Pattern transfer by solid state electrochemical stamping

a solid state electrochemical and pattern transfer technology, applied in the direction of contacting devices, manufacturing tools, instruments, etc., can solve the problems of not being fully adaptable to massive manufacturing, liquid electrolyte, and difficulty in handling, etc., to achieve high throughput patterning, excellent reproducibility, and high throughput patterning.

Inactive Publication Date: 2007-09-20
THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS
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  • Abstract
  • Description
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  • Application Information

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Benefits of technology

[0010] The present invention provides an electrochemical fabrication platform for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components of the present invention use an electrochemical stamping tool for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal layers. Electrochemical stamping tools of the present invention ar...

Problems solved by technology

However, a liquid electrolyte, which is difficult to handle, is required as a conducting medium between the two elect...

Method used

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  • Pattern transfer by solid state electrochemical stamping
  • Pattern transfer by solid state electrochemical stamping
  • Pattern transfer by solid state electrochemical stamping

Examples

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example 1

Reprogrammable Patterning of Functional Nanostructures Using Superionic Conduction

[0081] Reprogrammable and reconfigurable active nanostructures and processes influence the functional materials and devices to obtain enhanced energy conversion and chemical sensing. These experiments address outstanding issues in molecular-scale nanofabrication with superionic conduction by: (1) Addressing and explaining the underlying mechanisms of nanoscale charge, mass and energy transport, and reaction kinetics involved in nanostructure formation as a result of ionic conduction in solids; (2) Identifying the factors controlling growth rate and shape fidelity in the grown structures and exploiting this knowledge to develop a highly scalable and reprogrammable, in-parallel transfer stamping process; (3) Exploiting the new capability of programmable and reconfigurable patterning of nanostructures to actively regulate ionic transport and electron flow towards enhanced energy conversion and chemical s...

example 2

Direct Nanopatterning with Solid Ionic Stamping

[0100]FIG. 15A is an SEM image of an Ag2S solid state ionic conductor stamp used for electrochemical stamping and FIG. 15B an SEM image of the corresponding pattern etched in Ag metal.

[0101] This example discloses an embodiment for generating sub-hundred nanometer features that integrates and extends the concepts of nanoimprint lithography and electrochemical micromachining. Realized by the mass transport property of solid-state ionic conductors and their dimensional integrity, this technique provides simplicity and high throughput of single-step pattern generation while keeping high feature resolution and reproducibility. In an embodiment, the solid-state ionic conductor is silver sulfide and is made into a stamping tool on which calibration features are defined to verify the lateral resolution capabilities of this technique. Stamping is achieved under various driving potentials and sub-hundred-nanometer lateral resolution is obtaine...

example 3

Electrochemical Stamping

[0123] The invention disclosed herein provides a unique and new capability to pattern metals with sub-100 nm resolution in a high-through put stamping process. For example, FIG. 22 shows arrays of patterns can be etched in metal. Depending on manufacturing considerations, such a 5×5 array may be created using single step electrochemical stamping, or alternatively, the metal may be repeatedly stamped to obtain the array. FIG. 23 shows the stamps of the present invention provide structures having sub-100 nm resolution. For example, multiple distinct lines or channels are generated that are separated by 50 nm and the lateral resolution is 60 nm. In an embodiment, the process is a solid-state, room temperature process that is highly compatible with a large variety of process technologies. Although the examples provided herein utilize silver, different ionic crystals for other materials, including but not limited to copper, and gold, can be similarly used, to obt...

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Abstract

The present invention provides an electrochemical fabrication platform for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components of the present invention use an electrochemical stamping tool for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools of the present invention are capable high throughput patterning of large substrate areas and, thus, enable a robust and commercially attractive manufacturing pathway to a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices and integrated electronic circuits.

Description

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0001] This invention was made, at least in part, with United States governmental support awarded by National Science Foundation under contract number DMI-0328162. The United States government has certain rights in this invention.CROSS-REFERENCE TO RELATED APPLICATIONS [0002] Not Applicable. BACKGROUND OF THE INVENTION [0003] The use of solid state ionic conductors allows for nano-scale patterning and stamping by highly localized electrochemical etching and deposition. When an electric field is applied by two electrodes in contact with a material that exhibits ionic conduction, the metal ions near one of the electrodes migrate through the bulk of the ionic conductor, and, upon receiving electrons at the counter electrode, reduce back to metal atoms precipitating at the interface. Alternatively, under a reverse potential, a counter electrode of the metal is etched. By nano-patterning the contact between the electrode and...

Claims

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Application Information

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IPC IPC(8): C25D5/02
CPCB23H3/00B23H3/04B81C1/0046B81C2201/0154B82Y30/00C25D17/005C25F3/14G01Q80/00H01L21/32134C25D17/002C25D17/007C25D5/02
Inventor FANG, NICHOLAS X.FERREIRA, PLACID M.HSU, KENG HAORAPAKA, VENKATA K.
Owner THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS
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