177results about "Contacting devices" patented technology

The present invention provides a roller conductive device for NdFeB electroplating, comprising a roller, a conductive disk, a conductive tile and a conductor. The roller is arranged horizontally, and end caps are arranged at both ends of the roller. The conductive disk is arranged on the inner side of the end cap and rotates with the roller. The inner side of the conductive disk contacts the product inside the roller. A fixed conductive tile is arranged on the outer side of the conductive disk. One end of the conductive tile contacts the lower part of the conductive disk, and the other end of the conductive tile is connected to the conductor. The conductive disk is composed of a plurality of conductive plates, which are distributed on the inner side of the end cap at intervals along the circumference. When the roller drives the conductive disk to rotate, the plurality of conductive plates contact one end of the conductive tile in turn to conduct electricity, so that the conductive plate that rotates to the lower part contacts the product to form a current loop. The conductive disk of the present invention is composed of a plurality of conductive plates distributed at intervals along the circumference, which solves the problem that the upper part of the conductive disk does not contact the product, resulting in uneven electroplating effect, waste of electric energy and burning of the conductive disk.

An electroplating method and an electroplating apparatus, which relate to the technical field of semiconductor processing. The electroplating method comprises: S10, applying a positive voltage to an intermediate anode, and an edge electrode not operating; S20, acquiring a deposition rate v1 of a plating layer of an intermediate region, and acquiring a deposition rate v2 of a plating layer of an edge region; S30, determining the magnitudes of v1 and v2; S40, if v1 is greater than v2, applying the positive voltage to the edge electrode, and outputting a current I; S50, if v1 is less than v2, applying a negative voltage to the edge electrode, and outputting the current I; and S60, if v1 is equal to v2, keeping an operating state of the edge electrode unchanged. By means of respectively acquiring deposition rates of plating layers of an intermediate region and an edge region, and controlling the voltage and current of an edge electrode accordingly, the deposition rate of the edge region can be dynamically adjusted, such that the deposition rates of the edge region and the intermediate region can be balanced in real time, thereby improving the uniformity of electroplating.

A device, method, and equipment for improving the electroplating uniformity in wafer electroplating. The device includes an electroplating component and an electroplating rate adjustment component. The electroplating component includes an electroplating head, an electroplating tank, an anode metal and a power supply. The electroplating rate adjustment component includes an auxiliary electrode assembly, a switching device and a control module. The auxiliary electrode assembly consists of auxiliary electrodes, a circuit resistor assembly and a support ring structure. The auxiliary electrode is set on the support ring structure, and when the auxiliary electrode is connected to the circuit resistor assembly, the support ring body can be controlled to lift or rotate, bringing the auxiliary electrode closer to or farther from the wafer notch, thereby adjusting the electroplating rate at the notch.

A device for holding and electrically contacting a hollow workpiece (1), for insertion with at least a free end (3) in an axial direction into an interior of the hollow workpiece (1), comprises a first member (10) and a second member (11) for engaging the hollow workpiece (1). At least the first member (10) is electrically conducting and comprises at least one terminal (15) for electrically connecting the first member (10) to an electrical current supply. The first and second members (10,11) are oriented to extend at least predominantly parallel to the device axis (13). The device comprises guide parts (19a,b) for guiding relative movement of the first and second members (10,11). At least a component of the relative movement is a displacement transverse to the device axis (13). The guide parts (19a,b) comprise at least one guide part fixed in position with respect to the first member (10) and engaging a further guide part at a respective engagement location, the engagement permitting relative motion. The engagement locations are separate from the at least one terminal (15).

Pneumatic articles that include a moveable component with a coated surface are described. The coated surface can include a surface coating including an alloy layer that includes molybdenum or tungsten in combination with one or more other materials. Pneumatic cylinders and pneumatic devices are also described.

A workpiece holder and an apparatus for loading workpieces onto the holder for use in wet chemical semiconductor processing is described. The workpiece holder comprises two perimeter seal plates, electrical contact inserts and a locking plate. The perimeter seal plates provide force for both fluid sealing and electrical contact when the locking plate is in a locked position. The locking plate also functions as an electrical bus to provide current to the electrical contact inserts. The workpiece loader comprises a stage to insert or remove a workpiece from the workpiece holder. The loader also comprises vacuum chucks to position the perimeter seal plates prior to loading and to compress the perimeter seal plates during locking and unlocking.

The invention discloses a horizontal electroplating line capable of realizing single-side electroplating. The horizontal electroplating line comprises an annular driving device, an electroplating device, a multifunctional tank and a fixing device, a battery piece is arranged in the electroplating device, and the electroplating device is driven by the annular driving device to circularly move in the horizontal direction and lift in the vertical direction along the annular track on the fixing device; the multifunctional tank is mounted below the electroplating device and consists of a plurality of different functional tanks; the electroplating device moves up and down in each functional tank to realize electroplating treatment of the battery piece; the fixing device is installed below the annular driving device and used for fixing and connecting the whole annular line. The movement of the battery piece is realized through the electroplating device; through the design of a positive and negative air pressure annular sealing structure, the other surface is protected from being in contact with electroplating liquid while single-surface horizontal continuous electroplating is realized; and meanwhile, the fragment rate is reduced, and the electroplating efficiency is improved.

A head unit for electrochemical treatment of a surface including a handle having an output tube and a vacuum tube. The output tube and the vacuum tube configured to couple the handle to a portable cart. The head unit including a body coupled to the handle and an electrode disposed within the body and coupled to the output tube and the vacuum tube. The electrode including a plurality of output channels for outputting an electrochemical solution and a plurality of vacuum channels for vacuuming the electrochemical solution outputted from the plurality of output channels. Each of the plurality of output channels is disposed proximate to at least one of the plurality of vacuum channels and the electrode is fluidly coupled to the output tube to receive the electrochemical solution from the output tube.

The invention discloses a welding wire electroplating treatment device, and relates to the technical field of welding wire surface electroplating treatment, the welding wire electroplating treatment device comprises an electroplating bath, the top side of the electroplating bath is provided with a lifting mechanism, the lifting mechanism is provided with a threading mechanism used for enabling a welding wire to enter and exit from the electroplating bath on the same side, and the threading mechanism is provided with a rotating mechanism used for enabling an anode in the electroplating bath to rotate; according to the device, through the arrangement of the pulley block, the fixed pulley, the rotating ring, the collecting round frame and the like, in the continuous electroplating process of the welding wires, the welding wires are fed in and discharged out of the single side of the electroplating tank to be matched with rotation of the anode plates, and therefore the welding wires can be continuously electroplated; the electrode distance is dynamically balanced, the stroke of the welding wire in the electroplating bath is prolonged, the coating uniformity is improved, the anode plate rotates to drive the collecting round frame to slide in a reciprocating mode, meanwhile, the surface of the welding wire before and after electroplating is scraped, and the use convenience of the structure is improved.

The present invention relates to a structure and a method for chrome plating plastic pieces, for reducing the difference in the thickness of the metal in all areas of the piece to be chrome plated. This is achieved using a specially designed support means that allows the excess metal in chrome-plated plastic pieces to be reduced.

A handheld reactive electrochemical application system is provided. The handheld reactive electrochemical application system includes a power supply configured to be electrically coupled to a substrate and a hydrogel electrically coupled to the power supply. The hydrogel includes a reactive chemical solution. The hydrogel is configured to contact the substrate, the power supply is configured to pass a current through the hydrogel and the substrate, and the reactive chemical solution is configured to treat the substrate when the current is passed through the hydrogel and the substrate.

The present disclosure relates to an electroplating system including a first contact detection sensor and a second contact detection sensor disposed at a surface of a cone of the electroplating system. The first contact detection sensor detects a first resistance at a first contact between a substrate to be plated by the electroplating system and a first contact pin, the second contact detection sensor detects a second resistance at a second contact between the substrate and a second contact pin. A controller receives the first resistance and the second resistance, and determines the first contact and the second contact are not properly formed when a difference between the first resistance and the second resistance is not within a first predetermined resistance range, or the first resistance or the second resistance is not within a second predetermined resistance range.

Provided is a substrate holder for plating on a surface of a substrate, provided with an electrical contact that is easy to replace. A substrate holder 1 includes: a first holding member 2; a second holding member 3 that has an opening portion 3a for exposing the surface of a substrate W and holds the substrate W in a sandwiched manner with the first holding member 2; a plurality of engaging shaft portions 36 each having a head portion 36b in an expanded head shape at a tip end portion, provided in a circumferential direction of the second holding member 3; and an electrical contact 32 having a contact portion 32a to be in contact with an edge portion of the substrate W, and having an engagement reception portion 32b in a notch shape to be engaged with the adjacent engaging shaft portion 36 for arrangement along a circumference of the opening portion 3a of the second holding member 3.

The invention discloses a conductive device for an inner hole of a thin-wall sleeve. The conductive device comprises an annular process blocking plate, a gland flange assembly and a hanger assembly. The annular process blocking plate is detachably installed in the thin-wall sleeve and close to the upper end of the thin-wall sleeve, and the gland flange assembly covers the upper end face of the thin-wall sleeve and is detachably connected with the annular process blocking plate; the upper end of the hanger assembly is connected with the travelling crane, and the lower end of the hanger assembly is connected with the gland flange assembly. By adopting the detachable annular process blocking plate, the processes of welding and welding removal are removed, so that the annular process blocking plate is more convenient and quicker to disassemble and assemble, the production efficiency can be effectively improved, meanwhile, the detachable design also enables the disassembly and assembly of the annular process blocking plate not to influence the internal thread of the thin-wall sleeve, and the production efficiency is improved. Therefore, the process of finish turning of the internal threads does not need to be added after the annular process blocking plate is dismounted, the process is further shortened, and the manufacturing cost is reduced.

The invention relates to a device (100) for the local electrochemical coating of a component (200), which is movable along the component (200) and comprises an application unit (102) configured to dispense an electrolyte liquid onto the component (200), wherein the application unit (102) has a first electrode and the component (200) is connected to a second electrode (105) of opposite polarity. Furthermore, the device (100) comprises a rinsing unit (106) which is arranged in the direction of movement (101) behind the application unit (102) and is designed to discharge a rinsing fluid onto the component (200), and includes an extraction chamber (111) which comprises at least one area which is arranged in the direction of movement (101) behind the rinsing unit (106), wherein the extraction chamber (111) is connected to a vacuum unit and has an open side which, during operation of the device (100), points towards the component (200).Furthermore, the invention relates to a method for the local electrochemical coating of a component (200) using a device (100).

The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.

A cup-type chuck for a substrate holding device is disclosed. The cup-type chuck includes an inner pressure ring, a middle frame, a seal portion, an outer pressure ring, and a contact ring. The inner pressure ring is fixed to the inner peripheral surface of the middle frame. The seal portion has an outer end, a bottom, and an inner end. The outer end of the seal portion covers at least a portion of the outer peripheral surface of the middle frame. The bottom of the seal portion covers the bottom of the middle frame and is exposed to the outside of the cup-type chuck. The inner end of the seal portion covers at least a portion of the inner peripheral surface of the middle frame and is pressed between the inner pressure ring and the middle frame by the inner pressure ring. The outer pressure ring is made of an insulating material and fixed to the outer peripheral surface of the middle frame, and the outer end of the seal portion is pressed between the outer pressure ring and the middle frame by the outer pressure ring. The contact ring is located above the seal portion and is pressed between the inner pressure ring and the middle frame, with the seal ring being disposed between the inner pressure ring and the contact ring.

The present invention disclosed an electroplating apparatus for non-circular substrate, comprising a central electrode area, a peripheral electrode area, a power supply unit and a control device. The size of the central electrode area is the inscribed circle of the non-circular substrate, and the central electrode is arranged in the central electrode area. The peripheral electrode area surrounds the central electrode area. The peripheral size of the peripheral electrode area is the circumscribed circle of the non-circular substrate. The peripheral electrode area is provided with closely arranged point electrodes, and the point electrodes fill the peripheral electrode area. The power supply unit supply power to the central electrode and the point electrodes. The control device is connected between the power supply unit, the central electrode and the point electrodes and controls the on-off of the central electrode and the point electrodes. The control device tracks the rotating position of the substrate, so that the electrodes in the central electrode area and the peripheral electrode area covered by the substrate will be turned on and the electrodes not covered by the substrate will be turned off. The present invention also disclosed an electroplating method for the non-circular substrate.

The disclosure discloses a manufacturing method and apparatus for an electronic component, and belongs to the technical field of manufacture of photovoltaic devices. The manufacturing method includes: putting a semiconductor device into a cathode region, and driving the semiconductor device to move in the cathode region, at the same time, connecting line plating rollers to a power source, and driving the line plating rollers to rotate, so that a surface of the semiconductor device is plated with metal lines in a movement direction thereof by conductive parts located in a circumferential direction of an outer side of each of the line plating rollers; the conductive parts include line plating regions and deplating regions; an anode is disposed on outer sides of the deplating regions and is electrically connected to a positive electrode of the power source by the conductive parts in the deplating regions.

The present invention provides an anode for electroplating, which does not require an auxiliary device and an anode liquid management, and can be easily manufactured without using expensive metals and special metals. The present invention relates to an anode for electroplating, comprising: an input portion for inputting electric power from a power source; a pair of support portions extending in a first direction, arranged at intervals from each other in a second direction intersecting the first direction, receiving supply of electric power from the input portion, and covered with an insulating material at a liquid-contacting portion with a plating liquid; and a current-carrying portion extending in the second direction, one end of which is connected to one of the pair of support portions, the other end of which is connected to the other of the pair of support portions, and receiving supply of electric power from the pair of support portions; the current-carrying portion having a plurality of current paths arranged at intervals from each other in the first direction, and a cross-sectional area of the current-carrying portion being smaller than a cross-sectional area of the support portions.

The present invention relates to the technical field of electroplating and discloses a system for manufacturing flexible foil material. The system includes a first reservoir roller, a tension roller, a first conductive roller, and a second conductive roller arranged in sequence along a film transmission direction, the film passes through the first reservoir roller, the tension roller, the first conductive roller, and the second conductive roller in sequence, the tension roller and the second conductive roller contact the upper surface of the film, the first conductive roller contacts the lower surface of the film, and the horizontal height of the contact position where the film and the tension roller contact is greater than the horizontal height of the contact position where the film and the first reservoir roller contact. The present invention has the beneficial effects of greatly reducing copper plating on the conductive roller, avoiding the formation of crystals of the plating solution on the conductive roller, and preventing the crystals from piercing the film.

Embodiments disclosed herein relate to electroplating apparatuses used for components in semiconductor processing chambers. In one embodiment, an electroplating device is provided. The electroplating device includes a housing including a first surface and a second surface and a plurality of holes disposed in the housing. The plurality of holes extend from the first surface to the second surface, and are configured to hold a component to be electroplated. The electroplating device further includes a gas inlet connected to an air bladder. The air bladder is disposed between the plurality of holes. The air bladder is configured to cover an outer surface of the component to be electroplated. The electroplating device further includes a cathode connector disposed below the first surface, and a cathode insert connected to the cathode connector. The cathode insert is connected to the plurality of holes and is configured to electrically charge the component.

The electroplating cup assembly includes a cup bottom, a lip seal, and an electrical contact structure. The cup bottom at least partially defines an opening configured to expose a wafer located in the cup assembly to an electroplating solution. A lip seal is on the cup bottom and includes a sealing structure extending upwardly along an inner edge of the lip seal to an apex configured to contact a seed layer of the wafer and adjacent a sacrificial layer of the wafer. An electrical contact structure is over a portion of the seal. The electrical contact structure is configured to be coupled to a seed layer of a wafer.

This disclosure provides a method and system for improving the uniformity of wafer coating. The method includes: providing a coating apparatus; providing a wafer, the coating apparatus being used to coat the wafer; monitoring the current in different regions of the wafer surface during the coating process; inspecting the coating apparatus when the difference in current between different regions of the wafer surface exceeds a preset difference; and cleaning the coating apparatus when there are deposits on it. This technical solution, by monitoring the current in different regions of the wafer surface during the coating process, can promptly detect areas of uneven coating on the wafer surface; inspecting the coating apparatus when the difference in current between different regions of the wafer surface exceeds a preset difference to identify components requiring maintenance; and cleaning the coating apparatus when there are deposits, thereby improving the uniformity of the wafer coating.

An electrorefining installation has interconnectable intercell bars of the electroplating installation type that purifies metals using electrolysis. At least three cells are connected in series to one another by a set of three bars, namely, a main central bar and two lateral bars placed between each two consecutive cells. The central bar provides support and an electrical connection to one of the ends of the hangers of the cathodes of the previous cell and to one of the ends of the hangers of the anodes of the following cell. One of the lateral bars provides support and connection to all the anodes of the previous cell, and the other lateral bar provides support and connection to all the cathodes of the following cell. The installation has electric switches capable of establishing an electric bridge between the lateral bars for a short period of time causing a temporary current inversion.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

The invention provides a self-circulation cleaning conductive sliding contact group device. The self-circulation cleaning conductive sliding contact group device comprises a sealing mechanism, a stator mechanism, a rotor mechanism and a heat-conducting scrap-removing mechanism, the stator mechanism and the rotor mechanism are arranged in the sealing mechanism, and the stator mechanism surrounds the rotor mechanism; the rotor mechanism comprises a screw rod and a red copper ring, the screw rod penetrates through two ends of the sealing mechanism, and the red copper ring is nested on the screw rod; the stator mechanism comprises an electric contact and a conductive copper plate, one end of the electric contact is fixed on the conductive copper plate, and the other end of the electric contact abuts against the surface of the red copper ring; and the heat-conducting scrap-removing mechanism is connected with the sealing mechanism to form an outer circulating cooling loop for driving scraps on the surface of the electrical contact to be quickly discharged. The external circulation cooling loop is additionally arranged, so that powder scraps caused by sliding contact interface abrasion are rapidly taken away, the stability of the conductive slip ring is improved, the service life of the conductive slip ring is prolonged, resistance heat generated by the electric contact and the red copper ring is rapidly cooled, and the temperature of the slip ring is effectively kept constant and not hot in the operation process.

The disclosure relates to a substrate holder for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate, a substrate handling system comprising a substrate holder and an immersion scanner unit and a use of a substrate holder for holding a substrate with a width in a range of 1000 to 3500 mm and a length in a range of 1000 to 4000 mm. The substrate holder for holding a substrate in a chemical and / or electrolytic surface treatment of the substrate comprises a substrate carrier and a power contact unit. The substrate carrier comprises a frame to carry the substrate. The power contact unit comprises a body, a plurality of main legs extending from the body at least partially along an edge of the substrate carrier and a plurality of side legs each arranged essentially perpendicular at one of the main legs to contact the substrate. The power contact unit further comprises a plurality of retaining elements provided between the body of the power contact unit and the frame of the substrate carrier to keep the substrate in contact with the power contact unit when the substrate is placed onto the substrate carrier.

The present disclosure provides a substrate holder including a centering pin that does not push a substrate any farther toward the center than a designed position, even if a first holding member deviates from the designed position relative to a second holding member, when positioning the substrate. The substrate holder according to the present disclosure includes the first holding member and the second holding member. The second holding member includes a positioning member for positioning the substrate at a predetermined position, and a stopper. The positioning member includes the centering pin movable between a first position and a second position, and is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts a peripheral edge of the substrate to position the substrate at the predetermined position. The first holding member includes a driving member configured to bias the centering pin toward the first position, when the first holding member and the second holding member hold the substrate. The stopper is configured to contact the centering pin to stop the centering pin at the first position.

The invention discloses an electric connector for electroplating and a full-automatic wafer horizontal electroplating device.The connector comprises a rotating motor, a fixing base, a lifting air cylinder, a lifting connecting plate, a material containing disc, a material pressing disc, a lifting positioning disc and an electric connector body, the rotating motor is installed on the fixing base and connected with the material pressing disc, and a guide hole is formed in the lifting positioning disc; according to the electric connector, the electric connector body with the elastic deformation connector is arranged, and the electric connector body is annular, so that the electric connector can be better electrically connected with a product, the uniformity of electric connection is realized, and the electric connector has the advantages of being simple in structure, convenient to use and high in practicability. And meanwhile, the material carrying disc can be driven by the rotating motor to rotate, so that the better electroplating effect is achieved, and automatic clamping is achieved through the lifting air cylinder, so that automatic operation is achieved.