187results about "Current conducting devices" patented technology

An electroplating method and an electroplating apparatus, which relate to the technical field of semiconductor processing. The electroplating method comprises: S10, applying a positive voltage to an intermediate anode, and an edge electrode not operating; S20, acquiring a deposition rate v1 of a plating layer of an intermediate region, and acquiring a deposition rate v2 of a plating layer of an edge region; S30, determining the magnitudes of v1 and v2; S40, if v1 is greater than v2, applying the positive voltage to the edge electrode, and outputting a current I; S50, if v1 is less than v2, applying a negative voltage to the edge electrode, and outputting the current I; and S60, if v1 is equal to v2, keeping an operating state of the edge electrode unchanged. By means of respectively acquiring deposition rates of plating layers of an intermediate region and an edge region, and controlling the voltage and current of an edge electrode accordingly, the deposition rate of the edge region can be dynamically adjusted, such that the deposition rates of the edge region and the intermediate region can be balanced in real time, thereby improving the uniformity of electroplating.

The invention discloses a horizontal electroplating line capable of realizing single-side electroplating. The horizontal electroplating line comprises an annular driving device, an electroplating device, a multifunctional tank and a fixing device, a battery piece is arranged in the electroplating device, and the electroplating device is driven by the annular driving device to circularly move in the horizontal direction and lift in the vertical direction along the annular track on the fixing device; the multifunctional tank is mounted below the electroplating device and consists of a plurality of different functional tanks; the electroplating device moves up and down in each functional tank to realize electroplating treatment of the battery piece; the fixing device is installed below the annular driving device and used for fixing and connecting the whole annular line. The movement of the battery piece is realized through the electroplating device; through the design of a positive and negative air pressure annular sealing structure, the other surface is protected from being in contact with electroplating liquid while single-surface horizontal continuous electroplating is realized; and meanwhile, the fragment rate is reduced, and the electroplating efficiency is improved.

A method of making an electrical component includes transmitting electrical energy from a power source through one or more deposition anodes, through an electrolyte solution, and to an intralayer electrical-connection feature of a build plate, such that material is electrochemically deposited onto the intralayer electrical-connection feature and forms an interlayer electrical-connection feature. The method also includes securing a dielectric material so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature and contacts and at least partially electrically insulates the interlayer electrical-connection feature. The method additionally includes depositing a seed layer onto the dielectric material and the interlayer electrical-connection feature, electrochemically depositing material onto the seed layer, to form at least one second intralayer electrical-connection feature of the electrical component, and removing any one or more portions of the seed layer onto which no portion of the at least one second intralayer electrical-connection feature is formed.

The invention relates to a device (D) and an electrochemical surface treatment system for an internal surface of a longitudinal tubular element (T) made of electroconductive material, which device (D) comprises: a chassis assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means forming a sealed interface (4A, 4B) configured to cooperate removably with the tubular element (T) and with the anode, the means forming a sealed interface (4A, 4B) comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, in use, with a sealed longitudinal passage formed between the anode and the internal surface of the tubular element (T);and, means for rotating the tubular element (T) around its longitudinal axis (X0), characterized in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and that the device (D) further comprises means for tensing the anode configured to act on at least one of the two ends of the anode in order to prevent deflection of the anode. Figure to be published with the abbreviation: Figure 1.;

Uniformity of plating film thickness distribution is improved in a plating device that supplies power to only one of opposite edges of a substrate. An intermediate mask (30) includes a pair of first edge members (31) that oppose a power supply edge member of a substrate holder, a pair of second edge members (33) that oppose a non-power supply edge member of the substrate holder, a first electric field supply member (35) disposed at the first edge members (31), and a second electric field supply member (37) disposed at the second edge members (33). The first electric field supply member (35) is configured to extend along the first edge members (31) between a first position (PG-1) on an extension line of a first edge (30a-1) of a second central opening (30a) and a second position (PG-2) on an extension line of a second edge (30a-2) opposite the first edge (30a-1). The second electric field supply member (37) is configured to supply an electric field as a pair away from a third position (PG-3) on an extension line of a third edge (30a-3) of the second central opening (30a) and a fourth position (PG-4) on an extension line of a fourth edge (30a-4) opposite the third edge (30a-3).

An object of the present invention is to provide a method and system of electroplating using an anode that can be prepared relatively easily without the need for ancillary equipment or anolyte management, and without the need for expensive metals or special metals. The present invention relates to a method of electroplating an article with metal, the method comprising the steps of: allowing a current to flow in a plating bath containing ions of the metal and an organic compound additive, wherein the plating bath comprises the article as a cathode and a conductive base material as an anode, a part of a surface of the conductive base material is covered with an insulating material, and a remaining part is exposed, and a current flowing portion is dispersedly present in the anode.

The invention relates to a device (D) and a system for the electrochemical surface treatment of the inner surface of a longitudinal tubular member (T) made of an electrically conductive material, the device (D) comprising: a frame assembly (1); at least one cathode (2) configured to be electrically connected to the tubular member (T); a longitudinal anode (3) configured to be coaxially arranged inside the tubular member (T); a sealed interface mechanism (4A, 4B) configured to removably mate with the tubular member (T) and the anode (3), said sealed interface mechanism (4A, 4B) comprising at least first and second inlet / outlet ends for connecting a source of treatment fluid and adapted, in use, to communicate with a sealed longitudinal passage (7) formed between the anode (3) and the inner surface of the tubular member (T); and a mechanism (5) for driving the tubular member (T) in rotation about the longitudinal axis (X0); characterised in that said frame assembly (1) is adapted to support the tubular member (T) in a non-vertical orientation, and in that the device (D) further comprises means for pulling the anode under traction configured to act on at least one of the two ends of the anode (3) to prevent it from flexing.

Electroplating systems may include an electroplating chamber. These systems may also include a replenishment assembly coupled to the electroplating chamber fluid. The replenishment assembly may include a first compartment containing an anode material. The first compartment may include a first compartment section containing the anode material and a second compartment section separated from the first compartment section by a spacer. The replenishment assembly may include a second compartment coupled to the electroplating chamber fluid and electrically coupled to the first compartment. The replenishment assembly may also include a third compartment electrically coupled to the second compartment, the third compartment including an inert cathode.

The invention provides an electroplating device which comprises an electroplating cavity used for containing electroplating liquid; the anode is positioned in the electroplating cavity; the substrate holding device is used for clamping the substrate and immersing the plating surface of the substrate into the electroplating liquid during electroplating; the substrate extension assembly comprises an extension cavity, an extension cathode and a diaphragm, the extension cathode is located in the extension cavity and is biased by the cathode, and the diaphragm is used for isolating the extension cathode from the electroplating cavity; wherein the extension cavity is provided with a drainage part facing the anode, the drainage part is provided with an opening, and during electroplating, the drainage part is located below the substrate, surrounds the radial outer side of the substrate, is parallel to the plating surface of the substrate and is used for enabling current from the anode to partially flow to the extension cathode through the drainage part; and the drainage part forms an extending plating surface on the radial outer side of the substrate. According to the electroplating device, the negative influence of the edge effect on the substrate is effectively inhibited or even eliminated.

An electroplating apparatus for a non-circular substrate, comprising: a central electrode region, which is circular, wherein the size of the central electrode region is an inscribed circle of a non-circular substrate, a central electrode is provided in the central electrode region, and the central electrode region is filled with the central electrode; a peripheral electrode region, which is arranged to surround the central electrode region, wherein the peripheral size of the peripheral electrode region is a circumscribed circle of the non-circular substrate, a peripheral electrode is arranged in the peripheral electrode region, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode region; a power source module, which comprises a plurality of power sources for supplying power to the central electrode and the peripheral electrode; and a control module, which is configured to detect a rotation position of the substrate, calculate the amplitude of a current required by each current block electrode at present, and feed back the amplitude of the current to the power source module so as to adjust the amplitude of the current.

A plating apparatus (10) is disclosed including a plating tank (9), cathodes (1a to 1f), a holding mechanism (2), at least one anode (3), and a rotation mechanism (4). The plating tank (9) contains an annularly or helically wound substrate (90) together with a plating solution. The cathodes (1a to 1f) are placed inside the plating tank (9). The holding mechanism (2) holds the cathodes (1a to 1f) at positions electrically connected to the outer periphery of the substrate (90) and holds the substrate (90) via the cathodes (1a to 1f). The anode (3) is placed at least on the inner periphery side of the substrate (90) held by the holding mechanism (2). The rotation mechanism (4) rotates at least either the substrate (90) and cathodes (1a to 1f) held by the holding mechanism (2) or the anode (3), or both, around the axis of the wound substrate (90).

The invention provides a device and method for restraining plate stamping interface failure through pulse current regulation and control, and the system comprises a plate stamping module which is used for carrying out the stamping forming of a plate; the plurality of electrode clamps are detachably connected with the plate respectively, and electrodes are arranged on the electrode clamps; the current box is electrically connected with the electrode; the thermocouple is electrically connected with the current box and is used for acquiring temperature data of the plate; the ultrasonic emission sensor is electrically connected with the current box and is used for acquiring ultrasonic signal intensity data; the current box is configured to apply a heating current to the plated plate according to the temperature data, apply a preset high-strength low-frequency current to the plated plate after the temperature data reaches a target temperature, apply a low-strength high-frequency current to the plated plate when the ultrasonic signal strength reaches a preset strength in the punch forming process, continuously increase the density of the low-strength high-frequency current, and perform punch forming on the plated plate; the ultrasonic signal intensity is not increased any more. Therefore, the forming performance can be improved by introducing the high-strength low-frequency composite low-strength high-frequency pulse current.

This invention discloses a water bath tank body, in which copper guide rails are arranged inside. The length direction of the copper guide rails is parallel to the length direction of the water bath tank body. A water bath liquid inlet pipe is fixedly connected to the side of the water bath tank body. There are several copper guide rails, which are distributed in a stepped manner, with the copper guide rails on the side closer to the water bath liquid inlet pipe having the highest height. Filler blocks are fixedly connected or integrally formed between the copper guide rails. This invention has a high water bath liquid utilization rate, and the contact pads of the conductive brush and the copper guide rails are submerged below the water bath liquid. This satisfies the stepped water bath conductivity method for electroplating, avoids sparks generated by the conductive brush during movement, and ensures safe production.

The invention relates to a device (D) and a system for electrochemical surface treatment of an inner surface of a longitudinal tubular element (T) made of electrically conductive material, the device (D) comprising: a frame assembly (1); at least one cathode (2) configured to be electrically connected to the tubular element (T); a longitudinal anode configured to be placed coaxially inside the tubular element (T); means (4A, 4B) forming a sealed interface configured to removably cooperate with the tubular element (T) and with the anode, the means (4A, 4B) forming a sealed interface comprising at least first and second inlet / outlet ports intended to be connected to a source of treatment liquid and capable of communicating, when in use, with a sealed longitudinal passage that is formed between the anode and the inner surface of the tubular element (T); and means (5) for rotating the tubular element (T) about its longitudinal axis (X0), characterised in that the frame assembly (1) is capable of supporting the tubular element (T) in a non-vertical orientation and in that the device (D) further comprises means for pulling the anode that are configured to act on at least one of the two ends of the anode in order to prevent the anode from bending.

To provide a lipseal for use in a lipseal assembly of an electroplating clamshell which engages with a semiconductor substrate and supplies electrical current to the semiconductor substrate during electroplating, and a method of electroplating the semiconductor substrate using the lipseal.SOLUTION: A lipseal 212 includes an elastomeric body having an outer portion configured to engage with a cup 201 of the lipseal assembly and an inner portion configured to engage with a peripheral region of the semiconductor substrate. The inner portion includes a protrusion having a width in a radial direction sufficient to provide a contact area with the semiconductor substrate which inhibits diffusion of acid in an electroplating solution used during the electroplating. The protrusion is located at an inner periphery of the lipseal.SELECTED DRAWING: Figure 2

A catalyst electrode according to an embodiment of the present disclosure includes a metal layer; and a catalyst layer formed on the metal layer, wherein the catalyst layer includes iridium and palladium.

The application relates to a laser-assisted micro-anode local area electro-deposition additive manufacturing device and method, and belongs to the technical field of additive manufacturing and local area electro-deposition. A support is fixed on a base, a screw rod device is installed above the support and is connected with an xy-axis moving device, a z-axis moving device is installed on the xy-axis moving device, a micro-anode device is connected to the z-axis moving device, a printing chamber is installed on an adjustable support and can move along the z-axis, a light modulation device is installed on an adjustable frame and can move along the z-axis, and the adjustable frame and a laser are fixed on the base. The method combines laser modulation technology and electrochemical deposition technology, uses laser modulation to generate patterned light to generate a virtual electrode for local area electro-deposition, greatly improves printing resolution and part performance, further improves printing precision, avoids the generation of thermal residual stress in the metal part, the performance of the part is more superior, and the method is used for micron-level metal part manufacturing.

The present invention provides a water-sealed conductive clamp, which at least includes a first clamp arm, a second clamp arm, a first soft seal, a second soft seal, a liquid supply assembly and a plurality of hard protective covers. The facing sides of the first and second clamp arms respectively have a first and a second protrusion corresponding to the position of the clamping surface, and the first clamp arm has an opening penetrating the first clamp arm above the first protrusion. The liquid supply assembly is connected to the opening in the first clamp arm to infuse liquid into the space between the first and second clamp arms. The first soft seal has a first opening whose position matches the first protrusion and the opening, and a plurality of first idle openings respectively located on both sides of the first opening. The second soft seal has a second opening whose position matches the second protrusion, and a plurality of second idle openings respectively located on both sides of the second opening. The hard protective cover covers the surfaces of the first and second clamp arms.

The present invention provides a plating device capable of improving the uniformity of the thickness of a plated film formed on a plated object. The device-use resistor is a plating device-use resistor for adjusting the electric field, disposed between an anode and a holder holding the plated object in the plating device. The plating device-use resistor comprises a plate-shaped main body having an upper surface, a lower surface, and a plurality of through-holes connecting the upper surface and the lower surface. The plating device-use resistor further comprises an insert disposed within the main body, the insert having a plurality of through-holes, and the insert being movable between a first position in which the plurality of through-holes of the insert communicate with the plurality of through-holes of the main body, and a second position in which the plurality of through-holes of the insert are not connected with the plurality of through-holes of the main body.

The electroplating equipment comprises a plurality of electroplating baths and a water blocking device, a plurality of electroplating inner baths and an electrolytic bath are arranged in the electroplating baths, feeding ports are formed in one sides of the electroplating inner baths respectively, the electroplating inner baths and the electrolytic bath are located on the same horizontal plane, and a driving device is arranged on the side face of each electroplating inner bath. The driving device is connected with the conveying rollers and the conductive rollers, the conveying rollers and the conductive rollers are arranged in pairs, the conveying rollers are arranged in the electrolysis inner tanks, the water blocking device and the conductive rollers are arranged between the adjacent electrolysis inner tanks, and anode titanium meshes are symmetrically arranged on the upper side and the lower side of the electroplating inner tank and are arranged on the upper side and the lower side of the conveying rollers at equal intervals. Upper and lower layers of anodes are adopted, so that double-sided electroplating can be performed; groove type soaking is adopted, an electroplating sheet is in direct contact with electroplating liquid, ion supplementation is fast, and the concentration difference caused by electroplating precipitation can be supplemented in time; the anode titanium mesh directly faces the electroplating sheet, the electric field directly acts on the electroplating sheet, and the electric power utilization rate is high.

The present invention relates to a method for pretreatment of substrates containing copper and / or alloys thereof, the method comprising at least step 1), namely contacting at least one surface of the at least one substrate, said surface being made of copper and / or at least one alloy thereof, at least in portion with an aqueous composition and thereby forming a film at least in portion on said surface, wherein the aqueous composition comprises, besides water, at least one of constituents a1) and a2), namely at least one of zirconium, titanium and hafnium cations as constituent(s) a1) in an amount in a range of from 5 to 2000 mg / L, and / or at least one organosilane and / or a hydrolysis and / or condensation product thereof as constituent(s) a2), wherein contacting step 1) is performed in an electrolytic cell arrangement with the substrate made of copper and / or alloys thereof being the cathode during performance of step 1), a method of applying at least one coating film onto the surface of the pretreated substrate, a substrate obtainable by one of these methods, current collectors, conductors, copper clad laminates, anode materials and battery cells obtainable therefrom, and to a use of aforementioned aqueous composition for electrolytically forming films on substrates made of copper and / or alloys thereof.

Foil forming device (1) for forming a metal foil (M), comprising: an anode (2); a solid electrolyte membrane (6) arranged between the anode (2) and a substrate serving as a cathode (4); a current supply device (8) which applies a voltage between the anode (2) and the cathode (4); a solution container (12) containing a solution (L) between the anode (2) and the solid electrolyte membrane (6), the solution (L) containing metal ions; and a pressure device (30b) which pressurizes the solid electrolyte membrane (6) towards the cathode side with a fluid pressure of the solution (L), wherein a metal foil (M) is formed on a foil forming region by applying the voltage while the foil forming region is pressurized on a surface of the substrate (4r) through the solid electrolyte membrane (6) to deposit the metal ions contained in the solid electrolyte membrane (6), and wherein the film forming apparatus (1) further includes an auxiliary cathode (14) arranged in a peripheral region of the film forming region when the surface of the substrate (4s) is viewed in plan view, wherein an electric potential of the auxiliary cathode (14) is lower than an electric potential of the anode (2), wherein when the distance from the center (Q) to the outer periphery (B) of the film forming region (4r) on the surface (4s) of the substrate is set to 1 as a standard value of a relative value, a relative value of the distance from the center (P) to the outer circumference (A) on the surface (2s) of the anode (2) is 0.95 to 1.09, a relative value of the distance from the outer circumference (B) of the film forming region (4r) to the inner circumference (C) of the surface (14s) of the auxiliary cathode (14) is 0 to 0.2, a relative value of the distance from the inner periphery (C) to the outer periphery (D) on the surface (14s) of the auxiliary cathode (14) is 0.05 to 0.17, and a relative value of the distance from the center (P) on the surface (2s) of the anode (2) to the center (Q) of the film forming region (4r) is 0.15 to 0.32.

To provide a catalyst electrode and a method for manufacturing a catalyst electrode.SOLUTION: A catalyst electrode according to an embodiment of the present disclosure includes: a metal layer; and a catalyst layer formed on the metal layer, wherein the catalyst layer includes iridium and palladium.SELECTED DRAWING: Figure 1

The circular current-sharing type titanium electrode conductive connection structure comprises a conductive connection frame, a plurality of U-shaped connection frames arranged on the conductive connection frame, a first annular clamping seat and a second annular clamping seat, wherein the first annular clamping seat and the second annular clamping seat are arranged at the two ends of the U-shaped connection frames respectively and are used for carrying out limiting connection on a titanium electrode body; wherein the first annular clamping seat and the second annular clamping seat have the same structure; adjusting bases for adjusting the distance between the first annular clamping base and the second annular clamping base are arranged at the two ends of the U-shaped connecting frame. The positions, relative to the U-shaped connecting frames, of the different conductive connecting frames are adjusted, so that the vertical distance between the different U-shaped connecting frames is adjusted, and the distance between the different titanium electrode bodies clamped and installed on the U-shaped connecting frames is adjusted; besides, the expansion head of the annular clamping seat in the adjusting seat is adjusted through the adjusting screw rod in the adjusting seat, so that the coaxiality between different layers of titanium electrode bodies is kept.

Methods and apparatus for electroplating metal onto a substrate are provided herein. For example, such an electrodeposition apparatus may include: (a) a plating chamber configured to contain an electrolyte and an anode while plating a metal onto a substrate; (b) a substrate holder configured to hold the substrate and maintain a separation between a plating surface of the substrate and the anode during electroplating; and (c) an ionically resistive ionically permeable element comprising a substrate facing surface and an opposing surface wherein the ionically resistive ionically permeable element allows a flow of an ionic current through the ionically resistive ionically permeable element toward the substrate during electroplating, and wherein the ionically resistive ionically permeable element and the substrate holder are configured to cooperate with each other and rotate together relative to the plating chamber.

A metallic seed layer may be deposited on a top surface of a wafer. The wafer may be mounted on a wafer holder using a wafer clamp assembly. The wafer clamp assembly includes a wafer clamp frame, a dielectric seal ring, and a proximity mask. An electroplating process may be performed in an electroplating bath while the wafer holder and the wafer are immersed in an electroplating solution. Electrical field within a predominant fraction of an entire volume of an annular region between an annular backside surface of the proximity mask and the wafer has a distribution of a tilt angle relative to the axial direction that is greater than arctangent (0.1).

The method of manufacturing a copper foil with a high elongation rate includes: preparing a plating solution by mixing a copper ion, an additive for improving conductivity, a plating inhibitor, and a plating accelerator; and manufacturing the copper foil by immersing a substrate in the plating solution and applying an electric current to the plating solution to electroplate the copper foil on a surface of the substrate.

An electroplating fluid disturbance device is used in electroplating equipment. The electroplating fluid disturbance device includes two horizontal driving devices, two fan blade structures and two fan blade structure driving devices. Each horizontal driving device connects one fan blade structure, allowing each fan blade structure to move toward or away from two surfaces of a plated substrate. Each fan blade structure driving device connects one fan blade structure, allowing each fan blade structure to move back-and-forth in a specific direction perpendicular to a surface normal of the plated substrate and the height of electroplating equipment. An included angle between 10 degrees and 50 degrees is disposed between a direction along which the width of a left fan blade or a right fan blade of the fan blade structure is extended and a direction along which the width of a central fan blade of the fan blade structure is extended.

Provided is a technique capable of achieving uniform film thickness. The plating method includes a supply process (S5) of supplying a substrate to a plating bath in which an anode and an intermediate member are disposed. The substrate is supplied to a location where it does not contact the intermediate member. The substrate has a pattern formation region in which a plurality of patterns are formed, the contour shape of the pattern formation region is non-circular, and the intermediate member has, in a plan view, a hole formation region in which a plurality of holes through which the plating solution can pass are formed, and an electric field shielding region disposed around the hole formation region. The contour shape of the hole formation region corresponds to the contour shape of the pattern formation region. The supply process, an alignment process (S10) of adjusting the position of the substrate so that the contour shape of the pattern formation region and the contour shape of the hole formation region are spatially aligned, and a first energization process (S20) of energizing the anode and the substrate while causing the substrate to perform a rocking rotational motion.

Provided is a plating apparatus which is capable of improving the uniformity of the thickness of a plating film that is formed on an object to be plated.　Also provided is a resistor for electric field adjustment for a plating apparatus, the resistor for a plating apparatus being disposed between an anode and a holder for holding an object to be plated in a plating apparatus. The resistor for a plating apparatus has a plate-like main body. The plate-like main body has an upper surface, a lower surface, and a plurality of through holes with which the upper surface and the lower surface are in communication with each other. The resistor for a plating apparatus additionally has an insertion body that is disposed inside the main body. The insertion body has a plurality of through holes, and the insertion body is movable between a first position at which the plurality of through holes of the insertion body are in communication with the plurality of through holes of the main body and a second position at which the plurality of through holes of the insertion body are not in communication with the plurality of through holes of the main body.