Pattern transfer by solid state electrochemical stamping

a solid state electrochemical and pattern transfer technology, applied in the direction of contacting devices, manufacturing tools, instruments, etc., can solve the problems of not being fully adaptable to massive manufacturing, liquid electrolyte, and difficulty in handling, etc., to achieve high throughput patterning, excellent reproducibility, and high throughput patterning.
US20070215480A1Inactive Publication Date: 2007-09-20THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS
Publication Date
2007-09-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides an electrochemical fabrication platform for making structures, arrays of structures and functional devices having selected nanosized and / or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components of the present invention use an electrochemical stamping tool for generating patterns of relief and / or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools of the present invention are capable high throughput patterning of large substrate areas and, thus, enable a robust and commercially attractive manufacturing pathway to a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices and integrated electronic circuits.
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Description

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

[0001] This invention was made, at least in part, with United States governmental support awarded by National Science Foundation under contract number DMI-0328162. The United States government has certain rights in this invention.CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] Not Applicable. BACKGROUND OF THE INVENTION

[0003] The use of solid state ionic conductors allows for nano-scale patterning and stamping by highly localized electrochemical etching and deposition. When an electric field is applied by two electrodes in contact with a material that exhibits ionic conduction, the metal ions near one of the electrodes migrate through the bulk of the ionic conductor, and, upon receiving electrons at the counter electrode, reduce back to metal atoms precipitating at the interface. Alternatively, under a reverse potential, a counter electrode of the metal is etched. By nano-patterning the contact between the electrode and...

Claims

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