The utility model discloses a
wafer cutting knife correction device, including X -axis movement module, Y -axis movement module, blade rotary motor, blade clamp,
electrode rotary motor,
electrode,
electrode clamp, blade rotary motor is installed on the mobile part of X -axis movement module, blade clamp is installed on the rotary axle of blade rotary motor,
wafer cutting knife is clamped and installed on the blade clamp, electrode rotary motor is installed on the mobile part of Y -axis movement module, the rotary axle of blade rotary motor and the rotary axle of electrode rotary motor parallelly set up, electrode clamp is installed on the rotary axle of electrode rotary motor, electrode is clamped and installed on the electrode clamp, and the electrode is close to
wafer cutting knife setting when working. In this application, using pulse power, adopting electrode
discharge, the cutting repair of wafer cutting knife is carried out, and the
repair time of the knife
sharpening is faster than the original
grinding knife mode, and the original
grinding knife mode needs to consume the
grinding plate, and the use cost of electrode
discharge knife
sharpening is relatively lower.