244 results about "Pulse power supply" patented technology

The invention provides an under-water discharge machining system and method for a radiation environment. The under-water discharge machining system comprises a pulse power supply control system, an electric spark machining head device and a servo control system. The pulse power supply control system comprises a power supply control box, a rectifier and a power amplifier which are electrically connected in sequence. And the power amplifier is electrically connected with the servo control system and the electric spark machining head device. The electric spark machining head device is provided with a feedback signal wiring connected to the servo control system. The pulse power supply control system is matched with the servo control system to drive the electric discharge machining head device to guarantee the process of the workpiece to be machined, so that the problem that conventional electric discharge machining equipment cannot be used in the high-radiation and boron-containing water environment is solved.

The utility model belongs to the technical field of pulse power supplies, and particularly discloses a pulse power supply circuit, which comprises a power supply input module, a PWM (Pulse Width Modulation) signal input module, a feedback control module, a control chip and an output module, the power input module provides working power for the control chip and the whole circuit. The PWM signal input module is used for transmitting an external PWM signal to a signal input pin of the control chip; the feedback control module collects an electric signal in the circuit and transmits a processed feedback signal to the control chip; the control chip drives the output module to output a pulse power supply to provide electric energy for a load based on an input PWM signal and a feedback signal. According to the utility model, the feedback signal acquired by the feedback control module is compared with the reference voltage, the difference value is amplified, the control chip adjusts the duty ratio of the PWM signal according to the amplified error signal, the pulse waveform is effectively optimized, and the output stability and reliability of the pulse power supply are improved.

The invention relates to the technical field of nanotechnology, and discloses a high-concentration nitrogen nanobubble generation method based on multi-mechanism synergy, which comprises the following steps of: simultaneously applying a multi-stage vortex for generating turbulent flow and shearing force and periodically pressurizing and depressurizing the inside of a cavity to a water sample of supersaturated dissolved nitrogen flowing into the cavity, and in the process of reducing the pressure in the cavity, a pulse electric field which is synchronous with the frequency and the phase of the periodic pressure increasing and reducing is applied, and coalescence between interfaces of the continuously generated initial nanobubbles is inhibited through the pulse electric field. A pressure oscillation cavity of the device is provided with a water sample input port and a target concentration nitrogen nanobubble water sample output port, a multi-stage eddy current system for generating turbulent flow is fixedly arranged in the cavity, a pressure adjusting system capable of forming periodic pressure oscillation is communicated with the outside of the cavity, and an electric field generating system containing a relative electrode and a pulse power supply is arranged in the cavity. And the self-adaptive control unit monitors the pressure oscillation frequency and phase in real time and controls the pulse power supply to output a synchronous pulse electric field in a voltage reduction stage.

The invention belongs to the technical field of machining and intelligent manufacturing, and particularly relates to an intelligent regulation and control system and method for discharge energy of a spark machine. Comprising a multi-mode gap state sensing module, a high-throughput data synchronous acquisition and preprocessing module, a discharge pulse real-time classification and feature extraction module, an LSTM-based gap state trajectory prediction module, a multi-target model prediction control module and a high-frequency pulse power supply execution module. By fusing the electrical parameters and the in-situ optical turbidity signal, multi-dimensional perception of the discharge state is realized, the future discharge trend is predicted by using an LSTM network, and an optimal pulse parameter combination is solved online by combining an MPC controller. By the adoption of the technical scheme, dynamic optimal balance of the material corrosion rate, the surface quality and the stability in the machining process can be achieved, and the overall machining benefit is improved.

1. Name of the product in this design: Pulse Power Supply. 2. Purpose of this design: This design is used to provide base voltage and pulse voltage for the load electric field. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The invention belongs to the technical field of pulse power supply performance index measurement and system calibration, and provides an accelerator injection pulse power supply dynamic performance measurement and in-situ calibration system and method. The system comprises a multi-branch parallel acquisition hardware layer which adopts a multi-branch parallel output structure, is equipped with a Hall sensor array and a standard sensor mounting position for calibration, and is connected with a data acquisition and processing system; an instrument channel and system level calibration module and a dynamic performance index measurement and calculation module are further arranged; according to the invention, the consistency of measurement data of multiple power supplies is ensured through a standardized calibration process; the output capability of the power supply is matched with a standard sensor to realize system-level in-situ calibration, so that the calibration efficiency and accuracy are improved; adopting a zero-phase filtering and waveform shift synchronization technology to accurately calculate waveform tracking precision and flat-topped stability; the shunt measurement Hall array structure adapts to the characteristics of a high-power pulse power supply, and the measurement accuracy and reliability are ensured.

The application belongs to the field of special composite machining, and more particularly relates to a waveguide laser electrolysis composite machining device and method, which comprises a laser, a CCD camera, a pulse power supply, and a reflector, a focusing mirror, a liquid supply system and a conductive nozzle arranged in sequence from top to bottom; the CCD camera is arranged above the reflector; the laser is arranged on one side of the reflector, and the emitted light is refracted by the reflector, then passes through the focusing mirror, the liquid supply system and the conductive nozzle in sequence, and irradiates on the surface of a part to be machined; the anode of the pulse power supply is connected to the part to be machined, and the cathode is connected to the conductive nozzle; the outer surface of the conductive nozzle is sleeved with a synchronous belt, and the conductive nozzle is connected to the driving shaft of a driving device through the synchronous belt. The application utilizes the difference in laser refractive index between the electrolyte and the low refractive layer to make the laser realize total reflection between the electrolyte and the low refractive layer, adopts an inert electrolyte, reduces the loss of laser energy in the propagation process, and realizes the maximization of laser energy.

1. Name of the product in this design: General Purpose Pulse Power Supply. 2. Purpose of this design: To integrate supercapacitor modules with general-purpose power supplies to achieve energy storage and power conversion. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The invention discloses a preparation method of a low-temperature plasma plating and permeating modified layer on the surface of a metal mold. The preparation method comprises the following steps: S1, precise pretreatment of a base body: sequentially carrying out mechanical grinding and polishing and ultrasonic cleaning on the base body, and then drying and putting the base body in a vacuum chamber; s2, plasma activation: after vacuumizing, introducing mixed gas of argon and hydrogen, generating glow discharge under the action of a pulse power supply, and performing sputtering activation on the surface of the substrate; s3, gradient transition layer plasma deposition is conducted, specifically, a pulse direct-current plasma source is adopted, a Ti target and a Cr target serve as sputtering sources, and a transition layer with components changing in a gradient mode is prepared; s4, plating and permeating a multi-element synergistic functional layer: preparing the functional layer by adopting a radio frequency-pulse direct-current composite plasma source, namely a Ti target, a Cr target, a Si-Al alloy target and a rare earth element target through synergistic sputtering; and S5, post-treatment optimization: performing vacuum cooling to room temperature after low-temperature annealing treatment to obtain a final modified layer. The permeation modified layer prepared by the method has high binding force, high hardness, high wear resistance and salt spray corrosion resistance.

Provided in the present application are a power module of a pulse power supply, a wafer carrier device, and semiconductor process equipment. The power module of a pulse power supply comprises: a board card (6) having a first board surface and a second board surface opposite each other; a power tube (7) arranged on the first board surface; a cooling device (8) which is arranged on a side facing the first board surface of the board card and is in thermally conductive connection with the power tube; a dissipative element (9) which is a surface-mounted element and is arranged on the first board surface and in thermally conductive connection with the cooling device; and a common-mode choke (10) arranged on the second board surface, wherein a secondary-side cable (103) of the common-mode choke (10) passes through the board card and is electrically connected to the dissipative element. In the structure, the common-mode choke, and the power tube and the cooling device are respectively located on two sides of the board card, such that the power module of a pulse power supply can have an optimized structural layout, and thus can be disposed in an internal space of semiconductor process equipment; the dissipative element that cooperates with the common-mode choke is a small-sized surface-mounted element, and can be disposed on the side where the cooling device is located and cooled by the cooling device, thereby avoiding EMI in the internal space of the semiconductor process equipment.

The invention provides a node type intelligent electrode system for a high-density electrical method, which comprises a plurality of intelligent node electrodes, each intelligent node electrode comprises a control unit, a high-precision measurement module, a controllable voltage module, an energy module and a positioning and state sensing module, and the control unit is used for controlling node operation, data processing and communication coordination; the high-precision measurement module is used for measuring the potential difference between measurement electrodes, monitoring the magnitude of power supply current in real time and executing ground resistance self-inspection; the controllable voltage module is used for generating a pulse power supply signal with a controllable current direction; the energy module is connected with the control unit, the high-precision measurement module and the controllable voltage module and is used for providing electric energy for the nodes; and the positioning and state sensing module is used for automatically recording the geographical location information of the nodes and sensing the arrangement state of the electrodes. The intelligent electrode has the advantages that the intelligent electrode is completely wireless, efficiency and adaptability are improved, reliability is high, real intelligence is achieved, and expansibility is high.

The application relates to a negative ion water hydrate conversion air negative ion device which comprises an insulating water containing volume and a positive and negative electrode device arranged in the insulating water containing volume, the positive and negative electrode device is connected with a negative pulse power source through a wire, a positive electrode layer in the positive and negative electrode device is wrapped with an insulating layer, a water passing electric field gap serving as a circulating channel of water is arranged between the positive electrode layer and a negative electrode layer in the positive and negative electrode device, the water passing electric field gap is connected with an inlet channel of a circulating pump through an insulating pipeline, the circulating pump is made of an insulating material or is in an electrically conductive isolated state with zero potential of the ground, an outlet of the circulating pump is connected with an atomization device through an insulating pipeline to atomize negative ion water into atomized negative ion water, and the atomized negative ion water is gasified into air negative ions through an air dehumidifier drying method or a negative pressure volume cavity negative pressure mode. The application does not generate ozone, the ecological grade air negative ion concentration is high, the migration distance is far, and the application is suitable for a wide range of scenes.

This invention relates to a non-contact, low-temperature, intermittent heat exchange pulsed-dynamic electrolytic machining apparatus and method, belonging to the field of electrolytic machining. The apparatus consists of a blade workpiece, a cathode plate, a cathode holder, and an insulating sleeve. The cathode plate undergoes high-frequency reciprocating vibration during radial feeding, coordinated with the synchronous switching of a pulse power supply, to achieve pulsed-dynamic electrolytic machining. In this pulsed-dynamic electrolytic machining method, the cooling medium flows into the insulating sleeve from the inlet of the cooling channel, flows through the cooling channel, and then flows out from the outlet of the cooling channel, reducing the temperature inside the insulating cavity. As the blade is shaped and enters the insulating cavity, the cooling medium undergoes convective intermittent heat exchange with the stray electrolyte within the cooling channel, reducing the temperature and conductivity of the stray electrolyte, and even freezing the stray electrolyte, creating a low-temperature environment around the shaped blade and inhibiting the electrolytic reaction in the stray corrosion zone. Pulsed-dynamic machining promotes the removal of electrolytic products and heat, further improving machining accuracy and surface quality.

The present application relates to the technical fields of spectral analysis and substance detection, and discloses a deuterium lamp device and an atomic absorption spectral analysis method and system using the deuterium lamp. The system comprises a hollow cathode lamp unit, a built-in hollow cathode lamp emitting a first light beam after preheating under power supply; a first lens, a second lens and a third lens, a deuterium lamp device for emitting a second light beam at a first frequency under the driving of a pulse power supply; a sample cell for internally placing a sample to be measured in a combustion state; a monochromator for performing spectral processing on the incoming first light beam and / or the second light beam, and outputting the spectrally processed light signal to a photoelectric detector; the photoelectric detector for photoelectrically converting the light signal output by the monochromator to obtain an electric signal; and a data processing unit for analyzing and processing the electric signal of the photoelectric detector to obtain an analysis result. The present application can realize more accurate background deduction and improve the accuracy and reliability of atomic absorption spectral measurement.

The utility model relates to the technical field of pulse power supplies, and provides a mounting structure of a pulse power supply, which comprises a power supply body, mounting plates are fixedly mounted on two sides outside the power supply body, rotating rods are arranged outside the two mounting plates, fixing blocks are fixedly connected outside the two rotating rods, and the fixing blocks are fixedly connected with the power supply body. Rotating plates are fixedly connected to the exteriors of the two fixing blocks, through holes are formed in the interiors of the two rotating plates, a clamping plate is arranged on one side of the power source body, a shell is fixedly connected to one side of the exterior of the clamping plate, a plate body is fixedly connected to the interior of the shell, and springs are fixedly connected to the two sides of the exterior of the plate body; the outer ends of the two springs are fixedly connected with sliding columns, the outer portions of the two sliding columns are fixedly connected with rod bodies, two pull rods are arranged on one side of the rear portion of the power source body, and a rotating rod is movably connected with a mounting plate through a damping bearing. By means of the technical scheme, the problem that in the prior art, a power source is inconvenient to disassemble and assemble rapidly is solved.

This invention relates to the field of thin film technology, specifically disclosing a method and a thin film for preparing single-crystal TiN thin films based on pulsed DC magnetron sputtering. The method includes: placing a substrate into the sputtering chamber of a magnetron sputtering apparatus, evacuating and heating it to 400°C; introducing an activation gas and performing initial magnetron sputtering on a titanium target at a sputtering threshold to form an adhesion-promoting layer on the substrate surface; turning off the activation gas and then introducing a reactive sputtering gas into the sputtering chamber; then performing high-intensity sputtering while simultaneously turning on a bias power supply, wherein the bias power supply is a synchronous pulse power supply that is inversely phase to the pulsed DC power supply; turning off the pulsed DC power supply and the introduction of nitrogen in the reactive sputtering gas, and continuing magnetron sputtering on the substrate; cycling 2-4 times to cool to room temperature to obtain a single-crystal TiN thin film. In this application, the substrate temperature is only 400°C during deposition, thus reducing energy consumption and shortening the time during subsequent cooling. The titanium nitride thin film prepared in this application exhibits a high sputtering deposition rate and high crystal quality.

The invention discloses a multi-layer aluminum core copper-clad plate based on a plasma anodic oxidation coating and further discloses a preparation method of the copper-clad plate, and the preparation method comprises the following steps: pretreating an aluminum core; performing plasma anodic oxidation by adopting a pulse power supply, and generating an aluminum oxide ceramic insulating layer on the surface of the aluminum core in situ; positioning and drilling the aluminum core, and sealing the hole with insulating resin; adhering copper foils to the two sides of the aluminum core to form a double-sided plasma anodic oxidation copper-clad aluminum plate; performing pattern manufacturing on the surface of the double-sided plasma anodic oxidation copper-clad aluminum plate, overlapping multiple layers of copper-clad aluminum plates, and performing hot-pressing curing; carrying out through hole processing and hole metallization on the copper-clad plate subjected to multi-layer lamination; and performing pattern manufacturing and anti-oxidation treatment on the surface of the copper-clad plate to obtain the multi-layer aluminum core copper-clad plate. The multi-layer aluminum core copper-clad plate has excellent mechanical reliability, insulation stability, longitudinal heat conduction efficiency and high-frequency signal transmission performance.

FIELD: protective coatings.SUBSTANCE: method for forming a protective oxide-ceramic coating on the surface of products made of valve metals and alloys by the plasma electrolytic oxidation method involves immersing the product as an electrode together with a counter electrode in a bath filled with an aqueous alkaline electrolyte, and supplying rectangular pulses of anodic and cathodic voltage to the electrodes using a pulsed power source. Anode and cathode voltage pulses are supplied with a current-free pause between them, the value of which is 4.8 times the duration of the anode pulse. The amplitude values of the cathode voltage pulses range from 85 to 149 V with a pulse repetition frequency from 1000 Hz to 4000 Hz, while the current pulse repetition frequency is additionally regulated.EFFECT: obtaining oxide-ceramic coatings with specified properties under reduced energy conditions, with lower values of cathode voltage.1 cl, 2 ex

This invention discloses an electric field-assisted spline cold forming method and machine tool; this invention belongs to the technical field of machining and metal plastic forming equipment; it aims to solve the problems of high load, rapid mold wear and poor forming quality in the cold forming of splines of difficult-to-deform materials such as high-strength alloy steel and titanium alloy; the positive terminal of the pulse power supply forms a circuit with the workpiece through the center and the negative terminal through the brush, so that the high-frequency pulse current flows directly through the cold forming deformation zone, inducing the electroplastic effect, reducing the yield strength of the material and improving plasticity; on this basis, the symmetrically arranged cold forming tools apply radial force to the workpiece as the spindle rotates, and the spline teeth are formed by the axial feed and rotation of the workpiece; this method deeply couples electric field softening with mechanical forming, fundamentally reducing the forming load, extending the mold life and improving the spline dimensional accuracy and surface quality.

The utility model relates to an energy storage pulse power supply, in particular to an energy storage pulse power supply capable of fast switching, which comprises a power supply cabinet and single power supply mechanisms sequentially stacked in a cavity of the power supply cabinet from top to bottom, and a fast switching structure is arranged in the cavity at the bottom of the power supply cabinet. According to the utility model, the rapid switching structure is connected in parallel in the power supply grid, so that the rapid switching structure can respond rapidly when the grid is powered off, the use effect of continuous power supply is realized through the stacked single power supply mechanisms in the power supply cabinet, the power failure time is reduced, the response speed is improved, and the power supply of the single power supply mechanisms can be cut off when the power supply of the grid is recovered. And the fourth cable is arranged between the input mechanism and the output mechanism in a sliding adjustment mode, the closing state between the input mechanism and the output mechanism can be controlled, when the input mechanism and the output mechanism are disconnected, the disconnection mechanism and the output mechanism are conducted at the moment, and the power supply use effect is achieved.

A method for digital communication over a pulsed power supply having alternating high and low voltages in which a logic ZERO is transmitted by a low voltage pulse having a first low voltage duration tlowzero, followed by a high voltage pulse having a first high voltage duration thzero, and the logic ONE is transmitted by a low voltage pulse having a second low voltage duration tlow followed by a high voltage pulse having a second high voltage duration thlight, the method comprising detecting a parameter value of at least one parameter affecting a transition time between the high voltage and the low voltage, and adjusting the first low voltage duration, tlowzero, and the second low voltage duration, tlowone, based on the parameter value (s).

A method of operating an electrochemical cell including introducing an aqueous solution into the electrochemical cell, applying a current across an anode and a cathode to produce a product, monitoring the voltage, dissolved hydrogen, or a condition of the aqueous solution, and applying the current in a pulsed waveform responsive to one of the measured parameters is disclosed. An electrochemical system including an electrochemical cell including an anode and a cathode, a source of an aqueous solution having an outlet fluidly connectable to the electrochemical cell, a sensor for measuring a parameter, and a controller configured to cause the anode and the cathode to apply the current in a pulsed waveform responsive to the parameter measurement is disclosed. Methods of suppressing accumulation of hydrogen gas within the electrochemical cell are also disclosed. Methods of facilitating operation of an electrochemical cell are also disclosed.

To realize good commutation while simplifying the circuitry and control.SOLUTION: This circuit is provided with switches V1, V3 and V4 for respectively selecting a voltage source 11 for outputting a voltage S1, a voltage source 13 for outputting a voltage S3 and a voltage source 14 for outputting a voltage S4 to an outputting terminal 10, and a current source 12 connected between the outputting terminal 10 and a ground terminal 9 through the switches S3. A control part 20 turns on the switch V1 after the voltage is lowered to the vicinity of the voltage S1 by the second half-wave resonance to maintain the voltage Vop1 at a low level, and turns on the switch S3 to make the current of the first half-wave resonance flow in a resonance loop including a capacitor load, an inductor Ln, etc., to raise the voltage Vop1. When the voltage Vop1 becomes the voltage V5 and rises to the voltage V6 by making the DC current of the current source 12 flow, the switch S4 is turned on, and the current of second half-wave resonance is made to flow by a resonance loop including a capacitor load, an inductor Ln, etc., to lower the voltage Vop1 to the voltage V1.SELECTED DRAWING: Figure 2

This invention relates to the field of high-performance ceramic material preparation technology, specifically an ultra-high pressure discharge plasma sintering system, comprising a six-sided press body, a high-power DC pulse power supply, and a high-pressure synthesis assembly block. The six-sided press body has a frame providing ultra-high pressure and a hydraulic drive system. Its six carbide hammers together form a cubic space for placing the high-pressure synthesis assembly block containing the sample. The two poles of the high-power DC pulse power supply are respectively connected to two upper and lower large pads through two conductive copper strips. The ends of the two large pads are fitted with steel rings, and the ends of the steel rings are embedded with carbide hammers. This ultra-high pressure discharge plasma sintering system achieves rapid and uniform bulk heating of the sample. The synergistic effect of the two systems enables the densification sintering preparation of ultra-hard ceramics at temperatures far lower than those of traditional high-temperature and high-pressure methods in a short time.

The discharge type desulfurization and denitrification and fine particulate matter trapping equipment comprises a reaction tower and a discharge reactor, waste gas enters the discharge reactor and then enters the reaction tower, flows from bottom to top in the reaction tower, passes through the desulfurization and denitrification reaction area and the electrostatic trapping area and then flows out from the upper part of the reaction tower; integrated collaborative purification is achieved, and the three functions are integrated; an advanced pulse power supply and an optimized reactor structure are adopted, so that the generation efficiency and the stability of discharge plasma are improved; the output parameters of the high-voltage pulse power supply, the addition amount of the absorbent and the operation cycle of the ash removal system are automatically adjusted through an intelligent algorithm; it is ensured that the system can keep the optimal operation state under different working conditions, and the adaptability and reliability of the system are improved.

The invention relates to the field of monatomic or cluster particle preparation equipment, in particular to monatomic / cluster generation equipment and a preparation method thereof.The monatomic / cluster generation equipment comprises a control module, a generator and an air source module; the generator comprises a generating chamber, a first electrode mounting position arranged in the generating chamber and used for mounting a first electrode, a second electrode mounting position used for mounting a second electrode and arranged opposite to the first electrode mounting position, an electrode distance adjusting assembly and a power module. The electrode distance adjusting assembly is used for adjusting the distance between the first electrode and the second electrode; the power supply module is used for providing a pulse power supply for the first electrode and the second electrode based on a corresponding control signal of the control module so as to generate spark ablation between the first electrode and the second electrode, thereby generating corresponding monatomic; and the gas source assembly is electrically connected with the control module so as to convey corresponding carrier gas into the generation chamber based on a corresponding control signal, so that cluster particles are obtained.

The invention provides a variable-radius electrode and a pulse dynamic electrochemical polishing method for an inner channel, and belongs to the field of electrochemical machining. The variable radius electrode is composed of a dielectric material elastic driving body, a flexible insulation hinge and a cathode block. Wherein the elastic driving body is a cylinder formed by curling two layers of dielectric materials and a middle rigid reinforced fiber plate, and when pulse voltage is applied, the elastic driving body can generate axial periodic telescopic motion; flexible insulation hinges are connected to the upper end and the lower end of the elastic driving body, a plurality of cathode blocks are fixed between the flexible insulation hinges in the circumferential direction, the axial periodic telescopic motion of the elastic driving body can be converted into the radial periodic reciprocating motion of the cathode blocks, and the radius of the electrode is made to generate periodic pulsation change. In the machining process, the electrode moves in the channel under traction of the traction wire, the radius change period of the electrode is coupled with the pulse power-on period, power-on machining is conducted when the radius becomes large, power-off washing is conducted when the radius becomes small, and pulse dynamic electrochemical polishing of the complex inner channel is achieved.

The invention relates to the technical field of power supply circuits, in particular to a modular circuit of a high-repetition-frequency pulse power supply and a control method of the modular circuit. According to the technical scheme, the device comprises a preceding-stage AC-DC charging unit, an energy storage capacitor, two pulse discharging modules connected in parallel and a discharging switch, and the preceding-stage AC-DC charging unit is used for converting alternating current input into direct current. According to the invention, by adopting a standardized and parallelizable modular circuit architecture, flexible and linear adjustment of the maximum output current of the system is realized, the product development and delivery cycle for different current requirements is remarkably shortened, and the customization and maintenance cost is reduced; meanwhile, the total power is dispersed to a plurality of independent modules through the design, the limit requirement for a single power device is lowered, and the reliability and maintainability of the whole system are improved; under the design of synchronous triggering and current sharing, all the modules can cooperatively output high-quality and high-consistency pulse current.

The application discloses a large-area surface multistage complex microstructure composite forming device, which comprises an electric-field-assisted micro-roller pressure forming mechanism and an electric-field-assisted micro-die pressure forming mechanism. The electric-field-assisted micro-roller pressure forming mechanism comprises a pulse power supply and feeding mechanism, rough rolling roller, fine rolling roller and discharging mechanism arranged in sequence along a conveying direction. The electric-field-assisted micro-die pressure forming mechanism comprises a die pressure forming mechanism and a pressure device arranged above the die pressure forming mechanism. The die pressure forming mechanism comprises a punch and a blank groove arranged below the punch, and the bottom end of the punch is provided with a plurality of microstructures. The forming device adopts the rough rolling roller and the fine rolling roller of the electric-field-assisted micro-roller pressure forming mechanism and the pulse power supply, so that the material surface is subjected to twice roller pressure forming under heating condition, and a basic structure is obtained. Then, the punch is used for forming a multistage complex microstructure of the material, and is suitable for the technical field of mechanical processing and plastic micro-forming.

The invention provides a pulse power supply power assembly, a wafer bearing device and semiconductor process equipment, and the device comprises a board card which is provided with a first board surface and a second board surface which are opposite to each other; the power tube is arranged on the first plate surface; the cooling device is arranged on the board card, is positioned on one side facing the first board surface, and is in heat conduction connection with the power tube; the dissipation element is a patch element, is arranged on the first plate surface and is in heat conduction connection with the cooling device; and the common mode inductor is arranged on the second board surface, and a secondary side cable of the common mode inductor penetrates through the board card and is electrically connected with the dissipation element. In the above structure, the common mode inductor, the power tube and the cooling device are respectively arranged at two sides of the board card, so that the optimization of the structure layout of the pulse power supply power assembly can be realized, and the pulse power supply power assembly can be arranged in the internal space of semiconductor process equipment; the dissipation element matched with the common mode inductor is a patch element with a small size, can be arranged on the side where the cooling device is located and is cooled by the cooling device, and the occurrence of EMI in the internal space of the semiconductor process equipment is avoided.