2189results about "Electric circuits" patented technology

An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.

The invention provides a method for determining the concentration of an analyte in a sample comprising the steps of heating the sample and measuring the concentration of the analyte or the concentration of a species representative thereof in the sample at a predetermined point on a reaction profile by means that are substantially independent of temperature. Also provided is an electrochemical cell comprising a spacer pierced by an aperture which defines a cell wall, a first metal electrode on one side of the spacer extending over one side of the aperture, a second metal electrode on the other side of the spacer extending over the side of the aperture opposite the first electrode, means for admitting a sample to the cell volume defined between the electrodes and the cell wall, and means for heating a sample contained within the cell.

An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

The invention features a flow-through capacitor system that achieves enhanced power efficiency by sequential control and actuation of at least two or more flow-through capacitor cells within the flow-through capacitor system. Alternatively or in addition, power efficiency is enhanced by integrating the purification stages of the system, for example, by placing more than one cell within a single cell casing. Preferably, integrated stage flow-through capacitors are controlled sequentially.

The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.

An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer includes an end-point detector. The end-point detector is disposed adjacent the nozzle used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.

A novel method and apparatus of wet processing workpieces, such as electroplating semiconductor wafers and the like, that incorporates reciprocating processing fluid agitation to control fluid flow at the workpiece, and where electric fields are involved as in such electroplating, controlling the electric field distribution.

A master mould is made by wire cutting a plate in two or more directions to provide a base with an array of master mould needles protruding therefrom. The size and shape of the master mould needles can readily be varied by varying the angles of upward and downward cuts in the two or more directions. The master mould is used to make a secondary mould by hot embossing a secondary mould plate onto the master mould. This forms through-holes in the secondary mould. The secondary mould is plated with a layer of metal, which forms a microneedle array.

A fully automatic deionizer comprising five sub-systems for removing ionic contaminants from various liquids at low energy consumption is devised. Based on the charging-discharging principle of capacitors, the deionizer conducts deionization through applying a low DC voltage to its electrodes for adsorbing ions, while more than 30% of the process energy is recovered and stored by discharging the electrodes. At the mean time of discharge, surface of the electrodes is regenerated on site and reset for performing many more cycles of deionization-regeneration till the desirable purification is attained. In one moment, both deionization and regeneration proceed simultaneously on different groups of electrode modules, and in the next moment the electrode modules quickly switch the two processes. Such swift reciprocating actions are engaged in synchronized coordination of sub-systems of electrode modules, energy management, fluid flow, and automatic control.

Apparatus and methods for determining the individual states of charge of electrolytes in a redox battery with mixed or unmixed reactants by optical absorption spectrophotometry are disclosed. The state of charge thus obtained may serve as a gauge for the amount of electro-chemical energy left in the system. Further, the information on anolyte and catholyte charge states may be used for any rebalancing mechanism if the states are different.

Provided herein are the concept that “singularity-based configuration” electrodes design and method can produce in an ionic substance local high electric fields with low potential differences between electrodes. The singularity-based configuration described here includes: an anode electrode; a cathode electrode; and an insulator disposed between the anode electrode and the cathode electrode. The singularity-based electrode design concept refers to electrodes in which the anode and cathode are adjacent to each other, placed essentially co-planar and are separated by an insulator. The essentially co-planar anode / insulator / cathode configuration bound one surface of the volume of interest and produce desired electric fields locally, i.e., in the vicinity of the interface between the anode and cathode. In an ideal configuration, the interface dimension between the anode and the cathode tends to zero and becomes a point of singularity.

A method for electrofilling large, high aspect ratio recessed features with copper without depositing substantial amounts of copper in the field region is provided. The method allows completely filling recessed features having aspect ratios of at least about 5:1 such as at least about 10:1, and widths of at least about 1 μm in a substantially void-free manner without depositing more than 5% of copper in the field region (relative to the thickness deposited in the recessed feature). The method involves contacting the substrate having one or more large, high aspect ratio recessed features (such as a TSVs) with an electrolyte comprising copper ions and an organic dual state inhibitor (DSI) configured for inhibiting copper deposition in the field region, and electrodepositing copper under potential-controlled conditions, where the potential is controlled not exceed the critical potential of the DSI.

An automated self-propelled pool cleaner having a housing, a water pump for moving water through the housing, drive means for moving the pool cleaner over the surface of the salt water pool to be cleaned, and an integral electrochemical chlorine generator mounted in the housing, includes a processor / controller that is programmed to activate the chlorine generator, the pump and drive means in predetermined operational sequences that minimize wear and tear on the water pump and drive means, while at the same time distribute and maintain a safe level of sanitizing chlorine in the pool, to thereby obviate the need for an in-line chlorinator or other chemical additive treatments; an optional automated sensor device can be provided to activate a secondary maintenance program which enables the pool cleaner to operate over prolonged periods of time as the sole means for filtering and sanitizing the pool water. An electrochemical cell manual mounting system permits the cell to be secured in place for operation and manually removed for maintenance, repair or replacement by the user without special tools or training.

An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

In an electrochemical reactor used for electrochemical treatment of a substrate, for example, for electroplating or electropolishing the substrate, one or more of the surface area of a field-shaping shield, the shield's distance between the anode and cathode, and the shield's angular orientation is varied during electrochemical treatment to screen the applied field and to compensate for potential drop along the radius of a wafer. The shield establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film of conductive metal on the wafer.

An apparatus for producing electrolyzed water includes an electrochemical cell and a solution reservoir containing a solution and having an outlet. An injection pump has an input end in fluid communication with the outlet of the solution reservoir and an output end in fluid communication with the electrochemical cell, wherein the injection pumps an amount of the solution from the solution reservoir to mix with a water solution and enter the electrochemical cell. A current feedback sensor senses a cell current in the electrochemical cell. A current control unit in data communication with the current feedback sensor and the injection pump wherein the current control unit compares the cell current with a preselected current and adjusts the amount of solution pumped from the injection pump responsive to the comparison. The apparatus may also include an automatic control feedback system to monitor and adjust pH.

An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

There is provided an apparatus for producing strong alkaline reductive electrolyzed water and acidic water that enables efficient production of electrolyzed water that has excellent washing and sterilizing effects. There is provided an apparatus for producing strong alkaline reductive electrolyzed water and acidic water, which includes an electrolyzer provided with a strong alkaline reductive electrolyzed water-producing chamber, an acidic water-producing chamber and a partitioning membrane, wherein a flow path diffusing device is provided in the electrolyzer, and a gap between the cathode plate and the anode plate of 0.1 mm to 1 mm.

The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate electrically, and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises a plurality of anode elements arranged in rows.

A direct-metal deposition (DMD) processing stage and a 5DOF (degree of freedom) dry micro-EDM (mEDM) stage are integrated to provide the submicron scale resolution necessary for the ultra-precision processing of work pieces. The DMD processing stage includes optical feedback for dimensional control utilizing a high-power, fiber-coupled diode laser with fast response time and small beam parameter product. The electrical discharge machining (EDM) stage is a dry EDM stage using an inert gas with appropriate dielectric properties to perform the surface finishing operations. The system further includes one or more surface treatment operations to obtain a desired level of surface hardness or wear resistance and / or to minimize the distortion induced in treating the surface.

An electro-galvanic hydrogen generator system that has two or more anode materials; a cathode material; and an electrolyte. The electrolyte comprises a metal hydride, at least one stabilizing agent, and a solvent. Hydrogen gas is generated whenever an anode material and the cathode material are electrically connected, and the different anode materials can be used separately or in combination to control the quantity and rate of hydrogen generation. An insulating shield may be used to catch reaction debris from the anodes. A removable inert layer may cover the electrodes. The use of cell pressure may regulate the rate of hydrogen generation. The hydrogen generator may have a separate catalyst chamber, and the hydrogen generator may also function as a battery.

A solar electrolysis power co-generation system includes a solar electrolysis source and a control unit. The solar electrolysis source includes a solar panel, an electrolysis unit, a hermetically sealed compressor, a hydrogen tank, and a hydrogen-powered fuel cell and produces, compresses, and stores hydrogen gas that is used to fuel the fuel cell. The control unit includes an inverter, a microprocessor, and a modem. The control unit connects the solar electrolysis power source with a power grid and with an individual consumer having an electrical load. The power co-generation system utilizes the electrolysis of water and solar energy to power a fuel cell. The energy produced with the fuel cell may be provided to an existing power gird as well as to an individual consumer. Further a method for decentralized power co-generation includes the step of providing a plurality of solar electrolysis power co-generation systems.

An apparatus for electroplating a layer of metal on the surface of a wafer includes a second cathode located remotely with respect to the wafer. The remotely positioned second cathode allows modulation of current density at the wafer surface during an entire electroplating process. The second cathode diverts a portion of current flow from the near-edge region of the wafer and improves the uniformity of plated layers. The remote position of second cathode allows the insulating shields disposed in the plating bath to shape the current profile experienced by the wafer, and therefore act as a “virtual second cathode”. The second cathode may be positioned outside of the plating vessel and separated from it by a membrane.

Various embodiments of a planarization device and methods of using the same are provided. In one aspect, a device for planarizing a surface of a semiconductor workpiece is provided that includes a table for holding a quantity of an electrically conducting solution thereon. A member is included for holding the semiconductor workpiece such that the surface is in contact with the solution and operates as a working electrode. The member has a first conductor for establishing electrical connection with the semiconductor workpiece. A counter electrode is provided for making electrical connection with the solution and a reference electrode is provided for making electrical connection with the solution with a known electrode potential. A power source is operable to control the electric potential between the working electrode and the counter electrode. Slurry consumption may be dramatically reduced and static etch rate due to aborts may be virtually eliminated.

A self-sustaining, fully automated, hydrogen generator that utilizes the ocean's currents, tides, and water to produce vast amounts of hydrogen and oxygen. Additional electricity may be supplied by locally generated means including offshore wind, offshore geothermal, as well as wave powered generation. Hydrogen is exported as well as the oxygen not consumed by the life support systems. Residue collected from the ocean water purification process is collected and exported for use elsewhere or dispersed locally around the underwater facility. Systems orchestration is achieved by control systems that operate independently of one another with no single point of failure.

Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area.

A cathode containing a metal substrate that possesses a micro-roughened surface imparted by spark anodization is provided. The surface is formed by contacting the substrate with an electrolytic solution and applying a voltage to form a dielectric sub-oxide layer. The voltage is raised to a sufficiently high level to initiate “sparking” at the surface of the substrate, which is believed to create high local surface temperatures sufficient to etch away the substrate. This results in the formation of a “micro-roughened” surface having a plurality elevated regions. These elevated regions can increase the effective surface area and thus allow for the formation of capacitors with increased cathode capacitance for a given size and / or capacitors with a reduced size for a given capacitance. The elevated regions may also exhibit excellent adhesion to additional electrochemically-active materials and provide enhanced stability in certain liquid electrolytes.

A method and apparatus are provided for the electroplating of a substrate such as a semiconductor wafer which provides a uniform electroplated surface and minimizes bum-through of a seed layer used on the substrate to initiate electroplating. The method and apparatus of the invention uses a specially defined multistep electroplating process wherein, in one aspect, a voltage below a predetermined threshold voltage is applied to the anode and cathode for a first time period followed by applying a current to the anode and cathode for a second time period the current producing a voltage below the predetermined threshold voltage. In another aspect of the invention, a current is applied to the anode and cathode substrate which current is preprogrammed to ramp up to a current value from a first current value which current produces a voltage below a predetermined threshold voltage. Electroplated articles including copper electroplated semiconductor wafers made using the apparatus and method of the invention are also provided.

A method for optimizing the efficiency of a solar powered hydrogen generation system is disclosed. The system utilizes photovoltaic modules and a proton exchange membrane electrolyzer to split water into hydrogen and oxygen with an efficiency greater than 12%. This high efficiency for the solar powered electrolysis of water was obtained by matching the voltage generated by photovoltaic modules to the operating voltage of the electrolyzer. Optimizing PV-electrolysis systems makes solar generated hydrogen less expensive and more practical for use as an environmentally clean and renewable fuel.

A semiconductor electroplating process deposits copper into the through silicon via hole to completely fill the through silicon via in a substantially void free is disclosed. The through silicon via may be more than about 3 micrometers in diameter and more that about 20 micrometers deep. Low copper concentration and high acidity electroplating solution is used for deposition copper into the through silicon vias.