on a first supporting plate through a first rotating shaft, the other end of the roller is rotatably installed on a second supporting plate through a second rotating shaft, the roller is provided with an opening capable of being buckled, the opening is used for taking and placing a to-be-plated part, and a plurality of through holes are formed in the side wall of the roller; a plurality of conductive rods are arranged in the roller in the circumferential direction, a plurality of conductive heads are arranged on each conductive rod at intervals, the conductive rods extend in the length direction of the roller, one end of each conductive rod extends to the second rotating shaft to form a conductive end, and a first conductive bearing bush and a second conductive bearing bush corresponding to the conductive ends are arranged on the second supporting plate. The invention further comprises a plating solution forced circulation system. The contact area of the conductive head and a to-be-plated part is increased, the problems of virtual connection and overheating caused by floating of the free conductive head are solved, meanwhile, the plating solution forced circulation system enables the temperature and ion concentration of plating solutions inside and outside the roller to be more uniform, and the electroplating efficiency and quality are improved.

The invention discloses a horizontal electroplating production line and relates to the technical field of circuit board electroplating, the horizontal electroplating production line comprises horizontal electroplating equipment and a circuit board feeding device, the horizontal electroplating equipment comprises a first rack, an electroplating cylinder and a horizontal electroplating conveying device, the electroplating cylinder and the horizontal electroplating conveying device are arranged on the first rack, and the electroplating cylinder extends in the first direction; the horizontal electroplating conveying device is used for clamping the circuit board to move in the electroplating cylinder and carrying out electroplating, the circuit board feeding device comprises a second rack and a feeding conveying mechanism arranged on the second rack, and the feeding conveying mechanism is a conveying line with a certain length; the feeding conveying mechanism is used for allowing the circuit board to be horizontally placed and conveying the circuit board to the horizontal electroplating conveying device of the electroplating equipment in the horizontal direction, in the whole conveying process, the circuit board is kept horizontal and does not need to be operated through a mechanical arm, the occupied space of the equipment is smaller than that of traditional electroplating equipment, and the manufacturing cost is lower; and the high-precision electroplating requirement is met.

The present invention relates to the technical field of electroplating devices, and specifically to an electroplating device and method for surface treatment of metal products, comprising an electroplating pool, wherein a plurality of partitions are arranged inside the electroplating pool, and the plurality of partitions divide the internal space of the electroplating pool into a plurality of electroplating tanks, and a bracket is arranged on the top of the electroplating pool, and the bracket is in the shape of a gate, and a first linear slide distributed along its own length direction is arranged on the top of the bracket, and a vertical plate is arranged at the movable end of the first linear slide, and a second linear slide distributed vertically is arranged on the surface of the vertical plate, and a horizontal plate is arranged at the movable end of the second linear slide; the present invention has an electroplating rack and a blowing part, and when the electroplating rack carries the electroplated parts out of the electroplating liquid, the blowing part can be used to blow air to the surface of the electroplating rack, thereby accelerating the dripping of the electroplating liquid on the surface of the electroplated parts to avoid cross contamination between different electroplating liquids.

The invention provides a device for horizontal electroplating of a PCB and a method for horizontal electroplating of the PCB.The device for horizontal electroplating of the PCB comprises a plated plate conveying belt, the two sides, perpendicular to the direction of the plated plate conveying belt, of the plated plate conveying belt are each provided with at least one conductive roller, and a conductive shaft core is arranged at the position of a center shaft of each conductive roller in a penetrating mode; the conductive shaft core is connected with a power supply; the conductive roller is also provided with at least three movable conductive thimbles; the movable conductive ejector pin is arranged in the circumferential surface direction of the conductive roller along the conductive axis; and at least three movable conductive thimbles are distributed, so that in the rolling process of the conductive roller, at least one movable conductive thimble is connected with the conductive shaft core and the plated plate conveying belt on each of the two sides of the plated plate conveying belt. The conductive mode of traditional horizontal electroplating is simplified, a conductive clamp is omitted, and the cost is reduced. The conductive mode of the device is suitable for a hard board and a flexible board, boards with different thicknesses can be considered, and the current distribution of the board surface can be improved at the same time.

An electroplating method and an electroplating apparatus, which relate to the technical field of semiconductor processing. The electroplating method comprises: S10, applying a positive voltage to an intermediate anode, and an edge electrode not operating; S20, acquiring a deposition rate v1 of a plating layer of an intermediate region, and acquiring a deposition rate v2 of a plating layer of an edge region; S30, determining the magnitudes of v1 and v2; S40, if v1 is greater than v2, applying the positive voltage to the edge electrode, and outputting a current I; S50, if v1 is less than v2, applying a negative voltage to the edge electrode, and outputting the current I; and S60, if v1 is equal to v2, keeping an operating state of the edge electrode unchanged. By means of respectively acquiring deposition rates of plating layers of an intermediate region and an edge region, and controlling the voltage and current of an edge electrode accordingly, the deposition rate of the edge region can be dynamically adjusted, such that the deposition rates of the edge region and the intermediate region can be balanced in real time, thereby improving the uniformity of electroplating.

The present invention discloses a wafer electroplating device for wafer wet process equipment, comprising a plating tank shell with a cavity for electroplating, wherein the plating tank shell is provided with adjacent and detachable wafer hanger parts and a plating diffusion and shielding part, wherein the wafer hanger part is provided with a single-sided exposure port for exposing one side of the plating surface of the wafer, and the plating diffusion and shielding part is provided with a multi-stage guide surface directly opposite to the single-sided exposure port. The wafer electroplating device for wafer wet process equipment provided by the present invention has a compact overall structural arrangement, a sophisticated internal structure and comprehensive functions, and multiple wafers can be electroplated at the same time through the wafer hanger part, and each wafer is plated on only one side of the surface, and the plating liquid can be fully diffused through the multi-stage guide surface of the plating diffusion and shielding part to ensure that the plating liquid is evenly plated on the wafer to meet the requirement of uniform thickness.

An electrochemical treatment electrode configured to contact an interior surface of a metal article with an electrochemical treatment fluid comprises a flexible conductive body and a plurality of flexible elements connected to the flexible conductive body and extending generally outwardly of the flexible conductive body and configured to position an electrochemical treatment fluid around the flexible conductive body, the plurality of flexible elements including a plurality of conductive or non-conductive fibers extending generally outwardly of the flexible conductive body, the plurality of conductive or non-conductive fibers configured to contact the interior surface of the metal article when the electrode is in use.

The present invention relates to a method for pretreatment of substrates containing copper and / or alloys thereof, the method comprising at least step 1), namely contacting at least one surface of the at least one substrate, said surface being made of copper and / or at least one alloy thereof, at least in portion with an aqueous composition and thereby forming a film at least in portion on said surface, wherein the aqueous composition comprises, besides water, at least one of constituents a1) and a2), namely at least one of zirconium, titanium and hafnium cations as constituent(s) a1) in an amount in a range of from 5 to 2000 mg / L, and / or at least one organosilane and / or a hydrolysis and / or condensation product thereof as constituent(s) a2), wherein contacting step 1) is performed in an electrolytic cell arrangement with the substrate made of copper and / or alloys thereof being the cathode during performance of step 1), a method of applying at least one coating film onto the surface of the pretreated substrate, a substrate obtainable by one of these methods, current collectors, conductors, copper clad laminates, anode materials and battery cells obtainable therefrom, and to a use of aforementioned aqueous composition for electrolytically forming films on substrates made of copper and / or alloys thereof.

There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; and an intermediate mask placed between the substrate and the anode to be arranged on a substrate side, provided with a first center opening that causes an electric field from the anode toward the substrate to pass through, and further provided with an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening, wherein the auxiliary anode has an area that is not greater than ⅕ of an area of the anode.

The invention discloses a horizontal electroplating line capable of realizing single-side electroplating. The horizontal electroplating line comprises an annular driving device, an electroplating device, a multifunctional tank and a fixing device, a battery piece is arranged in the electroplating device, and the electroplating device is driven by the annular driving device to circularly move in the horizontal direction and lift in the vertical direction along the annular track on the fixing device; the multifunctional tank is mounted below the electroplating device and consists of a plurality of different functional tanks; the electroplating device moves up and down in each functional tank to realize electroplating treatment of the battery piece; the fixing device is installed below the annular driving device and used for fixing and connecting the whole annular line. The movement of the battery piece is realized through the electroplating device; through the design of a positive and negative air pressure annular sealing structure, the other surface is protected from being in contact with electroplating liquid while single-surface horizontal continuous electroplating is realized; and meanwhile, the fragment rate is reduced, and the electroplating efficiency is improved.

A method of making an electrical component includes transmitting electrical energy from a power source through one or more deposition anodes, through an electrolyte solution, and to an intralayer electrical-connection feature of a build plate, such that material is electrochemically deposited onto the intralayer electrical-connection feature and forms an interlayer electrical-connection feature. The method also includes securing a dielectric material so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature and contacts and at least partially electrically insulates the interlayer electrical-connection feature. The method additionally includes depositing a seed layer onto the dielectric material and the interlayer electrical-connection feature, electrochemically depositing material onto the seed layer, to form at least one second intralayer electrical-connection feature of the electrical component, and removing any one or more portions of the seed layer onto which no portion of the at least one second intralayer electrical-connection feature is formed.

The present invention discloses an electroplating device, comprising: a tank body, a hollow portion penetrating the bottom of the tank body and a receiving portion for placing the electroplating liquid are formed in the tank body; a tool holder, movably extending into the receiving portion; a first conductive component, installed in cooperation with the tool holder, movably extending into the hollow portion; a first bracket, used to install the tool holder and the first conductive component; a second conductive component, fixedly extending into the hollow portion and abutting against the first conductive component; a driving component, the driving component passes through the hollow portion and abuts against the first bracket, and is used to drive the first bracket to rotate. The present invention drives the tool holder and the workpiece to rotate through the driving component, and the rotation of the workpiece can improve the uniformity of the plating layer on the surface of the workpiece; the present invention realizes efficient current transmission by the second conductive component rotating and abutting against the first conductive component; the rotating conductive device of the present invention can withstand a current of up to 45000A, thereby meeting the needs of workpiece electroplating.

The invention relates to a device (D) and an electrochemical surface treatment system for an internal surface of a longitudinal tubular element (T) made of electroconductive material, which device (D) comprises: a chassis assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means forming a sealed interface (4A, 4B) configured to cooperate removably with the tubular element (T) and with the anode, the means forming a sealed interface (4A, 4B) comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, in use, with a sealed longitudinal passage formed between the anode and the internal surface of the tubular element (T);and, means for rotating the tubular element (T) around its longitudinal axis (X0), characterized in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and that the device (D) further comprises means for tensing the anode configured to act on at least one of the two ends of the anode in order to prevent deflection of the anode. Figure to be published with the abbreviation: Figure 1.;

Uniformity of plating film thickness distribution is improved in a plating device that supplies power to only one of opposite edges of a substrate. An intermediate mask (30) includes a pair of first edge members (31) that oppose a power supply edge member of a substrate holder, a pair of second edge members (33) that oppose a non-power supply edge member of the substrate holder, a first electric field supply member (35) disposed at the first edge members (31), and a second electric field supply member (37) disposed at the second edge members (33). The first electric field supply member (35) is configured to extend along the first edge members (31) between a first position (PG-1) on an extension line of a first edge (30a-1) of a second central opening (30a) and a second position (PG-2) on an extension line of a second edge (30a-2) opposite the first edge (30a-1). The second electric field supply member (37) is configured to supply an electric field as a pair away from a third position (PG-3) on an extension line of a third edge (30a-3) of the second central opening (30a) and a fourth position (PG-4) on an extension line of a fourth edge (30a-4) opposite the third edge (30a-3).

An object of the present invention is to provide a method and system of electroplating using an anode that can be prepared relatively easily without the need for ancillary equipment or anolyte management, and without the need for expensive metals or special metals. The present invention relates to a method of electroplating an article with metal, the method comprising the steps of: allowing a current to flow in a plating bath containing ions of the metal and an organic compound additive, wherein the plating bath comprises the article as a cathode and a conductive base material as an anode, a part of a surface of the conductive base material is covered with an insulating material, and a remaining part is exposed, and a current flowing portion is dispersedly present in the anode.

The invention relates to a device (D) and a system for the electrochemical surface treatment of the inner surface of a longitudinal tubular member (T) made of an electrically conductive material, the device (D) comprising: a frame assembly (1); at least one cathode (2) configured to be electrically connected to the tubular member (T); a longitudinal anode (3) configured to be coaxially arranged inside the tubular member (T); a sealed interface mechanism (4A, 4B) configured to removably mate with the tubular member (T) and the anode (3), said sealed interface mechanism (4A, 4B) comprising at least first and second inlet / outlet ends for connecting a source of treatment fluid and adapted, in use, to communicate with a sealed longitudinal passage (7) formed between the anode (3) and the inner surface of the tubular member (T); and a mechanism (5) for driving the tubular member (T) in rotation about the longitudinal axis (X0); characterised in that said frame assembly (1) is adapted to support the tubular member (T) in a non-vertical orientation, and in that the device (D) further comprises means for pulling the anode under traction configured to act on at least one of the two ends of the anode (3) to prevent it from flexing.

Electroplating systems may include an electroplating chamber. These systems may also include a replenishment assembly coupled to the electroplating chamber fluid. The replenishment assembly may include a first compartment containing an anode material. The first compartment may include a first compartment section containing the anode material and a second compartment section separated from the first compartment section by a spacer. The replenishment assembly may include a second compartment coupled to the electroplating chamber fluid and electrically coupled to the first compartment. The replenishment assembly may also include a third compartment electrically coupled to the second compartment, the third compartment including an inert cathode.

The invention provides an electroplating device which comprises an electroplating cavity used for containing electroplating liquid; the anode is positioned in the electroplating cavity; the substrate holding device is used for clamping the substrate and immersing the plating surface of the substrate into the electroplating liquid during electroplating; the substrate extension assembly comprises an extension cavity, an extension cathode and a diaphragm, the extension cathode is located in the extension cavity and is biased by the cathode, and the diaphragm is used for isolating the extension cathode from the electroplating cavity; wherein the extension cavity is provided with a drainage part facing the anode, the drainage part is provided with an opening, and during electroplating, the drainage part is located below the substrate, surrounds the radial outer side of the substrate, is parallel to the plating surface of the substrate and is used for enabling current from the anode to partially flow to the extension cathode through the drainage part; and the drainage part forms an extending plating surface on the radial outer side of the substrate. According to the electroplating device, the negative influence of the edge effect on the substrate is effectively inhibited or even eliminated.

An electroplating apparatus for a non-circular substrate, comprising: a central electrode region, which is circular, wherein the size of the central electrode region is an inscribed circle of a non-circular substrate, a central electrode is provided in the central electrode region, and the central electrode region is filled with the central electrode; a peripheral electrode region, which is arranged to surround the central electrode region, wherein the peripheral size of the peripheral electrode region is a circumscribed circle of the non-circular substrate, a peripheral electrode is arranged in the peripheral electrode region, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode region; a power source module, which comprises a plurality of power sources for supplying power to the central electrode and the peripheral electrode; and a control module, which is configured to detect a rotation position of the substrate, calculate the amplitude of a current required by each current block electrode at present, and feed back the amplitude of the current to the power source module so as to adjust the amplitude of the current.

This invention discloses a water bath tank body, in which copper guide rails are arranged inside. The length direction of the copper guide rails is parallel to the length direction of the water bath tank body. A water bath liquid inlet pipe is fixedly connected to the side of the water bath tank body. There are several copper guide rails, which are distributed in a stepped manner, with the copper guide rails on the side closer to the water bath liquid inlet pipe having the highest height. Filler blocks are fixedly connected or integrally formed between the copper guide rails. This invention has a high water bath liquid utilization rate, and the contact pads of the conductive brush and the copper guide rails are submerged below the water bath liquid. This satisfies the stepped water bath conductivity method for electroplating, avoids sparks generated by the conductive brush during movement, and ensures safe production.