1479 results about "Metal deposition" patented technology

A microfluidic device having integrated components for conducting chemical operations. Depending upon the desired application, the components include electrodes for manipulating charged entities, heaters, electrochemical detectors, sensors for temperature, pH, fluid flow, and other useful components. The device may be fabricated from a plastic substrate such as, for example, a substantially saturated norbornene based polymer. The components are integrated into the device by adhering an electrically conductive film to the substrate. The film may be made of metal or an electrically conducting ink and is applied to the device through metal deposition, printing, or other methods for applying films. Methods for reducing bubble formation during electrokinetic separation and methods for heating material in a microfluidic device are also disclosed.

To provide a very-low-cost and short-TAT connection structure superior in connection reliability in accordance with a method for three-dimensionally connecting a plurality of semiconductor chips at a shortest wiring length by using a through-hole electrode in order to realize a compact, high-density, and high-function semiconductor system. The back of a semiconductor chip is decreased in thickness up to a predetermined thickness through back-grinding, a hole reaching a surface-layer electrode is formed at a back position corresponding to a device-side external electrode portion through dry etching, a metallic deposit is applied to the sidewall of the hole and the circumference of the back of the hole, a metallic bump (protruded electrode) of another semiconductor chip laminated on the upper side is deformation-injected into the through-hole by compression bonding, and the metallic bump is geometrically caulked and electrically connected to the inside of a through-hole formed in an LSI chip. It is possible to realize a unique connection structure having a high reliability in accordance with the caulking action using the plastic flow of a metallic bump in a very-low-cost short-TAT process and provide a three-dimensional inter-chip connection structure having a high practicability.

The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be suitably oxidized to a higher oxidation state electrochemically. Exposing a part to be plated (such as an organic resin, e.g. a printed circuit board substrate) to the solution enables reactive hydroxyl species (e.g. hydroxyl radicals) to be generated and to texture the polymer surface. Such texturing facilitates good plated metal adhesion. As part of this contacting process sufficient time is allowed for both surface texturing to take place and for the oxidized metal activator to adsorb onto said part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form, or a lower oxidation state. That reduction can result in the formation of metallic catalytic material over the surface of the part. The reduced metal activator can then function to catalyze the electroless deposition of metal such as copper from solution by contacting the part with the plating solution.

A method of depositing a hard wear resistant surface onto a porous or non-porous base material of a medical implant. The medical implant device formed by a Laser Based Metal Deposition (LBMD) method. The porous material of the base promotes bone ingrowth allowing the implant to fuse strongly with the bone of a host patient. The hard wear resistant surface provides device longevity when applied to bearing surfaces such as artificial joint bearing surface or a dental implant bearing surface.

The invention is directed to enhanced methods for detecting an analyte of interest in situ, by immunoassay, or by hybridization comprising binding an enzyme-labeled conjugate molecule to an analyte of interest in the presence of a redox-inactive reductive species and a soluble metal ion. The enzyme catalyzes the conversion of the inactive reductive species to an active reducing agent, which in turn reduces the metal ion to a metal atom thereby providing an enhanced means of detecting the analyte via metal deposition.

A method of improving the breakdown strength of polymer multi-layer (PML) capacitors is provided and of providing a window in food packaging is provided. The method comprises patterning the aluminum coating, either by selective removal of deposited aluminum or by preventing deposition of the aluminum on selected areas of the underlying polymer film. Apparatus is also provided for patterning metal deposition on polymer films comprising masking for defining regions in which metal is deposited. The apparatus comprises: (a) a rotating drum; (b) a monomer evaporator for depositing a monomer film on the rotating drum; (c) a radiation curing element for curing the monomer film to form a cross-linked polymer film; and (d) a resistive evaporator for depositing a metal film on the cross-linked polymer film. The foregoing elements are enclosed in a vacuum chamber. The masking comprising one of the following: (e1) a web mask provided with openings for depositing the metal film therethrough, the web mask including a portion adapted for positioning between the resistive evaporator for depositing the metal film on the cross-linked polymer film and the rotating drum; or (e2) a rotating element for transferring liquid from a source to the rotating drum, the rotating element adapted to transfer the liquid to the rotating drum after the monomer evaporator for depositing the polymer film and before the resistive evaporator for depositing the metal film.

A method and apparatus for forming layers on a substrate comprising depositing a metal seed layer on a substrate surface having apertures, depositing a transition metal layer over the copper seed layer, and depositing a bulk metal layer over the transition metal layer. Also a method and apparatus for forming a via through a dielectric to reveal metal at the base of the via, depositing a transition metal layer, and depositing a first metal layer on the transition metal layer. Additionally, a method and apparatus for depositing a transition metal layer on an exposed metal surface, and depositing a layer thereover selected from the group consisting of a capping layer and a low dielectric constant layer.

The invention discloses a transparent conducting electrode using a graphene film as a GaN-based LED (light-emitting diode) or ultraviolet light detector and a manufacture method and applications thereof. The graphene film is solidified and bonded on the surface of the GaN substrate of the LED or ultraviolet light detector. The transparent graphene conducting film is prepared by adopting a chemical vapor deposition or reduction-oxidation method, and the GaN-based LED or ultraviolet light detector is manufactured by utilizing a micromachining photoetching, etching and metal deposition method; the graphene film is moved to the p-type GaN-based substrate of the LED or ultraviolet light detector to serve as the transparent conducting electrode instead of ITO or Ni/Au. In the invention, the graphene film is used as the transparent conducting electrode, which can realize low-cost and high-brightness luminescent devices and expands the applications of carbon nanometer materials in the field of GaN-based photoelectric devices.

The present invention provides a surface preparation process using adsorbed halogen. The halogen is applied in a gas phase with UV light. The adsorbed halogen is subsequently modified in another gas phase reaction. The halogen may be reacted with water to form a hydroxyl-bearing Si—O monolayer that forms a layer for subsequent metal deposition. In one aspect the halogen layer is reacted with an alkyl or alkoxy of the formula R-OH to form a passivation layer. By replacing hydrogen atom termination with alkoxy (e.g.methoxy termination, —OCH₃). The selective deposition process can be used for passivating and depositing thin metal films on material surfaces composed of any combination of the group consisting of semiconductors, conductors, insulators, and the like.

The present invention relates to methods for producing metal-coated palladium or palladium-alloy particles. The method includes contacting hydrogen-absorbed palladium or palladium-alloy particles with one or more metal salts to produce a sub-monoatomic or monoatomic metal- or metal-alloy coating on the surface of the hydrogen-absorbed palladium or palladium-alloy particles. The invention also relates to methods for producing catalysts and methods for producing electrical energy using the metal-coated palladium or palladium-alloy particles of the present invention.

A method for forming signal conduits before encapsulation for incorporation as through vias in a semiconductor device package is provided. One or more signal conduits are formed through photolithography and metal deposition on a metal film or substrate. After removing photoresistive material, the semiconductor device package is built by encapsulating the signal conduits along with any semiconductor die and other parts of the package. The ends of the signal conduits are exposed and the signal conduits can then be used as through vias, providing signal-bearing pathways between interconnects or contacts on the bottom and top of the package, and electrical contacts of the semiconductor die. Using this method, signal conduits can be provided in a variety of geometric placings in the semiconductor device package. A semiconductor device package including the signal conduits made from the above method is also provided.

This invention relates to a solid divided composition comprising grains whose mean size is greater than 25 μm and less than 2.5 mm, wherein each grain is provided with a solid porous core and a homogeneous continuous metal layer consisting of at least one type of transition non-oxidised metal and extending along a gangue coating the core in such a way that pores are inaccessible. A method for the production of said composition and for the use thereof in the form of a solid catalyst is also disclosed.

A method for depositing superalloy materials. A layer of powder (14) disposed over a superalloy substrate (12) is heated with an energy beam (16) to form a layer of superalloy cladding (10) and a layer of slag (18). The layer of powder includes flux material and alloy material, formed either as separate powders or as a hybrid particle powder. A layer of powdered flux material (22) may be placed over a layer of powdered metal (20), or the flux and metal powders may be mixed together (36). An extrudable filler material (44) such as nickel, nickel-chromium or nickel-chromium-cobalt wire or strip may be added to the melt pool to combine with the melted powder to give the superalloy cladding the composition of a desired superalloy material.

Multiple criteria are monitored and controlled to enhance the success of direct-metal deposition, including greater control over factors such as deposit layer height/thickness, sub-harmonic vibration, contour path shape, powder mass flow, and deposition speed, and stress accumulation. Sensors are used to monitor some or all of the following parameters during the deposition process: deposit height, width, temperature, and residual stress. A predetermined limit with respect to the yield strength of the material is preferably set. If the stress exceeds that limit sensors will automatically introduce one or more remedial measures, the priority of which is established using a look-up table generated in accordance with prior experimental knowledge. To control temperature induced distortion and stress, an infrared temperature detector may be used in conjunction with a controller to reduce temperature, increase speed and decreased power for purpose of stress management.

A method is provided for depositing a hard wear resistant surface onto a porous or non-porous base material of a medical implant. The wear resistant surface of the medical implant device may be formed by a Laser Based Metal Deposition (LBMD) method such as Laser Engineered Net Shaping (LENS). The wear resistant surface may include a blend of multiple different biocompatible materials. Further, functionally graded layers of biocompatible materials may be used to form the wear resistant surface. Usage of a porous material for the base may promote bone ingrowth to allow the implant to fuse strongly with the bone of a host patient. The hard wear resistant surface provides device longevity, particularly when applied to bearing surfaces such as artificial joint bearing surfaces or a dental implant bearing surfaces. An antimicrobial material such as silver may be deposited in combination with a metal to form an antimicrobial surface deposit.

Methods and compositions for depositing a metal containing film on a substrate are disclosed. A reactor and at least one substrate disposed in the reactor are provided. A metal containing precursor is provided and introduced into the reactor, which is maintained at a temperature of at least 100° C. A metal is deposited on to the substrate through a deposition process to form a thin film on the substrate.

A method of separating, concentrating or purifying uniform carbon nanotubes with desired properties (diameter, chiral vector, etc) in a highly sensitive manner by the use of structure-sensitive properties peculiar to carbon nanotubes; and an apparatus therefor. There is provided a method of separating, concentrating, or purifying carbon nanotubes with the desired properties contained in a sample, comprising the steps pf (a) irradiating a sample containing carbon nanotubes with light; and (b) selecting carbon nanotubes with desired properties. In a preferred embodiment, the light irradiation of the step (a) can be carried out in the presence of a metal so as to cause specified carbon nanotubes to selectively induce a photocatalytic reaction, resulting in metal deposition. Further, in a preferred embodiment, a given magnetic filed can be applied in the steps (b) so as to attain accumulation or concentration or carbon nanotubes with metal deposited.

A method of modeling multiple material parts for additive manufacturing processes such direct metal deposition operates within the constraints of a single material CAD system. Each material is modeled separately as a single or multiple solid part, under the assumption that there are no internal multiple materials; that is, no voids for other material parts. The parts are ordered from the outer most geometry to the innermost geometry and Boolean operations are performed to calculate the final volume for each part. In use of the invention, should any design changes occur, only the parts as originally defined need to be modified, and the method is reapplied. The method is applicable to the generation of CAM cutting paths for 2½-D and 3-D geometries by pocket machining with spiral-in, spiral-out, and arbitrary direction raster tool paths using stock material with and without reflection, depending upon the geometry. Single- and multi-material files may be merged one toolpath file, and commands may be embedded for closed- or open-loop control of the fabrication process.