68results about "Current conducting devices" patented technology

The invention relates to a device (D) and an electrochemical surface treatment system for an internal surface of a longitudinal tubular element (T) made of electroconductive material, which device (D) comprises: a chassis assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means forming a sealed interface (4A, 4B) configured to cooperate removably with the tubular element (T) and with the anode, the means forming a sealed interface (4A, 4B) comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, in use, with a sealed longitudinal passage formed between the anode and the internal surface of the tubular element (T);and, means for rotating the tubular element (T) around its longitudinal axis (X0), characterized in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and that the device (D) further comprises means for tensing the anode configured to act on at least one of the two ends of the anode in order to prevent deflection of the anode. Figure to be published with the abbreviation: Figure 1.;

Uniformity of plating film thickness distribution is improved in a plating device that supplies power to only one of opposite edges of a substrate. An intermediate mask (30) includes a pair of first edge members (31) that oppose a power supply edge member of a substrate holder, a pair of second edge members (33) that oppose a non-power supply edge member of the substrate holder, a first electric field supply member (35) disposed at the first edge members (31), and a second electric field supply member (37) disposed at the second edge members (33). The first electric field supply member (35) is configured to extend along the first edge members (31) between a first position (PG-1) on an extension line of a first edge (30a-1) of a second central opening (30a) and a second position (PG-2) on an extension line of a second edge (30a-2) opposite the first edge (30a-1). The second electric field supply member (37) is configured to supply an electric field as a pair away from a third position (PG-3) on an extension line of a third edge (30a-3) of the second central opening (30a) and a fourth position (PG-4) on an extension line of a fourth edge (30a-4) opposite the third edge (30a-3).

An object of the present invention is to provide a method and system of electroplating using an anode that can be prepared relatively easily without the need for ancillary equipment or anolyte management, and without the need for expensive metals or special metals. The present invention relates to a method of electroplating an article with metal, the method comprising the steps of: allowing a current to flow in a plating bath containing ions of the metal and an organic compound additive, wherein the plating bath comprises the article as a cathode and a conductive base material as an anode, a part of a surface of the conductive base material is covered with an insulating material, and a remaining part is exposed, and a current flowing portion is dispersedly present in the anode.

The invention provides an electroplating device which comprises an electroplating cavity used for containing electroplating liquid; the anode is positioned in the electroplating cavity; the substrate holding device is used for clamping the substrate and immersing the plating surface of the substrate into the electroplating liquid during electroplating; the substrate extension assembly comprises an extension cavity, an extension cathode and a diaphragm, the extension cathode is located in the extension cavity and is biased by the cathode, and the diaphragm is used for isolating the extension cathode from the electroplating cavity; wherein the extension cavity is provided with a drainage part facing the anode, the drainage part is provided with an opening, and during electroplating, the drainage part is located below the substrate, surrounds the radial outer side of the substrate, is parallel to the plating surface of the substrate and is used for enabling current from the anode to partially flow to the extension cathode through the drainage part; and the drainage part forms an extending plating surface on the radial outer side of the substrate. According to the electroplating device, the negative influence of the edge effect on the substrate is effectively inhibited or even eliminated.

The invention provides a device and method for restraining plate stamping interface failure through pulse current regulation and control, and the system comprises a plate stamping module which is used for carrying out the stamping forming of a plate; the plurality of electrode clamps are detachably connected with the plate respectively, and electrodes are arranged on the electrode clamps; the current box is electrically connected with the electrode; the thermocouple is electrically connected with the current box and is used for acquiring temperature data of the plate; the ultrasonic emission sensor is electrically connected with the current box and is used for acquiring ultrasonic signal intensity data; the current box is configured to apply a heating current to the plated plate according to the temperature data, apply a preset high-strength low-frequency current to the plated plate after the temperature data reaches a target temperature, apply a low-strength high-frequency current to the plated plate when the ultrasonic signal strength reaches a preset strength in the punch forming process, continuously increase the density of the low-strength high-frequency current, and perform punch forming on the plated plate; the ultrasonic signal intensity is not increased any more. Therefore, the forming performance can be improved by introducing the high-strength low-frequency composite low-strength high-frequency pulse current.

This invention discloses a water bath tank body, in which copper guide rails are arranged inside. The length direction of the copper guide rails is parallel to the length direction of the water bath tank body. A water bath liquid inlet pipe is fixedly connected to the side of the water bath tank body. There are several copper guide rails, which are distributed in a stepped manner, with the copper guide rails on the side closer to the water bath liquid inlet pipe having the highest height. Filler blocks are fixedly connected or integrally formed between the copper guide rails. This invention has a high water bath liquid utilization rate, and the contact pads of the conductive brush and the copper guide rails are submerged below the water bath liquid. This satisfies the stepped water bath conductivity method for electroplating, avoids sparks generated by the conductive brush during movement, and ensures safe production.

The electroplating equipment comprises a plurality of electroplating baths and a water blocking device, a plurality of electroplating inner baths and an electrolytic bath are arranged in the electroplating baths, feeding ports are formed in one sides of the electroplating inner baths respectively, the electroplating inner baths and the electrolytic bath are located on the same horizontal plane, and a driving device is arranged on the side face of each electroplating inner bath. The driving device is connected with the conveying rollers and the conductive rollers, the conveying rollers and the conductive rollers are arranged in pairs, the conveying rollers are arranged in the electrolysis inner tanks, the water blocking device and the conductive rollers are arranged between the adjacent electrolysis inner tanks, and anode titanium meshes are symmetrically arranged on the upper side and the lower side of the electroplating inner tank and are arranged on the upper side and the lower side of the conveying rollers at equal intervals. Upper and lower layers of anodes are adopted, so that double-sided electroplating can be performed; groove type soaking is adopted, an electroplating sheet is in direct contact with electroplating liquid, ion supplementation is fast, and the concentration difference caused by electroplating precipitation can be supplemented in time; the anode titanium mesh directly faces the electroplating sheet, the electric field directly acts on the electroplating sheet, and the electric power utilization rate is high.

The present invention relates to a method for pretreatment of substrates containing copper and / or alloys thereof, the method comprising at least step 1), namely contacting at least one surface of the at least one substrate, said surface being made of copper and / or at least one alloy thereof, at least in portion with an aqueous composition and thereby forming a film at least in portion on said surface, wherein the aqueous composition comprises, besides water, at least one of constituents a1) and a2), namely at least one of zirconium, titanium and hafnium cations as constituent(s) a1) in an amount in a range of from 5 to 2000 mg / L, and / or at least one organosilane and / or a hydrolysis and / or condensation product thereof as constituent(s) a2), wherein contacting step 1) is performed in an electrolytic cell arrangement with the substrate made of copper and / or alloys thereof being the cathode during performance of step 1), a method of applying at least one coating film onto the surface of the pretreated substrate, a substrate obtainable by one of these methods, current collectors, conductors, copper clad laminates, anode materials and battery cells obtainable therefrom, and to a use of aforementioned aqueous composition for electrolytically forming films on substrates made of copper and / or alloys thereof.

Methods and apparatus for electroplating metal onto a substrate are provided herein. For example, such an electrodeposition apparatus may include: (a) a plating chamber configured to contain an electrolyte and an anode while plating a metal onto a substrate; (b) a substrate holder configured to hold the substrate and maintain a separation between a plating surface of the substrate and the anode during electroplating; and (c) an ionically resistive ionically permeable element comprising a substrate facing surface and an opposing surface wherein the ionically resistive ionically permeable element allows a flow of an ionic current through the ionically resistive ionically permeable element toward the substrate during electroplating, and wherein the ionically resistive ionically permeable element and the substrate holder are configured to cooperate with each other and rotate together relative to the plating chamber.

Provided is a plating apparatus which is capable of improving the uniformity of the thickness of a plating film that is formed on an object to be plated.　Also provided is a resistor for electric field adjustment for a plating apparatus, the resistor for a plating apparatus being disposed between an anode and a holder for holding an object to be plated in a plating apparatus. The resistor for a plating apparatus has a plate-like main body. The plate-like main body has an upper surface, a lower surface, and a plurality of through holes with which the upper surface and the lower surface are in communication with each other. The resistor for a plating apparatus additionally has an insertion body that is disposed inside the main body. The insertion body has a plurality of through holes, and the insertion body is movable between a first position at which the plurality of through holes of the insertion body are in communication with the plurality of through holes of the main body and a second position at which the plurality of through holes of the insertion body are not in communication with the plurality of through holes of the main body.

The invention relates to the field of electroplating equipment, in particular to a thyristor shell nickel plating device and a using method thereof.The thyristor shell nickel plating device comprises a nickel plating pool, an electroplating frame is vertically arranged on the nickel plating pool in a sliding mode, a lifting piece for driving the electroplating frame to vertically slide is arranged on the nickel plating pool, and a water sinking frame is arranged on the electroplating frame; a plurality of shell placing mechanisms for placing tube shells are uniformly distributed on the water sinking frame, each shell placing mechanism comprises a branch pipe arranged on the water sinking frame, a bearing plate is coaxially arranged on each branch pipe, and a first electrifying supporting rod and a second electrifying supporting rod which are the same in structure are vertically and slidably arranged on each bearing plate; the multiple first electrified supporting rods and the multiple second electrified supporting rods are evenly distributed in the circumferential direction of the axis of the supporting pipe and are sequentially arranged in a staggered mode, the pipe shell is used for being placed on the tops of the first electrified supporting rods or the tops of the second electrified supporting rods, a jacking assembly is arranged on the supporting pipe, and a power supply part is arranged on the electroplating frame. The electroplating device has the effect of improving the electroplating quality of the tube shell.

The application provides a double-sided electroplating tool suitable for rotary sputtering, which comprises a lower ring body, an upper ring body and an upper cover connected in a matching mode, a conductive ring with a group of lower conductive comb teeth is arranged on the lower ring body, an upper conductive ring with a group of upper conductive comb teeth is arranged on the upper ring body, a group of supporting cylinders in contact with the upper cover are uniformly distributed on the upper ring body, a conductive column connected with the upper conductive ring is arranged in the supporting cylinder, a conductive disc is arranged in the upper cover, a group of conductive guide columns corresponding to the conductive column are uniformly distributed on the conductive disc, a conductive shaft extending out of the upper cover is arranged on the conductive disc, and a group of electroplating liquid exchange holes penetrating through the upper cover and the conductive disc are uniformly distributed on the upper cover. The application has the advantages of simple structure, convenient use, realization of double-sided electroplating of a wafer on the basis of a tilted rotary sputtering electroplating process cavity structure, small difference between double-sided electroplating rates, high uniformity, simple operation, strong applicability and the like.

In one embodiment of the present invention, an electrolytic plating apparatus is disclosed. The electrolytic plating apparatus includes an electrolytic plating tank, a clamp, a positioning cylinder, and an anode. In the electrolytic plating apparatus, the positioning cylinder is located in the electrolytic plating tank, and one end of the positioning cylinder is open. The anode is located inside the positioning cylinder, and the positioning cylinder is in sealing contact with the anode. Furthermore, of the total surface area of ​​the anode, only a first surface is in contact with the electrolytic plating solution, the first surface faces the substrate in parallel, the center is aligned with the center of the substrate, and the size of the first surface is similar to the size of the effective electrolytic plating area of ​​the substrate. The electrolytic plating apparatus allows the electric field generated by the anode to be uniformly distributed on the surface of the substrate, thereby improving the uniformity of the electrolytic plating height on the surface of the substrate. Furthermore, in one embodiment of the present invention, an electrolytic plating method using the electrolytic plating apparatus is disclosed.

The application provides a power supply structure and an electroplating device. The electroplating device comprises a conveying mechanism, a plurality of processing units and the power supply structure. The power supply structure comprises a power supply part, a main conductive part, a plurality of sub-conductive parts and a plurality of wires. The power supply part is connected with the main conductive part and supplies power to the main conductive part. Each sub-conductive part is arranged in each processing unit. The conveying mechanism is used to drive each processing unit to move around the main conductive part. The plurality of sub-conductive parts are arranged around the periphery of the main conductive part and move around the main conductive part in sequence. Each sub-conductive part is electrically connected with the main conductive part through a wire. The wire is elastic, and the length of the wire can change with the distance between the sub-conductive part and the main conductive part. Through the arrangement of the power supply structure, the plurality of sequentially moving processing units can be supplied with power by one power supply part. The power supply structure is simple and stable, thereby improving the processing stability and processing effect of the electroplating device on parts.

To improve uniformity of plating thickness in a plating apparatus.SOLUTION: A plating apparatus is provided for plating a substrate by passing an electric current from an anode to the substrate. The plating apparatus comprises a plurality of anode-side electrical wires electrically connected to the anode via a plurality of electrical contacts on the anode, a plurality of substrate-side electrical wires electrically connected to the substrate via a plurality of electrical contacts on the substrate, and on at least either one of the anode side or the substrate side, a plurality of variable resistors located in the middle of the plurality of anode-side electrical wires or the plurality of substrate-side electrical wires, and a controller configured to adjust the respective resistance values of the plurality of variable resistors.SELECTED DRAWING: Figure 5

An electroplated part, which contains hardly any organic residues and has a uniform electroplated layer. An electroplating method for preparing the electroplated part is also provided. By controlling the ratio of the length of the motion trajectory of the electroplated part relative to an anode during the electroplating process to the width of the anode, and adding auxiliary cathodes to the electroplated part, the electroplating method improves the uniformity of the thickness of the electroplated layer at various positions of the electroplated part. A fixture for implementing the electroplating method and an electroplating apparatus are provided. The electroplated layer of the electroplated part prepared by the electroplating method has relatively uniform thickness and a high coverage rate, problems such as burn and fracture have hardly occurred during the electroplating process of the electroplated part, the yield of electroplated parts is high, and the scrap rate is low. In addition, the precision of the weight of plated layers of electroplated parts can reach 99% or above.

The present disclosure is applicable to the technical field of electroplating solar cells, and provides horizontal electroplating equipment for a solar cell plate. A plurality of electroplating baths are successively arranged in the horizontal electroplating equipment at intervals in a horizontal direction, and include first side walls and second side walls opposite to the first side walls in the horizontal direction. The solar cell plate remains in contact with at least one cathode structure in an electroplating process. In the horizontal direction, a spacing between the first side wall of the Mth electroplating bath and the first side wall of the (M+1)th electroplating bath is less than a length of the solar cell plate, and a spacing between the first side wall of the Mth electroplating bath and the second side wall of the (M+1)th electroplating bath is greater than the length of the solar cell plate. As such, the solar cell plate can be in contact with the at least one cathode structure regardless of a state of the solar cell plate, enabling continuous electroplating. In addition, in the electroplating process, the number of the electroplating baths covered by the solar cell plate is less than 2, which can improve the electroplating efficiency of a single electroplated region while reducing the cost and the failure rate.

The present disclosure is applicable to the technical field of solar cell electroplating. Provided is a horizontal electroplating apparatus for a solar cell. In the horizontal electroplating apparatus, a plurality of electroplating tanks are arranged in sequence and at intervals in a horizontal direction, wherein each of the electroplating tanks comprises a first side wall and a second side wall facing away from each other in the horizontal direction. During an electroplating process, a solar cell is always in contact with at least one cathode structure. In the horizontal direction, the distance between the first side wall of an Mth electroplating tank and the first side wall of an (M+1)th electroplating tank is less than the length of the solar cell, and the distance between the first side wall of the Mth electroplating tank and the second side wall of the (M+1)th electroplating tank is greater than the length of the solar cell. In this way, the solar cell can be in contact with at least one cathode structure regardless of the state of the solar cell, thus realizing continuous electroplating. In addition, during the electroplating process, the number of electroplating tanks covered by the solar cell is less than two, which can improve the electroplating efficiency of a single electroplating zone, and also can reduce costs and failure rates.

The application discloses a method and device for horizontal electroplating of a battery piece, wherein a flexible conductive piece is fixedly attached to an opening of a mask on a plated surface of the battery piece, so that an electrical connection is formed between the flexible conductive piece and the battery piece, and metal material can be electroplated in the opening of the mask on one side or two sides of the battery piece, thereby avoiding the problems of cracked or broken pieces caused by clamping of the battery piece by a hard conductive point in the prior art.

Forming plural bumps on a substrate in such a manner that the bumps have uniform heights. A plating apparatus for forming bumps on a substrate is provide. The plating apparatus comprises: a substrate holder constructed to hold the substrate; a plating tank constructed to store plating liquid and the substrate holder; an anode arranged in the inside of the plating tank in such a manner that the anode faces the substrate held by the substrate holder; an electric power source constructed to supply electric current flowing between the substrate and the anode; and a controller; wherein the controller is constructed to make the electric power source output electric current that comprises a first period during that positive-direction electric current is supplied for depositing metal on the substrate from the plating liquid, a second period during that at lest one reverse-current pulse, that flows in a direction opposite to a direction of the positive-direction electric current, is supplied, and a third period during that supplying of electric current is stopped, wherein the third period is a period in the middle of a transition from the reverse-current pulse to the positive-direction electric current.

The invention provides gold electroplating equipment. According to the gold electroplating equipment provided by the invention, the conductive panel is directly connected with the turnover assembly and the conductive column, so that the problems of short circuit and poor contact caused by impact between different plates and conductive tiles due to the fact that the conductive plates are arranged in a plurality of blocks and are electrically connected through rotation are solved. And when the body is turned out of the electroplating pool by the turnover mechanism, the ratchet wheel is clamped on the ratchet to fix the body and the turnover assembly, so that metal to be electroplated in the body is turned over. And in the process that the turnover mechanism immerses the body into the electroplating liquid, the ratchet wheel and the ratchets rotate freely, so that the at least two conductive columns are located at the lower half part of the body. Therefore, short circuit can be prevented, the electroplating effect of the bottom-sinking metal can be guaranteed, it can be guaranteed that electroplating liquid residues on the surface of other metal are minimum when the other metal is fished out, and the cleaning cost is reduced.

The invention belongs to the technical field of brush plating, and particularly relates to a brush plating method for preparing a CT slip ring copper ring surface plating layer or repairing a surface plating layer, in particular to a brush plating method suitable for preparing a CT slip ring copper ring surface plating layer or repairing a surface plating layer in high-end rotating equipment such as a medical CT machine and an industrial CT machine. The method comprises the following steps of CT slip ring preparation and surface finishing, CT slip ring electrocleaning treatment, stepped activation treatment, priming layer pre-plating, functional layer brush plating and aftertreatment, and compared with the prior art, the method has the advantages of being excellent in plating layer performance, high in process adaptability, controllable in plating layer quality, high in deposition speed, economical, environmentally friendly and wide in application prospect.

There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; and an intermediate mask placed between the substrate and the anode to be arranged on a substrate side, provided with a first center opening that causes an electric field from the anode toward the substrate to pass through, and further provided with an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening, wherein the auxiliary anode has an area that is not greater than ⅕ of an area of the anode.

The invention relates to the technical field of electroplating, in particular to a differentiated electroplating method and a hanger, and the method comprises the following steps: soaking a to-be-differentiated electroplating device and electroplating metal in an electrolyte, connecting the electroplating metal with a positive electrode of a power supply, and connecting the to-be-differentiated electroplating device with a negative electrode of the power supply to finish electroplating; the to-be-differentiated electroplating device comprises a first electroplating area and a second electroplating area; in the electroplating process, the current density of the first electroplating area is different from that of the second electroplating area; according to the differentiated electroplating method, differentiated electroplating is achieved by providing different current densities for different electroplating areas, and the differentiated electroplating method has the advantages of being easy to achieve, high in coating uniformity and high in yield.

To provide a workpiece holder that improves plating uniformity while overcoming the limitations of conventional workpiece frame holders for wet chemical processing including electric plating, protects fragile rectangular workpieces on all four edges, and enables a shield to be arranged within several mm on both faces of the workpiece.SOLUTION: An apparatus for loading and transport of fragile flexible workpieces for use in wet chemical semiconductor processing is described. A loader aligns a workpiece in a frame while maintaining minimal physical contact. A holder precisely positions at least two edges of the workpiece, while providing workpiece edge protection and straightening on the remaining two edges. The holder allows fluid processing of both faces of the workpiece while allowing a shield or agitation plate to be positioned close to the faces of the workpiece.SELECTED DRAWING: Figure 6

An electrochemical treatment electrode configured to contact an internal surface of metallic article with an electrochemical treatment fluid, the electrode comprising: a flexible conducting body; and a plurality of flexible elements connected to and extending generally outwardly of the flexible conducting body which are configured to locate an electrochemical treatment fluid around the flexible conducting body, wherein the plurality of flexible elements includes a plurality of conductive fibres or non-conductive fibres extending generally outwardly of the flexible conducting body, the plurality of conductive fibres or non-conductive fibres configured to contact the internal surface of the metallic article when the electrode is in use.

A plating apparatus capable of improving the uniformity of the thickness of a plating film formed on an object to be plated is proposed. The plating apparatus resistor is a plating apparatus resistor for adjusting an electric field, which is placed between an anode and a holder that holds an object to be plated in a plating apparatus, the plating apparatus resistor having a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the plating apparatus resistor further having an insert placed inside the body, the insert having a plurality of through holes, the insert being movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the body, and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the body.

The invention relates to a method for pretreating substrates containing copper and / or an alloy thereof, comprising at least a step 1) of bringing at least one surface of at least one substrate made of copper and / or at least one alloy thereof into contact at least partially with an aqueous composition and thereby forming a film at least partially on said surface, wherein the aqueous composition comprises, in addition to water, at least one of components a1) and a2), i.e. At least one of zirconium, titanium and hafnium cations in an amount in the range of 5 to 2000 mg / L as component a1), and / or at least one organosilane and / or a hydrolysis and / or condensation product thereof as component a2), the contacting step 1) being carried out in an electrolytic cell arrangement, wherein the substrate made of copper and / or an alloy thereof during the proceeding of step 1) is a cathode; a method of applying at least one coating film onto the surface of the pre-treated substrate; a substrate obtainable by one of these methods; a current collector, a conductor, a copper clad laminate, an anode material and a battery cell obtainable from the substrate; and the use of the aforementioned aqueous composition for the electrolytic formation of a film on a substrate made of copper and / or an alloy thereof.

The invention discloses a device for improving conductivity of clamps of horizontal pulse electroplating equipment, and belongs to the technical field of horizontal electroplating equipment.The device comprises a rotary table, a plurality of clamp bodies and a dust recycling mechanism, the clamp bodies are installed on the periphery of the rotary table, and a sliding block is installed on each clamp body; a copper cylinder guide rail used in cooperation with the sliding block is arranged on one side of the rotary disc, a corrosion-resistant heat-shrinkable sleeve is selected as a protective sleeve, physical isolation protection can be conducted on a wire, dust recycling mechanisms are installed at the two ends of the copper cylinder guide rail, dust in the copper cylinder guide rail is brought into the positions of the dust recycling mechanisms through the sliding block, and the dust recycling efficiency is improved. Collection and cleaning are carried out through the dust recovery mechanism, so that no obvious dust exists in the copper cylinder guide rail, the sliding block and the copper cylinder guide rail are in good contact, the current stability of the clamp body is guaranteed, meanwhile, the service time of the sliding block and the copper cylinder guide rail is prolonged, and the good effect of improving the conductivity of the horizontal pulse electroplating equipment clamp is achieved.

An example hydraulic system component (116, 118, 120) of a machine (100) includes a protective coating deposited by electroplating in a multi-anodic plating tool (200). The plating tool (200) allows for independent control of the anodic current, voltage, and / or waveform of each of the anodes (218) to provide a uniform, hard, and dense protective coating along a length of an elongated component, such as a rod (120), cylinder (116), or piston (118). The electroplating process may allow for independent control of rectifiers (122) providing power to the electrically isolated anodes (118) to achieve a high level of uniformity over the length of the components (116, 118, 120) being electroplated. The coating may include a layer of trivalent chromium electroplated over an electroplated layer of nickel to protect the component (116, 118, 120) from wear, oxidation, and / or corrosion. The bi-layer coating may be relatively thin, with a thickness less than 125 microns.