The invention discloses a method for manufacturing a
copper-block-embedded double-sided
printed circuit board, which comprises the following steps of: slotting a core board, and controlling the slot precision within + / -50 microns; the core plate is placed on a marble platform, the
copper blocks are placed in the groove holes, and it is ensured that the flatness of the
copper blocks is within + / -12.7 micrometers; plugging the hole with vacuum resin, and pasting a high-temperature
adhesive tape to fix the copper block after plugging the hole; the baking plate is vertically placed or fixed by a special jig; a UC type
coating drilling tool is used for drilling, a segmented drilling mode is adopted to cope with
hardness differences of different materials, and the service life of a
drill bit is dynamically set and strictly controlled according to the
diameter of the drilling tool, the thickness of a copper block and a laminated plate structure; hole metallization is carried out, full-board
electroplating is carried out, and it is ensured that the hole copper thickness is 25-30 [mu] m; manufacturing an outer-layer circuit by adopting a high-precision pattern transfer process; and carrying out surface treatment, molding and
electrical testing. According to the manufacturing method of the copper-block-embedded double-sided
printed circuit board, the displacement risk of the copper block in a double-sided
board structure is reduced by 15% through the measures of marble platform flatness control, vertical board baking and the like, and the problems of copper block fixing, precise drilling and interface reliability are systematically solved.