High-power seeker tile type active phased array antenna

Abstract

The invention discloses a high-power seeker tile type active phased array antenna, and aims at providing an active phased array antenna which is small in size and low in weight and can reliably work with no requirement for temperature compensation. The high-power seeker tile type active phased array antenna is realized by the following scheme that E-type patches act as radiation array elements of a microstrip antenna array which can be extended according to integral multiples of 4x4 array scale, rectangular grid arrays are distributed on an antenna dielectric substrate, and a tile type TR component is closely connected with a heat exchanger integrally; and the microstrip antenna array is connected with the high-power transmit-receive chips of the tile type TR component to form transmit-receive channels through integration, every four high-power transmit-receive chips are connected with one TR multifunctional chip simultaneously, four TR multifunctional chips form one 4x4 subarray circuit module together, and then subsequent connection with a power distribution synthesis network is performed. Power supply, high-power pulse power modulation and amplitude-phase code control of a DC power supply and wave beam control signals are realized via a power supply modulation distributor so that directional diagram scanning of the high-power tile type active phased array antenna can be realized.

Description

technical field [0001] The invention relates to a high-power, high-efficiency heat storage, and high-density integrated seeker active phased array antenna in the field of electronic technology. Background technique [0002] In the 1980s, the United States commissioned Martin Marietta to develop a planar phased array antenna for the seeker using brick design technology. The phased array antenna works in the W band (94GHz), and the antenna diameter is 127mm. There are 2208 antennas in total. Array element, the peak power of the array element is 100mW, and the combined power is 62W. In 2002, the U.S. Defense Advanced Research Projects Agency invested in the development of a micro-electromechanical system (MEMS) electronically scanned antenna. The electronically scanned antenna array of the seeker adopts brick design technology and works in the X and Ka bands; the X-band consists of 60 The radio frequency radiation power of each radiation array unit is 500mW, and the total radi...

AI Technical Summary

Problems solved by technology

[0009] To sum up, the current domestic and foreign literature reports mainly adopt the brick-type modular design of the seeker active phased array antenna, which mainly transfers the heat from the TR component to the array surface and then transfers the heat to the outside of the array. Exchange with the heat exchanger, the disadvantage of the heat dissipation method is: the reliability of the active phased array antenna is poor, because the heat path of the active phased array antenna is long, and the heat of the high-power chip cannot be directly introduced into the heat exchanger quickly, causing the high-power chip to be easily damaged. Burned out; secondly, the excessively long thermal path leads to a large temperature difference of the high-power chip of each channel, which affects the consistency of the chip's amplitude and phase, resulting in the need for temperature compensation of the active phased array antenna of the seeker

At present, there is no confirmed technical solution for the high-power seeker tile-type active phased array antenna that can directly introduce heat into the heat exchanger and does not require temperature compensation.

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