77results about "Contacting devices" patented technology

A workpiece holder and an apparatus for loading workpieces onto the holder for use in wet chemical semiconductor processing is described. The workpiece holder comprises two perimeter seal plates, electrical contact inserts and a locking plate. The perimeter seal plates provide force for both fluid sealing and electrical contact when the locking plate is in a locked position. The locking plate also functions as an electrical bus to provide current to the electrical contact inserts. The workpiece loader comprises a stage to insert or remove a workpiece from the workpiece holder. The loader also comprises vacuum chucks to position the perimeter seal plates prior to loading and to compress the perimeter seal plates during locking and unlocking.

The invention discloses a horizontal electroplating line capable of realizing single-side electroplating. The horizontal electroplating line comprises an annular driving device, an electroplating device, a multifunctional tank and a fixing device, a battery piece is arranged in the electroplating device, and the electroplating device is driven by the annular driving device to circularly move in the horizontal direction and lift in the vertical direction along the annular track on the fixing device; the multifunctional tank is mounted below the electroplating device and consists of a plurality of different functional tanks; the electroplating device moves up and down in each functional tank to realize electroplating treatment of the battery piece; the fixing device is installed below the annular driving device and used for fixing and connecting the whole annular line. The movement of the battery piece is realized through the electroplating device; through the design of a positive and negative air pressure annular sealing structure, the other surface is protected from being in contact with electroplating liquid while single-surface horizontal continuous electroplating is realized; and meanwhile, the fragment rate is reduced, and the electroplating efficiency is improved.

A head unit for electrochemical treatment of a surface including a handle having an output tube and a vacuum tube. The output tube and the vacuum tube configured to couple the handle to a portable cart. The head unit including a body coupled to the handle and an electrode disposed within the body and coupled to the output tube and the vacuum tube. The electrode including a plurality of output channels for outputting an electrochemical solution and a plurality of vacuum channels for vacuuming the electrochemical solution outputted from the plurality of output channels. Each of the plurality of output channels is disposed proximate to at least one of the plurality of vacuum channels and the electrode is fluidly coupled to the output tube to receive the electrochemical solution from the output tube.

A handheld reactive electrochemical application system is provided. The handheld reactive electrochemical application system includes a power supply configured to be electrically coupled to a substrate and a hydrogel electrically coupled to the power supply. The hydrogel includes a reactive chemical solution. The hydrogel is configured to contact the substrate, the power supply is configured to pass a current through the hydrogel and the substrate, and the reactive chemical solution is configured to treat the substrate when the current is passed through the hydrogel and the substrate.

The present disclosure relates to an electroplating system including a first contact detection sensor and a second contact detection sensor disposed at a surface of a cone of the electroplating system. The first contact detection sensor detects a first resistance at a first contact between a substrate to be plated by the electroplating system and a first contact pin, the second contact detection sensor detects a second resistance at a second contact between the substrate and a second contact pin. A controller receives the first resistance and the second resistance, and determines the first contact and the second contact are not properly formed when a difference between the first resistance and the second resistance is not within a first predetermined resistance range, or the first resistance or the second resistance is not within a second predetermined resistance range.

Provided is a substrate holder for plating on a surface of a substrate, provided with an electrical contact that is easy to replace. A substrate holder 1 includes: a first holding member 2; a second holding member 3 that has an opening portion 3a for exposing the surface of a substrate W and holds the substrate W in a sandwiched manner with the first holding member 2; a plurality of engaging shaft portions 36 each having a head portion 36b in an expanded head shape at a tip end portion, provided in a circumferential direction of the second holding member 3; and an electrical contact 32 having a contact portion 32a to be in contact with an edge portion of the substrate W, and having an engagement reception portion 32b in a notch shape to be engaged with the adjacent engaging shaft portion 36 for arrangement along a circumference of the opening portion 3a of the second holding member 3.

The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.

A cup-type chuck for a substrate holding device is disclosed. The cup-type chuck includes an inner pressure ring, a middle frame, a seal portion, an outer pressure ring, and a contact ring. The inner pressure ring is fixed to the inner peripheral surface of the middle frame. The seal portion has an outer end, a bottom, and an inner end. The outer end of the seal portion covers at least a portion of the outer peripheral surface of the middle frame. The bottom of the seal portion covers the bottom of the middle frame and is exposed to the outside of the cup-type chuck. The inner end of the seal portion covers at least a portion of the inner peripheral surface of the middle frame and is pressed between the inner pressure ring and the middle frame by the inner pressure ring. The outer pressure ring is made of an insulating material and fixed to the outer peripheral surface of the middle frame, and the outer end of the seal portion is pressed between the outer pressure ring and the middle frame by the outer pressure ring. The contact ring is located above the seal portion and is pressed between the inner pressure ring and the middle frame, with the seal ring being disposed between the inner pressure ring and the contact ring.

The present invention disclosed an electroplating apparatus for non-circular substrate, comprising a central electrode area, a peripheral electrode area, a power supply unit and a control device. The size of the central electrode area is the inscribed circle of the non-circular substrate, and the central electrode is arranged in the central electrode area. The peripheral electrode area surrounds the central electrode area. The peripheral size of the peripheral electrode area is the circumscribed circle of the non-circular substrate. The peripheral electrode area is provided with closely arranged point electrodes, and the point electrodes fill the peripheral electrode area. The power supply unit supply power to the central electrode and the point electrodes. The control device is connected between the power supply unit, the central electrode and the point electrodes and controls the on-off of the central electrode and the point electrodes. The control device tracks the rotating position of the substrate, so that the electrodes in the central electrode area and the peripheral electrode area covered by the substrate will be turned on and the electrodes not covered by the substrate will be turned off. The present invention also disclosed an electroplating method for the non-circular substrate.

The present invention provides an anode for electroplating, which does not require an auxiliary device and an anode liquid management, and can be easily manufactured without using expensive metals and special metals. The present invention relates to an anode for electroplating, comprising: an input portion for inputting electric power from a power source; a pair of support portions extending in a first direction, arranged at intervals from each other in a second direction intersecting the first direction, receiving supply of electric power from the input portion, and covered with an insulating material at a liquid-contacting portion with a plating liquid; and a current-carrying portion extending in the second direction, one end of which is connected to one of the pair of support portions, the other end of which is connected to the other of the pair of support portions, and receiving supply of electric power from the pair of support portions; the current-carrying portion having a plurality of current paths arranged at intervals from each other in the first direction, and a cross-sectional area of the current-carrying portion being smaller than a cross-sectional area of the support portions.

Embodiments disclosed herein relate to electroplating apparatuses used for components in semiconductor processing chambers. In one embodiment, an electroplating device is provided. The electroplating device includes a housing including a first surface and a second surface and a plurality of holes disposed in the housing. The plurality of holes extend from the first surface to the second surface, and are configured to hold a component to be electroplated. The electroplating device further includes a gas inlet connected to an air bladder. The air bladder is disposed between the plurality of holes. The air bladder is configured to cover an outer surface of the component to be electroplated. The electroplating device further includes a cathode connector disposed below the first surface, and a cathode insert connected to the cathode connector. The cathode insert is connected to the plurality of holes and is configured to electrically charge the component.

This disclosure provides a method and system for improving the uniformity of wafer coating. The method includes: providing a coating apparatus; providing a wafer, the coating apparatus being used to coat the wafer; monitoring the current in different regions of the wafer surface during the coating process; inspecting the coating apparatus when the difference in current between different regions of the wafer surface exceeds a preset difference; and cleaning the coating apparatus when there are deposits on it. This technical solution, by monitoring the current in different regions of the wafer surface during the coating process, can promptly detect areas of uneven coating on the wafer surface; inspecting the coating apparatus when the difference in current between different regions of the wafer surface exceeds a preset difference to identify components requiring maintenance; and cleaning the coating apparatus when there are deposits, thereby improving the uniformity of the wafer coating.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

The invention provides a self-circulation cleaning conductive sliding contact group device. The self-circulation cleaning conductive sliding contact group device comprises a sealing mechanism, a stator mechanism, a rotor mechanism and a heat-conducting scrap-removing mechanism, the stator mechanism and the rotor mechanism are arranged in the sealing mechanism, and the stator mechanism surrounds the rotor mechanism; the rotor mechanism comprises a screw rod and a red copper ring, the screw rod penetrates through two ends of the sealing mechanism, and the red copper ring is nested on the screw rod; the stator mechanism comprises an electric contact and a conductive copper plate, one end of the electric contact is fixed on the conductive copper plate, and the other end of the electric contact abuts against the surface of the red copper ring; and the heat-conducting scrap-removing mechanism is connected with the sealing mechanism to form an outer circulating cooling loop for driving scraps on the surface of the electrical contact to be quickly discharged. The external circulation cooling loop is additionally arranged, so that powder scraps caused by sliding contact interface abrasion are rapidly taken away, the stability of the conductive slip ring is improved, the service life of the conductive slip ring is prolonged, resistance heat generated by the electric contact and the red copper ring is rapidly cooled, and the temperature of the slip ring is effectively kept constant and not hot in the operation process.

The present disclosure provides a substrate holder including a centering pin that does not push a substrate any farther toward the center than a designed position, even if a first holding member deviates from the designed position relative to a second holding member, when positioning the substrate. The substrate holder according to the present disclosure includes the first holding member and the second holding member. The second holding member includes a positioning member for positioning the substrate at a predetermined position, and a stopper. The positioning member includes the centering pin movable between a first position and a second position, and is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts a peripheral edge of the substrate to position the substrate at the predetermined position. The first holding member includes a driving member configured to bias the centering pin toward the first position, when the first holding member and the second holding member hold the substrate. The stopper is configured to contact the centering pin to stop the centering pin at the first position.

A structure and method for chrome plating plastic parts aimed at reducing the variation in metal thickness across all areas of the part during chrome plating. This is achieved through the use of a specially designed support device that allows for the reduction of excess metal in chrome-plated plastic parts.

The invention relates to a device (100) and a method for forming a via in a layered substrate (101) having a through-hole (102) which is closed on a first face (101a) of the substrate (101) by means of a metal layer (103) and exits the substrate on a second face (101b) of the substrate (100). A metal is deposited in the through-hole (102) by means of electrochemical deposition. The device comprises a support (106) for receiving and positioning the substrate (101), an electrical contact for electrically contacting the metal layer (106), a metallization container (108) which can be filled with an electrolyte, and an anode (109) which is immersed in the electrolyte during the deposition process. The support (106) is preferably part of the metallization container (108) and / or is designed and / or positioned in such a way that the layered substrate (101) forms a boundary of the metallization container (108). In a first variant, the device is designed in such a way that only the second face (101b) of the substrate (100) comes into contact with the electrolyte during the deposition process. In a second variant, the support (106) is designed and / or positioned in such a way that the inserted substrate (100) forms a boundary of the metallization container (108). In a third variant, the support (106) is electrically conductive and serves as the electrical contact for electrically contacting the metal layer (103), or the electrical contact is integrated into the support (106) or is fixed to the support (106). In a fourth variant, an ultrasound generator (110) is provided on the first face (101a) of the substrate (101) and applies ultrasound to the substrate (101) during the deposition process. In a fifth variant, the device comprises a stationary sub-element (116) and a movable sub-element (115).

This invention discloses a formation electrode separator plate for improving the uniformity of oxide films on electrode foils, relating to the field of anodizing technology. The formation electrode separator plate includes a main support plate, multiple conductive partition modules, a current balancing unit, an elastic conductive contact layer, a layered composite liquid channel, and an adjustable clamping mechanism. The design of the conductive partition modules and the current balancing unit achieves uniform current density distribution; the elastic conductive layer effectively reduces contact resistance and accommodates the thermal expansion of the electrode foil; the layered composite liquid channel controls liquid distribution and improves film uniformity; the clamping mechanism provides adjustable clamping force on the electrode foil, ensuring stable adhesion during the formation process. This structure significantly improves the yield and reliability of anodizing while enhancing the uniformity, density, and stability of the oxide film, making it suitable for the preparation of high-performance electrode foils for solid aluminum electrolytic capacitors. It solves the problems of poor film uniformity, significant thermal deformation impact, and uneven electrolyte distribution in existing formation processes.

A device for holding and electrically contacting a hollow workpiece (1) for insertion with at least a free end (3) into an interior of the hollow workpiece (1) in an axial direction comprises a first part (10) and a second part (11) for engaging the hollow workpiece (1). At least the first component (10) is electrically conductive and comprises at least one terminal (15) for electrically connecting the first component (10) to a current supply. The first part (10) and the second part (11) are oriented to extend at least mainly parallel to a device axis (13). The device comprises guide portions (19a, b) for guiding the relative movement of the first part (10) and the second part (11). At least a component of the relative movement is a displacement transverse to the device axis (13). The guide parts (19a, b) comprise at least one guide part which is fixed in position relative to the first part (10) and engages with the other guide part at a respective engagement position, said engagement allowing a relative movement. The engagement position is separated from the at least one terminal (15).

To provide a workpiece holder and a device for loading workpieces onto the holder for use in wet chemical semiconductor processing. [Solution] The workpiece holder includes two perimeter seal plates, an electrical contact insert, and a locking plate. When the locking plate is in the locked position, the perimeter seal plates provide force for both fluid sealing and electrical contact. The locking plate also functions as an electrical bus, supplying current to the electrical contact insert. The workpiece loader includes a stage for inserting or removing a workpiece from the workpiece holder. The loader also includes a vacuum chuck that positions the perimeter seal plates before loading and compresses the perimeter seal plates during locking and unlocking.

The present invention aims to provide an anode for electroplating that can be relatively easily manufactured without the need for ancillary facilities or anolyte management, and without requiring expensive or special metals.The present invention relates to an anode for electroplating, comprising:an input part where power is input from a power source;a pair of support parts that extend in a first direction, are arranged at intervals in a second direction intersecting the first direction, receive power supply from the input part, and whose portions in contact with a plating solution are covered with an insulating material; andan electrification part that extends in the second direction, one end of which is connected to one of the pair of support parts, the other end of which is connected to the other of the pair of support parts, and receives power supply from the pair of support parts,wherein the electrification part includes several current paths arranged at intervals in the first direction, anda cross-sectional area of the electrification part is smaller than that of each of the support parts.

The invention provides an electroplating device and an electroplating system.The electroplating device comprises an electroplating bath, a cathode-to-you mechanism and an anode conductive mechanism, the electroplating bath is used for containing workpieces and comprises a first side wall, a second side wall and a bottom wall, and the two opposite ends of the bottom wall are connected to the first side wall and the second side wall correspondingly; the cathode conductive mechanism comprises two opposite limiting pieces which are arranged in the electroplating bath and are arranged at intervals in the first direction, the anode conductive mechanism comprises a first anode assembly and a second anode assembly, the first anode assembly comprises a first metal bar and a first anode bar, and the first anode bar at least partially extends to the second side wall along the inner side wall of the electroplating bath; the second anode assembly comprises a second metal bar and a second anode bar, and the second anode bar at least partially extends to the first side wall along the inner side wall of the electroplating bath; and in the first direction, a second anode bar is arranged between any two adjacent first anode bars.

The device for gripping a workpiece (2) and making electrical contact with at least one surface of the workpiece (2) comprises a first member (9, 44, 82, 120, 155) extending between a first end (12, 47, 85, 123, 158) and a second end (13, 48, 86, 124, 159), and a workpiece (2) extending between a first end (10, 45, 88, 121, 156) and a second end (11, 46, 84, 122, 157) and a first member (8, 9; 43, 44, 82, 120, 155) extending between a first end (12, 47, 85, 123, 158) and a second end (13, 48, 86, 124, 159). and a second member (8, 43, 81, 119, 154) movably journalled relative to the first member (9, 44, 82, 120, 155) to enable the second member (8, 43, 81, 119, 154) to be held between the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) at respective clamping positions closer to the first ends (10, 45, 88, 121, 156) and (12, 47, 85, 123, 158) than the second ends (11, 46, 84, 122, 157) and (13, 48, 86, 124, 159) along the extent of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155). Each of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) includes at least one section located along the extent of that member (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) between the clamping location and the second ends (11, 46, 84, 122, 157) and (13, 48, 86, 124, 159). At least one of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) is electrically conductive and is provided with a contact area in the clamping position for contacting a surface of the workpiece (2), the contact area including at least one exposed surface (25, 30; 63, 68; 100, 105; 137, 142; 173, 178) facing the other of the first member (8, 43, 81, 119, 154) and the second member (9, 44, 82, 120, 155).The device includes at least one shield portion (17, 32-35, 38-40; 70-72, 75-78; 93a, 93b, 94, 107-109, 112-114; 131, 144-147, 149, 150; 166a, 166b, 167, 180-182, 185-187) that is obtainable independently from the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) and is made of a material having a lower electrical conductivity than the conductive material of the conductive members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155). At least one section located between the clamping position and the second ends (11, 46, 84, 122, 157) and (13, 48, 86, 124, 159) of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) that are conductive is a shield part (17, 32-35, 38-40; 70-72, 75-78; 93a, 93b, 94, 10 7-109, 112-114; 131, 144-147, 149, 150; 166a, 166b, 167, 180-182, 185-187) on a side of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) facing the other of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155). A shielding portion (17, 33, 34, 39, 40; 71, 77, 78; 93a, 93b, 94, 108, 113; 131, 145, 146, 150; 166a, 166b, 167, 181, 186) that shields that section of either of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) on a side of that member facing the other of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) is adjacent to a gap through which liquid can flow between the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155).

The invention discloses an intermittent alternating type conductive mechanism, and the mechanism comprises a transmission device which is used for clamping and horizontally conveying PCBs; the driving device is used for driving the transmission device to move; the cathode device is arranged on one side or two sides of the transmission device and is used for providing cathode current for the PCB; wherein the cathode device comprises at least two groups of conductive components and a driving mechanism for driving the conductive components to move; and each group of conductive assemblies performs periodic reciprocating motion according to a preset square motion trail under the action of the driving mechanism, and the motion phases of the at least two groups of conductive assemblies are arranged in a staggered manner, so that alternate continuous conduction of the PCB is realized. According to the intermittent alternating type conductive mechanism, horizontal continuous electroplating of a PCB can be achieved, efficient and stable contact conduction of the PCB is achieved by designing the movement mode of the PCB and changing the cathode conductive structure, and meanwhile the electroplating uniformity and the production efficiency are remarkably improved.

An electroplated part, which contains hardly any organic residues and has a uniform electroplated layer. An electroplating method for preparing the electroplated part is also provided. By controlling the ratio of the length of the motion trajectory of the electroplated part relative to an anode during the electroplating process to the width of the anode, and adding auxiliary cathodes to the electroplated part, the electroplating method improves the uniformity of the thickness of the electroplated layer at various positions of the electroplated part. A fixture for implementing the electroplating method and an electroplating apparatus are provided. The electroplated layer of the electroplated part prepared by the electroplating method has relatively uniform thickness and a high coverage rate, problems such as burn and fracture have hardly occurred during the electroplating process of the electroplated part, the yield of electroplated parts is high, and the scrap rate is low. In addition, the precision of the weight of plated layers of electroplated parts can reach 99% or above.

To improve in-plane uniformity of a film to be plated on a polygonal substrate. A plating apparatus includes: a plating tank; a substrate holder configured to hold a polygonal substrate; an anode disposed inside the plating tank such that the anode faces the substrate held by the substrate holder; and an anode mask defining an opening corresponding to an outer shape of the polygonal substrate. The anode mask includes a first mask member defining a first projecting portion projecting toward a center of the opening at a center portion of a first opening side of the opening corresponding to a first side of the polygonal substrate and a second mask member defining a second projecting portion projecting toward the center of the opening at a center portion of a second opening side of the opening corresponding to a second side of the polygonal substrate, and is configured to be able to adjust a mutual distance between the first mask member and the second mask member.

A method and system for improving uniformity of plating film on the wafer are provided. The method includes: providing a plating device; providing a wafer, the plating device being configured to coat the wafer; monitoring currents at different areas of a surface of the wafer in a plating process; when a difference between the currents at the different areas of the surface of the wafer is greater than a preset difference, inspecting the plating device; and when an attachment is present on the plating device, cleaning the plating device.

The present disclosure relates to an electroplating system including a first contact detection sensor and a second contact detection sensor disposed at a surface of a cone of the electroplating system. The first contact detection sensor detects a first resistance at a first contact between a substrate to be plated by the electroplating system and a first contact pin, the second contact detection sensor detects a second resistance at a second contact between the substrate and a second contact pin. A controller receives the first resistance and the second resistance, and determines the first contact and the second contact are not properly formed when a difference between the first resistance and the second resistance is not within a first predetermined resistance range, or the first resistance or the second resistance is not within a second predetermined resistance range.

An electroplating method for enhancing the performance of rolled-up passive components comprises providing an array of rolled-up passive components on a substrate, where each rolled-up passive component comprises a multilayer strip in a rolled configuration including multiple turns spaced apart by gaps. The multilayer strip comprises a conductive pattern layer on a strain-relieved layer, and a core of each rolled-up passive component is defined by a first of the multiple turns. A layer comprising a functional material is electroplated onto the conductive pattern layer of each rolled-up passive component, thereby at least partly filling the gaps and / or the core with the functional material.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.