High-quality conicity-controllable drilling machining device and method

A processing equipment and high-quality technology, applied in metal processing equipment, welding equipment, laser welding equipment and other directions, can solve the problems of complex processing process and inconvenient integration, achieve rapid incident angle adjustment, speed up drilling efficiency, and improve drilling efficiency. The effect of hole quality

Active Publication Date: 2015-11-11
INNO LASER TECH CORP LTD
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  • Abstract
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Problems solved by technology

[0004] The purpose of the present invention is to provide a laser processing device capable of realizing zero-taper and reverse-taper grooves, which is used to solve the problems of inconvenient integration and complicated processing process of zero-taper laser processing devices in the prior art

Method used

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  • High-quality conicity-controllable drilling machining device and method
  • High-quality conicity-controllable drilling machining device and method
  • High-quality conicity-controllable drilling machining device and method

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Embodiment Construction

[0025] The present invention will be further elaborated below with reference to the accompanying drawings.

[0026] see figure 1 to attach Figure 5 , a kind of high-quality drilling processing equipment with controllable taper of the present invention has a laser emitting device, which sequentially includes: a beam rotation module 1; a focusing lens 3; a first wedge-shaped optical glass substrate 41; A second wedge-shaped optical glass substrate 42; wherein, the laser light acts on the workpiece to be processed through the beam rotation module 1, the focusing lens 3, the first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 in sequence, and the The first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 are controlled to rotate the device, so as to change the laser irradiation line, thereby realizing the drilling process.

[0027] Wherein, the beam rotation module adopts self-rotatio...

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Abstract

A high-quality conicity-controllable drilling machining device is characterized by comprising a light beam rotating module, a focusing lens, a first wedge-shaped optical glass substrate, a second wedge-shaped optical glass substrate and a rotating device in the laser radiating direction in sequence, wherein the rotating device is connected to the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate; laser sequentially passes through the light beam rotating module, the focusing lens, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate focusing and dynamic scanning are carried out on a laser beam, and the laser acts on a workpiece to be machined; and the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate are controlled by the rotating device to rotate so as to change a laser irradiating route. According to the machining device, the module is simple in structure and can be machined and integrated with a common laser, manufacturing is easy, cost is low, and the light path adjustment is easier. The zero-taper and inverted-cone drill hole high-quality machining can be rapidly achieved.

Description

technical field [0001] The invention relates to the technical field of laser processing devices, in particular to a high-quality drilling processing equipment and method with controllable taper. Background technique [0002] The basic principle of laser processing is to focus the laser on the surface of the material, make the interaction between the laser and the material, the Gaussian distribution of the laser beam and the mechanism of the interaction between the laser and the object. After the laser interacts with the material, a positive conical laser drilling hole is formed on the object. . [0003] In the prior art, Gaussian beam processing is used, and in order to realize zero-taper or inverted-taper groove processing, the laser beam should be obliquely incident on the sample surface. There are two basic approaches: one is to tilt the sample, and the other is to tilt the laser beam. Tilting the sample will bring great inconvenience to the processing. Therefore, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/064
Inventor 赵晓杰张杰马明鸿
Owner INNO LASER TECH CORP LTD
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