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39results about "Contacting devices" patented technology
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Locking frame holder and workpiece loader for wet chemical semiconductor processing
A workpiece holder and an apparatus for loading workpieces onto the holder for use in wet chemical semiconductor processing is described. The workpiece holder comprises two perimeter seal plates, electrical contact inserts and a locking plate. The perimeter seal plates provide force for both fluid sealing and electrical contact when the locking plate is in a locked position. The locking plate also functions as an electrical bus to provide current to the electrical contact inserts. The workpiece loader comprises a stage to insert or remove a workpiece from the workpiece holder. The loader also comprises vacuum chucks to position the perimeter seal plates prior to loading and to compress the perimeter seal plates during locking and unlocking.
Owner:ASMPT NEXX INC
System for electrochemical treatment and method thereof
A head unit for electrochemical treatment of a surface including a handle having an output tube and a vacuum tube. The output tube and the vacuum tube configured to couple the handle to a portable cart. The head unit including a body coupled to the handle and an electrode disposed within the body and coupled to the output tube and the vacuum tube. The electrode including a plurality of output channels for outputting an electrochemical solution and a plurality of vacuum channels for vacuuming the electrochemical solution outputted from the plurality of output channels. Each of the plurality of output channels is disposed proximate to at least one of the plurality of vacuum channels and the electrode is fluidly coupled to the output tube to receive the electrochemical solution from the output tube.
Owner:QUAKER CHEMICAL CORPORATION
Portable electrolytic deposition system including hydrogels and methods of using same
A handheld reactive electrochemical application system is provided. The handheld reactive electrochemical application system includes a power supply configured to be electrically coupled to a substrate and a hydrogel electrically coupled to the power supply. The hydrogel includes a reactive chemical solution. The hydrogel is configured to contact the substrate, the power supply is configured to pass a current through the hydrogel and the substrate, and the reactive chemical solution is configured to treat the substrate when the current is passed through the hydrogel and the substrate.
Owner:CHEMEON SURFACE TECHNOLOGY LLC
Substrate holder, substrate plating device equipped therewith, and electrical contact
Provided is a substrate holder for plating on a surface of a substrate, provided with an electrical contact that is easy to replace. A substrate holder 1 includes: a first holding member 2; a second holding member 3 that has an opening portion 3a for exposing the surface of a substrate W and holds the substrate W in a sandwiched manner with the first holding member 2; a plurality of engaging shaft portions 36 each having a head portion 36b in an expanded head shape at a tip end portion, provided in a circumferential direction of the second holding member 3; and an electrical contact 32 having a contact portion 32a to be in contact with an edge portion of the substrate W, and having an engagement reception portion 32b in a notch shape to be engaged with the adjacent engaging shaft portion 36 for arrangement along a circumference of the opening portion 3a of the second holding member 3.
Owner:EBARA CORP
Substrate holder, plating apparatus, plating method, and storage medium
The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.
Owner:EBARA CORP
Methods and systems for improving wafer coating uniformity
This disclosure provides a method and system for improving the uniformity of wafer coating. The method includes: providing a coating apparatus; providing a wafer, the coating apparatus being used to coat the wafer; monitoring the current in different regions of the wafer surface during the coating process; inspecting the coating apparatus when the difference in current between different regions of the wafer surface exceeds a preset difference; and cleaning the coating apparatus when there are deposits on it. This technical solution, by monitoring the current in different regions of the wafer surface during the coating process, can promptly detect areas of uneven coating on the wafer surface; inspecting the coating apparatus when the difference in current between different regions of the wafer surface exceeds a preset difference to identify components requiring maintenance; and cleaning the coating apparatus when there are deposits, thereby improving the uniformity of the wafer coating.
Owner:CHANGXIN MEMORY TECH INC
Structure for uniform distribution of thicknesses of metal layers deposited with galvanizing process
A structure and method for chrome plating plastic parts aimed at reducing the variation in metal thickness across all areas of the part during chrome plating. This is achieved through the use of a specially designed support device that allows for the reduction of excess metal in chrome-plated plastic parts.
Owner:NICRO BOLTA SA DE CV
Device and method for forming a via in a layered substrate
The invention relates to a device (100) and a method for forming a via in a layered substrate (101) having a through-hole (102) which is closed on a first face (101a) of the substrate (101) by means of a metal layer (103) and exits the substrate on a second face (101b) of the substrate (100). A metal is deposited in the through-hole (102) by means of electrochemical deposition. The device comprises a support (106) for receiving and positioning the substrate (101), an electrical contact for electrically contacting the metal layer (106), a metallization container (108) which can be filled with an electrolyte, and an anode (109) which is immersed in the electrolyte during the deposition process. The support (106) is preferably part of the metallization container (108) and / or is designed and / or positioned in such a way that the layered substrate (101) forms a boundary of the metallization container (108). In a first variant, the device is designed in such a way that only the second face (101b) of the substrate (100) comes into contact with the electrolyte during the deposition process. In a second variant, the support (106) is designed and / or positioned in such a way that the inserted substrate (100) forms a boundary of the metallization container (108). In a third variant, the support (106) is electrically conductive and serves as the electrical contact for electrically contacting the metal layer (103), or the electrical contact is integrated into the support (106) or is fixed to the support (106). In a fourth variant, an ultrasound generator (110) is provided on the first face (101a) of the substrate (101) and applies ultrasound to the substrate (101) during the deposition process. In a fifth variant, the device comprises a stationary sub-element (116) and a movable sub-element (115).
Owner:GEBR SCHMID GMBH & CO
Locking frame holder and workpiece loader for wet chemical semiconductor processing
PendingJP2026075086AContacting devicesSealing devices
To provide a workpiece holder and a device for loading workpieces onto the holder for use in wet chemical semiconductor processing. [Solution] The workpiece holder includes two perimeter seal plates, an electrical contact insert, and a locking plate. When the locking plate is in the locked position, the perimeter seal plates provide force for both fluid sealing and electrical contact. The locking plate also functions as an electrical bus, supplying current to the electrical contact insert. The workpiece loader includes a stage for inserting or removing a workpiece from the workpiece holder. The loader also includes a vacuum chuck that positions the perimeter seal plates before loading and compresses the perimeter seal plates during locking and unlocking.
Owner:ASMPT NEX INC
Anode for electroplating, and method and system for electroplating articles with metal
The present invention aims to provide an anode for electroplating that can be relatively easily manufactured without the need for ancillary facilities or anolyte management, and without requiring expensive or special metals.The present invention relates to an anode for electroplating, comprising:an input part where power is input from a power source;a pair of support parts that extend in a first direction, are arranged at intervals in a second direction intersecting the first direction, receive power supply from the input part, and whose portions in contact with a plating solution are covered with an insulating material; andan electrification part that extends in the second direction, one end of which is connected to one of the pair of support parts, the other end of which is connected to the other of the pair of support parts, and receives power supply from the pair of support parts,wherein the electrification part includes several current paths arranged at intervals in the first direction, anda cross-sectional area of the electrification part is smaller than that of each of the support parts.
Owner:DISPOL CHEMICALS CO LTD
Electroplating device and electroplating system
The invention provides an electroplating device and an electroplating system.The electroplating device comprises an electroplating bath, a cathode-to-you mechanism and an anode conductive mechanism, the electroplating bath is used for containing workpieces and comprises a first side wall, a second side wall and a bottom wall, and the two opposite ends of the bottom wall are connected to the first side wall and the second side wall correspondingly; the cathode conductive mechanism comprises two opposite limiting pieces which are arranged in the electroplating bath and are arranged at intervals in the first direction, the anode conductive mechanism comprises a first anode assembly and a second anode assembly, the first anode assembly comprises a first metal bar and a first anode bar, and the first anode bar at least partially extends to the second side wall along the inner side wall of the electroplating bath; the second anode assembly comprises a second metal bar and a second anode bar, and the second anode bar at least partially extends to the first side wall along the inner side wall of the electroplating bath; and in the first direction, a second anode bar is arranged between any two adjacent first anode bars.
Owner:LOUDI ZHONGXING HYDRAULIC COMPONENTS CO LTD
Intermittent alternating type conductive mechanism
The invention discloses an intermittent alternating type conductive mechanism, and the mechanism comprises a transmission device which is used for clamping and horizontally conveying PCBs; the driving device is used for driving the transmission device to move; the cathode device is arranged on one side or two sides of the transmission device and is used for providing cathode current for the PCB; wherein the cathode device comprises at least two groups of conductive components and a driving mechanism for driving the conductive components to move; and each group of conductive assemblies performs periodic reciprocating motion according to a preset square motion trail under the action of the driving mechanism, and the motion phases of the at least two groups of conductive assemblies are arranged in a staggered manner, so that alternate continuous conduction of the PCB is realized. According to the intermittent alternating type conductive mechanism, horizontal continuous electroplating of a PCB can be achieved, efficient and stable contact conduction of the PCB is achieved by designing the movement mode of the PCB and changing the cathode conductive structure, and meanwhile the electroplating uniformity and the production efficiency are remarkably improved.
Owner:XIAN TAIJIN NEW ENERGY & MATERIALS SCI TECH CO LTD
Electroplated Part and Manufacturing Method Therefor, Fixture for Manufacturing, and Apparatus
An electroplated part, which contains hardly any organic residues and has a uniform electroplated layer. An electroplating method for preparing the electroplated part is also provided. By controlling the ratio of the length of the motion trajectory of the electroplated part relative to an anode during the electroplating process to the width of the anode, and adding auxiliary cathodes to the electroplated part, the electroplating method improves the uniformity of the thickness of the electroplated layer at various positions of the electroplated part. A fixture for implementing the electroplating method and an electroplating apparatus are provided. The electroplated layer of the electroplated part prepared by the electroplating method has relatively uniform thickness and a high coverage rate, problems such as burn and fracture have hardly occurred during the electroplating process of the electroplated part, the yield of electroplated parts is high, and the scrap rate is low. In addition, the precision of the weight of plated layers of electroplated parts can reach 99% or above.
Owner:BIOTYX MEDICAL (SHENZHEN) CO LTD
Detection of contact formation between a substrate and contact pins in an electroplating system
The present disclosure relates to an electroplating system including a first contact detection sensor and a second contact detection sensor disposed at a surface of a cone of the electroplating system. The first contact detection sensor detects a first resistance at a first contact between a substrate to be plated by the electroplating system and a first contact pin, the second contact detection sensor detects a second resistance at a second contact between the substrate and a second contact pin. A controller receives the first resistance and the second resistance, and determines the first contact and the second contact are not properly formed when a difference between the first resistance and the second resistance is not within a first predetermined resistance range, or the first resistance or the second resistance is not within a second predetermined resistance range.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
Method of plating and apparatus for plating
One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.
Owner:EBARA CORP
Electrical processing system for a microelectronic substrate and process
System (20) for electroplating a substrate, comprising the following: several chuck assemblies (76), each comprising a chuck (72) and a contact ring (70) positioned between the contact ring (70) and the chuck (72) for clamping a substrate; several electroplating processors (42), each having a rotor (80) adapted to accommodate a chuck assembly; a ring module (40) with a contact ring electroplating device; and a chuck assembly robot (60) which is movable between the ring module (40) and the electroplating processors (42) and has an end effector to engage a chuck assembly.
Owner:APPLIED MATERIALS INC
Method for manufacturing a multi-component component, multi-component component and composite component
A method for producing a multi-component component, in which an electrically conductive insert element is inserted into a first injection mold, in which a first portion of the insert element is overmolded with a first, electroplating-resistant plastic, the insert element is either overmolded in the first contact region with only a thin layer of the first plastic or not at all, the insert element, which is overmolded in the first portion with the first plastic, is fixed in a second injection mold, in which a second portion of the insert element, which is complementary to the first portion, is overmolded with a second, electroplatable plastic, the overmolding with the second plastic is such that the insert element is closed with the second plastic flush on the outside in the second contact region, the insert element is removed from the second injection mold, the insert element is contacted in the first contact region by means of a contact pin through the thin layer or directly, and a metal layer is applied to the second plastic on the outside and to the second contact region by electroplating in this state. The invention also relates to a composite component and a multi-component component.
Owner:CONTINENTAL AUTOMOTIVE GMBH
Plating materials and fastener stringers
This plated member includes: a base material (83) containing at least one base material metal element; and plating layers (84) formed on the base material (83). The plating layers (84) include first and second plating layers (81, 82) formed on the base material (83) in the stated order. The first and second plating layers (81, 82) each contain at least a first plating layer metal element which is the same metal element as the base material metal element, and a second plating layer metal element which is a metal element different from the base material metal element. The element proportion of the first plating layer metal element continuously decreases away from the base material (83) at least over the total layer thickness of the first and second plating layers (81, 82). The element proportion of the second plating layer metal element continuously increases away from the base material (83) at least over the total layer thickness of the first and second plating layer (81, 82). The second plating layer (82) is observable as being distinct from the first plating layer (81) in a first TEM image as a layer having crystal grains larger than crystal grains in the first plating layer (81).
Owner:YKK CORP
Electrorefining installation with interconnectable intercell bars
Electrorefining installation with interconnectable intercell bars, of the type of electro-deposition installations used for metal purification through electrolysis, comprising at least three cells connected to each other in series by means of a set of three bars: one central main bar and two lateral bars placed between each pair of consecutive cells. The central bar provides support and electrical connection to one end of all the cathode hangers of the preceding cell and to one end of all the anode hangers of the following cell. One of the two lateral bars provides support and connection to all the anodes of the preceding cell, while the other side bar provides support and connection to all the cathodes of the following cell. The installation includes electrical switches capable of creating an electrical bridge between the lateral bars periodically, for a short period of time, causing a temporary reversal of the current.
Owner:PRADO PUEO FELIX
Electrical contacts, systems, and methods for electroplating
Electrical contact apparatuses, systems, and techniques for electroplating are provided. The electrical contact apparatus may have a body portion extending around a center axis, and a plurality of electrical contact fingers arranged in a substantially equally spaced manner around the center axis and extending in a radial direction inwards towards the center axis. Each electrical contact finger may be flexible in a direction parallel to the center axis, may have a proximal portion connected to the body portion, and has a distal portion connected to the proximal portion and forming an included angle with the proximal portion that is between about 45 degrees and 145 degrees, and the distal portion of each electrical contact finger has an end portion configured to contact a substrate and that has a surface roughness Ra of about 50 micro-inches or less, is beveled, chamfered, and / or has one or more curved surfaces.
Owner:LAM RES CORP
Locking frame holder and workpiece loader for wet chemical semiconductor processing
The invention relates to a workpiece holder for wet chemical semiconductor processing and to a device for loading a workpiece to a holder. The workpiece holder includes two peripheral sealing plates, an electrical contact insert, and a locking plate. When the locking plate is in the locked position, the peripheral sealing plates provide force for fluid sealing and electrical contact. The locking plate may also act as an electrical bus to provide electrical current to the electrical contact inserts. The workpiece loader includes a table for inserting or removing a workpiece into or from the workpiece holder. The loader also includes a vacuum chuck for positioning the peripheral seal plate prior to loading and compressing the peripheral seal plate during locking and unlocking.
Owner:TEL NEXX INC
Fixture for oppositely attaching double-tension gauze to two surfaces of workpiece in shape covering manner and processing method
Owner:德中(天津)技术发展股份有限公司
Horizontal electroplating production line
A horizontal electroplating production line includes a horizontal electroplating apparatus and a circuit board feeding device. The horizontal electroplating apparatus includes a first frame, an electroplating tank and a horizontal electroplating conveying device arranged at the first frame, the electroplating tank extends along a first direction, the horizontal electroplating conveying device is configured to clamp a circuit board and move the circuit board in the electroplating tank for electroplating, the circuit board feeding device includes a second frame and a feeding conveying mechanism arranged at the second frame, the feeding conveying mechanism is a conveying line with a certain length, and the feeding conveying mechanism is configured to place the circuit board horizontally and convey the circuit board to the horizontal electroplating conveying device of the electroplating apparatus.
Owner:UNIVERSAL CIRCUIT BOARD EQUIP CO LTD
Electrochemical deposition apparatus
An electrochemical deposition apparatus is provided to include a process groove body with an accommodating groove is configured to accommodate a plating solution; a substrate carrier including a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier is in the accommodating groove; and at least one driving assembly on the process groove body and configured to control the substrate carrier to move along a first plane, wherein the first plane intersects with a normal direction of the carrying surface.
Owner:BOE TECHNOLOGY GROUP CO LTD
Plating device and plating device diagnosis method
In the present invention, the operation status of a plating device is accurately ascertained. Provided is a plating device for forming a plating film on a substrate, said plating device comprising: a substrate holder configured to hold the substrate; a plating tank configured to accommodate a plating solution together with the substrate holder; an anode disposed in the plating tank so as to face the substrate held by the substrate holder; a film thickness measurement unit configured to measure the film thickness of the plating film formed on the substrate at points on the substrate; and a control unit for controlling the plating device. The control unit includes: an imaging sub-unit configured to generate, on the basis of a film thickness measurement value at each of the points on the substrate, an image map representing a film thickness distribution on the substrate; a machine learning model trained to output an estimated status related to a plating process of the plating device when the image map is input; and a diagnosis sub-unit configured to diagnose the plating device on the basis of the estimated status output from the machine learning model.
Owner:EBARA CORP
Electroplating system and electroplating method
The invention relates to the technical field of metal processing, in particular to an electroplating system and an electroplating method.The electroplating system comprises an electroplating liquid storage cavity and a bearing circular plate rotationally connected to the interior of the electroplating liquid storage cavity, a vertical square sliding rod is fixedly connected to the upper portion of the bearing circular plate, and a lifting frame plate is slidably connected to the vertical square sliding rod; the lifting frame plate is fixedly connected with two conductive cylinders, the electroplating liquid storage cavity is fixedly connected with a horizontal liquid discharging pipe and a gear motor, an output shaft of the gear motor is fixedly connected with the bearing circular plate, and the electroplating liquid storage cavity is fixedly connected with a plurality of supporting fixing legs; the system comprises a vertical square sliding rod, a top fixing square plate is fixedly connected to the vertical square sliding rod, a lifting lead screw is rotationally connected to the top fixing square plate, the lifting lead screw is in transmission connection with a lifting frame plate through threads, and a plurality of limiting sliding grooves are fixedly connected to the two ends of the lifting frame plate correspondingly. And the electroplating effect on the to-be-plated metal is further improved.
Owner:徐玉文
Electrodes and methods for manufacturing them
To provide an electrode for an electrochemical reaction bath, and to provide a method for producing the same.SOLUTION: An electrode includes a substrate, an active side adapted to come into contact with a reaction bath, and a passive side adapted to come into contact with at least one conductor. The passive side includes a doped carbon coating.SELECTED DRAWING: None
Owner:CONDIAS
Plating equipment
Provided is a plating apparatus that suppresses the occurrence of defects in a plated object without the plated object rising excessively to a high position in a plating solution in which the plated object is contained, even if the flow rate of the plating solution sprayed from a spraying unit is increased. The plating apparatus according to the present invention comprises: a plating tank that stores the plating solution and contains the plated object; and the spraying unit, which includes a first spraying port that is formed in the plating tank and sprays the plating solution, the plated object in the plating solution being agitated by the plating solution sprayed from the spraying unit. A mesh member is provided to the first spraying port of the spraying unit. The mesh member is formed by overlapping at least two meshes, and, when viewed in a planar direction, the mesh member includes a center portion and a peripheral portion provided to the outside of the center portion. The peripheral portion is formed using a layer of one mesh or a layer of a plurality of meshes. The center portion is formed in a layer of a plurality of meshes, and the number of layers of the mesh in the center portion is greater than the number of layers of the mesh in the peripheral portion.
Owner:MURATA MFG CO LTD
Flexible pressing roller and usage method therefor
The present invention relates to a flexible pressing roller and a usage method therefor. The flexible pressing roller comprises an inner roller, wherein a flexible sleeve is provided on the periphery of the inner roller, two ends of the flexible sleeve are sealingly connected to the inner roller by means of sealing rings, and the interior of the flexible sleeve is filled with a liquid medium; the inner roller is a rigid solid round rod or a rigid tube, or comprises a solid round rod and a rigid tube, and the material of the inner roller comprises metal, plastic or rigid carbon fiber. The present invention enables flexible contact with the surface of solar cells, thereby greatly reducing the breakage rate of the solar cells in various horizontal chain-type wet process apparatuses. Further, the present invention applied in a horizontal roller chain-type electroplating apparatus ensures full contact with the upper surface of solar cells having uneven thickness, thereby enabling good conductive contact between the lower surface of the solar cells and a cathode roller.
Owner:JIANGSU XIANGHUAN TECHNOLOGY CO LTD
Method for manufacturing solar cell, solar module, and power generation system
The disclosure discloses a method for manufacturing a solar cell, a solar module, and a power generation system. The manufacturing method includes the following steps: S1: perforating film layer in a first region (100) and / or a second region (200) of a solar cell where an electrode is to be disposed, thus forming a plurality holes (2); S2: growing a plurality seed layers (1) on the solar cell, contacting with the first region and / or the second region through the plurality of holes or grooves in S1; and S3: horizontally transporting a to-be-electroplated solar cell on a horizontal electroplating device, to form a cathode on the seed layer, where an anode terminal is disposed in an electroplating liquid in an electroplating bath, and a moving mechanism disposed in the electroplating bath drives the solar cell to move from inlet to outlet, thus achieving electroplating.
Owner:SOLARLAB AIKO EUROPE GMBH